Patents by Inventor Ognjen Djekic

Ognjen Djekic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatsinking and packaging of integrated circuit chips
    Patent number: 6853068
    Abstract: A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surface of the semiconductor die placed is in thermal contact with an inner surface of the rigid structure with a compressible material.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: February 8, 2005
    Assignee: Volterra Semiconductor Corporation
    Inventor: Ognjen Djekic