Patents by Inventor Nyi O. Myo
Nyi O. Myo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10731272Abstract: Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support including a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.Type: GrantFiled: February 22, 2019Date of Patent: August 4, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Nyi O. Myo, Kevin Bautista, Zhiyuan Ye, Schubert S. Chu, Yihwan Kim
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Publication number: 20200071832Abstract: Embodiments described herein generally relate to apparatus for fabricating semiconductor devices. A gas injection apparatus is coupled to a first gas source and a second gas source. Gases from the first gas source and second gas source may remain separated until the gases enter a process volume in a process chamber. A coolant is flowed through a channel in the gas injection apparatus to cool the first gas and the second gas in the gas injection apparatus. The coolant functions to prevent thermal decomposition of the gases by mitigating the influence of thermal radiation from the process chamber. In one embodiment, the channel surrounds a first conduit with the first gas and a second conduit with the second gas.Type: ApplicationFiled: August 13, 2019Publication date: March 5, 2020Inventors: Shu-Kwan LAU, Lit Ping LAM, Preetham RAO, Kartik SHAH, Ian ONG, Nyi O. MYO, Brian H. BURROWS
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Publication number: 20200040451Abstract: Embodiments herein relate to chamber liners with a multi-piece design for use in processing chambers. The multi-piece design can have an inner portion and an outer portion. A portion of the inner surface of the outer portion may be designed to be in contact with the outer surface of the inner portion at a single junction point, creating a thermal barrier between the inner portion and outer portion, thus reducing heat transfer from the inner portion and outer portion. The thermal barrier creates higher temperatures at the chamber liner inner surface and therefore leads to shorter heat up times within the chamber. Additionally, the thermal barrier also creates lower temperatures near the base ring and outer surface of the outer ring, thereby protecting the chamber walls and requiring less thermal regulation/dissipation at the chamber walls.Type: ApplicationFiled: July 25, 2019Publication date: February 6, 2020Inventors: Zhepeng CONG, Schubert CHU, Nyi O. MYO, Kartik SHAH, Surajit KUMAR
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Patent number: 10519547Abstract: Embodiments of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one embodiment, the susceptor includes a first rim, an inner region coupled to and surrounded by the first rim, and one or more annular protrusions formed on the inner region. The one or more annular protrusions may be formed on the inner region at a location corresponding to the location where a valley is formed on the substrate, and the one or more annular protrusions help reduce or eliminate the formation of the valley.Type: GrantFiled: January 19, 2016Date of Patent: December 31, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Karthik Ramanathan, Kartik Shah, Nyi O. Myo, Schubert S. Chu, Jeffrey Tobin, Errol Antonio C. Sanchez, Palamurali Gajendra
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Publication number: 20190371631Abstract: Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.Type: ApplicationFiled: May 9, 2019Publication date: December 5, 2019Inventors: Shu-Kwan LAU, Zhiyuan YE, Zuoming ZHU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Nyi O. MYO, Schubert S. CHU
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Publication number: 20190267263Abstract: Embodiments described herein provide processing chambers that include an enclosure for a processing volume, a rotatable support within the enclosure, the support having a shaft that extends outside the enclosure, wherein the shaft has a signal feature located outside the processing volume, an energy module within the enclosure, wherein the shaft extends through the energy module, one or more directed energy sources coupled to the enclosure, and one or more signalers positioned proximate to the signal feature, each signaler coupled to at least one of the directed energy sources.Type: ApplicationFiled: February 12, 2019Publication date: August 29, 2019Inventors: Shu-Kwan Danny LAU, Zhiyuan YE, Zuoming ZHU, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
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Publication number: 20190257000Abstract: Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support including a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.Type: ApplicationFiled: February 22, 2019Publication date: August 22, 2019Inventors: NYI O. MYO, KEVIN BAUTISTA, ZHIYUAN YE, SCHUBERT S. CHU, YIHWAN KIM
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Publication number: 20190127851Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: ApplicationFiled: October 25, 2018Publication date: May 2, 2019Inventors: Shu-Kwan LAU, Koji NAKANISHI, Toshiyuki NAKAGAWA, Zuoming ZHU, Zhiyuan YE, Joseph M. RANISH, Nyi O. MYO, Errol Antonio C. SANCHEZ, Schubert S. CHU
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Publication number: 20190119814Abstract: Embodiments of a precursor feed system for a semiconductor process are described herein. The precursor feed system provides improved flow control of a vaporized precursor material to a process chamber by improving flow characteristics of vaporized precursor materials, carried by a carrier gas, which may be an inert gas. The precursor feed system also reduces an occurrence of a pressure drop in conduits that deliver the precursor to the process chamber. Reducing the occurrence of the pressure drop also reduces a decrease of energy from the gas, thus reducing a tendency of the gas to condense in the along the flow path.Type: ApplicationFiled: October 16, 2018Publication date: April 25, 2019Inventors: Zhiyuan YE, Garry KWONG, Errol Antonio C. SANCHEZ, Nyi O. MYO
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Patent number: 10269614Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.Type: GrantFiled: October 16, 2015Date of Patent: April 23, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Schubert S. Chu, Kartik Shah, Anhthu Ngo, Karthik Ramanathan, Nitin Pathak, Nyi O. Myo, Paul Brillhart, Richard O. Collins, Kevin Joseph Bautista, Edric Tong, Zhepeng Cong, Anzhong Chang, Kin Pong Lo, Manish Hemkar
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Patent number: 10260164Abstract: Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support comprising a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.Type: GrantFiled: May 15, 2017Date of Patent: April 16, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Nyi O. Myo, Kevin Bautista, Zhiyuan Ye, Schubert S. Chu, Yihwan Kim
