Socket for mounting a printed circuit board module
Latest Mitsubishi Semiconductor America, Inc. Patents:
Description
FIG. 1 is a front and upper right perspective of a socket for mounting a printed circuit board module showing my new design. The broken line showing of the module is included for the purpose of illustrating environmental elements only and forms no part of the claimed design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof, the right side elevational view thereof being the same; and,
FIG. 6 is a rearview thereof.
Referenced Cited
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Patent History
Patent number: D349886
Type: Grant
Filed: Jul 15, 1992
Date of Patent: Aug 23, 1994
Assignee: Mitsubishi Semiconductor America, Inc. (Durham, NC)
Inventor: Nour E. Derouiche (Durham, NC)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Law Firm: Lowe, Price, LeBlanc & Becker
Application Number: 7/913,543
Type: Grant
Filed: Jul 15, 1992
Date of Patent: Aug 23, 1994
Assignee: Mitsubishi Semiconductor America, Inc. (Durham, NC)
Inventor: Nour E. Derouiche (Durham, NC)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Law Firm: Lowe, Price, LeBlanc & Becker
Application Number: 7/913,543
Classifications