Patents by Inventor Nour E. Derouiche

Nour E. Derouiche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package assembly
    Patent number: 5623395
    Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners that allow several packages to be attached to each other to produce an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: April 22, 1997
    Assignee: Mitsubishi Semiconductor America, Inc.
    Inventors: Nour E. Derouiche, Scott Jewler
  • Socket for mounting a printed circuit board module
    Patent number: D349886
    Type: Grant
    Filed: July 15, 1992
    Date of Patent: August 23, 1994
    Assignee: Mitsubishi Semiconductor America, Inc.
    Inventor: Nour E. Derouiche