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Publication number: 20180366363Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: ApplicationFiled: August 23, 2018Publication date: December 20, 2018Inventors: Anhthu NGO, Zuoming ZHU, Balasubramanian RAMACHANDRAN, Paul BRILLHART, Edric TONG, Anzhong CHANG, Kin Pong LO, Kartik SHAH, Schubert S. CHU, Zhepeng CONG, James Francis MACK, Nyi O. MYO, Kevin Joseph BAUTISTA, Xuebin LI, Yi-Chiau HUANG, Zhiyuan YE
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Patent number: 10074555Abstract: Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substrate on a substrate receiving surface of a susceptor, and rotating the susceptor and the substrate by delivering flow of fluid from one or more rotating ports.Type: GrantFiled: March 5, 2013Date of Patent: September 11, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Blake Koelmel, Nyi O. Myo
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Patent number: 10062598Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: GrantFiled: April 28, 2015Date of Patent: August 28, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Anhthu Ngo, Zuoming Zhu, Balasubramanian Ramachandran, Paul Brillhart, Edric Tong, Anzhong Chang, Kin Pong Lo, Kartik Shah, Schubert S. Chu, Zhepeng Cong, James Francis Mack, Nyi O. Myo, Kevin Joseph Bautista, Xuebin Li, Yi-Chiau Huang, Zhiyuan Ye
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Patent number: 9890455Abstract: Embodiments of the present invention generally relates to apparatus for use in film depositions. The apparatus generally include pre-heat rings adapted to be positioned in a processing chamber. In one embodiment, a pre-heat ring includes a ring having an inner edge and an outer edge. The outer edge has a constant radius. The inner edge is oblong-shaped and may have a first portion having a constant radius measured from a center of a circle defined by an outer circumference of the ring. A second portion may have a constant radius measured from a location other than the center of the outer circumference. In another embodiment, a processing chamber includes a pre-heat ring positioned around the periphery of a substrate support. The pre-heat ring includes an inner edge having a first portion, a second portion, and one or more linear portions positioned between the first portion and the second portion.Type: GrantFiled: September 30, 2011Date of Patent: February 13, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Nyi O. Myo, John S. Webb, Masato Ishii, Xuebin Li, Zhiyuan Ye, Ali Zojaji
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Publication number: 20170314158Abstract: Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support comprising a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.Type: ApplicationFiled: May 15, 2017Publication date: November 2, 2017Inventors: NYI O. MYO, KEVIN BAUTISTA, ZHIYUAN YE, SCHUBERT S. CHU, YIHWAN KIM
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Patent number: 9695508Abstract: Embodiments described herein relate to an apparatus and method for lining a processing region within a chamber. In one embodiment, a modular liner assembly for a substrate processing chamber is provided. The modular liner assembly includes a first liner and a second liner, each of the first liner and second liner comprising an annular body sized to be received in a processing volume of a chamber, and at least a third liner comprising a body that extends through the first liner and the second liner, the third liner having a first end disposed in the process volume and a second end disposed outside of the chamber.Type: GrantFiled: March 5, 2015Date of Patent: July 4, 2017Assignee: APPLIED MATERIALS, INC.Inventors: David K. Carlson, Mehmet Tugrul Samir, Nyi O. Myo
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Publication number: 20170175265Abstract: In one embodiment, a susceptor is provided and includes a first major surface opposing a second major surface, and a plurality of contact structures disposed on the first major surface, each of the contact structures being at least partially surrounded by one or more of a plurality of radially oriented grooves and an annular groove, wherein each of the plurality of contact structures includes a substrate contact surface, each of the substrate contact surfaces is between two parallel planes separated by a distance of 0.1 millimeters, and the substrate contact surfaces define a substrate receiving surface.Type: ApplicationFiled: December 18, 2015Publication date: June 22, 2017Inventors: Kartik SHAH, Schubert S. CHU, Nyi O. MYO, Karthik RAMANATHAN, Richard O. COLLINS, Zhepeng CONG, Nitin PATHAK
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Patent number: 9650726Abstract: Methods and apparatus for deposition processes are provided herein. In some embodiments, an apparatus may include a substrate support comprising a susceptor plate having a pocket disposed in an upper surface of the susceptor plate and having a lip formed in the upper surface and circumscribing the pocket, the lip configured to support a substrate on the lip; and a plurality of vents extending from the pocket to the upper surface of the susceptor plate to exhaust gases trapped between the backside of the substrate and the pocket when a substrate is disposed on the lip. Methods of utilizing the inventive apparatus for depositing a layer on a substrate are also disclosed.Type: GrantFiled: February 16, 2011Date of Patent: May 16, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Nyi O. Myo, Kevin Bautista, Zhiyuan Ye, Schubert S. Chu, Yihwan Kim
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Patent number: 9644267Abstract: A method and apparatus that may be utilized for chemical vapor deposition and/or hydride vapor phase epitaxial (HVPE) deposition are provided. In one embodiment, a metal organic chemical vapor deposition (MOCVD) process is used to deposit a Group III-nitride film on a plurality of substrates. A Group III precursor, such as trimethyl gallium, trimethyl aluminum or trimethyl indium and a nitrogen-containing precursor, such as ammonia, are delivered to a plurality of straight channels which isolate the precursor gases. The precursor gases are injected into mixing channels where the gases are mixed before entering a processing volume containing the substrates. Heat exchanging channels are provided for temperature control of the mixing channels to prevent undesirable condensation and reaction of the precursors.Type: GrantFiled: July 9, 2013Date of Patent: May 9, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Brian H. Burrows, Alexander Tam, Ronald Stevens, Kenric T. Choi, James David Felsch, Jacob Grayson, Sumedh Acharya, Sandeep Nijhawan, Lori D. Washington, Nyi O. Myo