Patents by Inventor Ognian N. Dimov

Ognian N. Dimov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10793676
    Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 6, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20200262978
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here] (la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 18, 2017
    Publication date: August 20, 2020
    Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
  • Publication number: 20200218152
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 10696932
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 30, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Publication number: 20190263969
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Application
    Filed: October 26, 2017
    Publication date: August 29, 2019
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190171105
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Application
    Filed: July 11, 2018
    Publication date: June 6, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20190129303
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 25, 2017
    Publication date: May 2, 2019
    Inventors: William A. Reinerth, Binod B. De, Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190016999
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Application
    Filed: July 28, 2016
    Publication date: January 17, 2019
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Publication number: 20190018321
    Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.
    Type: Application
    Filed: December 20, 2016
    Publication date: January 17, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Patent number: 10036952
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: July 31, 2018
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20160313642
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 27, 2016
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20160313641
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 27, 2016
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 9034557
    Abstract: A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: May 19, 2015
    Assignee: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
    Inventors: Ognian N. Dimov, Binod B. De
  • Patent number: 8535872
    Abstract: An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: September 17, 2013
    Assignee: Fujifilm Electronic Materials, U.S.A., Inc.
    Inventors: Binod B. De, Ognian N. Dimov, Stephanie J. Dilocker
  • Publication number: 20120178871
    Abstract: An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composirion being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.
    Type: Application
    Filed: March 21, 2012
    Publication date: July 12, 2012
    Inventors: Binod B. De, Ognian N. Dimov, Stephanie J. Dilocker
  • Patent number: 8153346
    Abstract: An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: April 10, 2012
    Assignee: FUJIFILM Electronic Materials, U.S.A., Inc.
    Inventors: Binod B. De, Ognian N. Dimov, Stephanie J. Dilocker
  • Publication number: 20100304299
    Abstract: A photoresist composition. The composition has the following: (a) one or more resin binders that include one or more acid sensitive groups and that are substantially free of phenolic groups protected by acetal or ketal groups; (b) one or more photo acid generators, that, upon exposure to a source of high energy, decompose and generate a photoacid strong enough to remove the one or more acid sensitive groups; (c) one or more ionic non-photosensitive additives including an iminium salt; and (d) one or more solvents. There is also a process for patterning relief structures on a substrate employing the photoresist composition.
    Type: Application
    Filed: June 1, 2010
    Publication date: December 2, 2010
    Inventors: Ognian N. Dimov, Binod B. De
  • Publication number: 20080206676
    Abstract: An etch resistant thermally curable Underlayer composition for use in a multiplayer lithographic process for producing a photolithographic bilayer coated substrate, the composition being a composition of: (a) a polymer comprising repeating units of Structure I, II and III (b) at least one crosslinking agent; (c) at least one thermal acid generator; and (d) at least one solvent.
    Type: Application
    Filed: February 20, 2008
    Publication date: August 28, 2008
    Inventors: Binod B. De, Ognian N. Dimov, Stephanie J. Dilocker
  • Publication number: 20080199805
    Abstract: A photosensitve composition exhibiting high resolution and enhanced, tunable O2 plasma etch resistance comprising a silicon-containing base polymer, a silicon-containing additive, a photoacid generator and solvent is provided. A method of forming a patterned resist film is also provided.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 21, 2008
    Inventors: IL'YA RUSHKIN, OGNIAN N. DIMOV, SANJAY MALIK, BINOD B. DE
  • Patent number: 6916543
    Abstract: Novel copolymers suitable for forming the top layer photoimagable coating in a deep U V. particularly a 193 nm and 248 nm, bilayer resist system providing high resolution photolithography. Chemically amplified photoresist composition and organosilicon moieties suitable for use in the binder resin for photoimagable etching resistant photoresist composition that is suitable as a material for use in ArF and KrF photolithography using the novel copolymers.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: July 12, 2005
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Binod B. De, Sanjay Malik, Stephanie J. Dilocker, Ognian N. Dimov