Abstract: According to various embodiments, a method for processing a carrier may include: doping a carrier with fluorine such that a first surface region of the carrier is fluorine doped and a second surface region of the carrier is at least one of free from the fluorine doping or less fluorine doped than the first surface region; and oxidizing the carrier to grow a first gate oxide layer from the first surface region of the carrier with a first thickness and simultaneously from the second surface region of the carrier with a second thickness different from the first thickness.

Abstract: A method for contacting and connecting solar cells, according to which at least one electrode is formed by at least one wire conductor, and including the following steps: positioning a continuous wire conductor so that the continuous wire conductor extends across a plurality of solar cells, interrupting the electrodes at the positions required for the connection, and contacting the solar cells and electrodes.

Abstract: An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Abstract: According to various embodiments, a method for processing a carrier may include: doping a carrier with fluorine such that a first surface region of the carrier is fluorine doped and a second surface region of the carrier is at least one of free from the fluorine doping or less fluorine doped than the first surface region; and oxidizing the carrier to grow a first gate oxide layer from the first surface region of the carrier with a first thickness and simultaneously from the second surface region of the carrier with a second thickness different from the first thickness.

Abstract: According to various embodiments, a method for processing a carrier may include: doping a carrier with fluorine such that a first surface region of the carrier is fluorine doped and a second surface region of the carrier is at least one of free from the fluorine doping or less fluorine doped than the first surface region; and oxidizing the carrier to grow a first gate oxide layer from the first surface region of the carrier with a first thickness and simultaneously from the second surface region of the carrier with a second thickness different from the first thickness.

Abstract: In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell.

Abstract: In various embodiments, a method for patterning the surface of a solder-covered photovoltaic cell connector on the light-incidence side of a photovoltaic cell is provided. The method may include heating at least a part of the solder-covered photovoltaic cell connector which is in contact with the surface of the photovoltaic cell; patterning at least a part of the surface of the heated part of the solder-covered photovoltaic cell connector so that a predetermined surface pattern is formed; and cooling the photovoltaic cell connector by means of which the pattern is fixed on the solder-covered surface of the photovoltaic cell connector.

Abstract: In various embodiments, a single-pole switching unit for limiting the energy flow in a series circuit having photovoltaic modules by a pulsating control signal present on at least one DC line is provided. The switching unit may include: a switching element, which is designed to reduce the current flow in the at least one DC line of the photovoltaic modules; a transmission element, which is designed to couple out an electrical control signal present on the DC line and to control the switching element merely with the energy of the coupled-out control signal; and a coupling element, which is arranged in parallel with the switching element and which conducts the control signal through the switching unit when the switching element is nonconducting.

Abstract: In various embodiments, a solar cell connector electrode may include a multiplicity of electrically conductive solar cell connector elements arranged alongside one another; and a plurality of electrically non-conductive and isolated from one another, planar elements on which the electrically conductive solar cell connector elements are arranged. Solar cell connector element isolating locations are provided in regions on the planar elements, such that, by means of a respective solar cell connector element isolating location, a respectively electrically conductive solar cell connector element is divided into a plurality of, preferably two, solar cell connector partial elements electrically isolated from one another.

Abstract: In various embodiments, a tabbing ribbon for connecting at least one solar cell is provided, wherein the tabbing ribbon at least partially extends in a non-planar manner and includes a non-planar section.

Abstract: Various embodiments may provide a controller for photovoltaic power supply, configured to be connected with one or more photovoltaic modules and configured to be connected with an AC grid terminal, wherein the controller is configured to monitor the status of the AC grid power and to generate a signal for deactivation of the photovoltaic modules if the AC power is off, wherein the controller is further configured to generate the signal such that it controls the activation of the at least one photovoltaic module with an active signal having a non-zero signal voltage level and such that it controls the deactivation of the at least one photovoltaic module with an inactive signal, wherein the deactivation of the at least one photovoltaic module results in that the connections between a plurality of photovoltaic modules are interrupted or that the photovoltaic modules are short circuited.

Abstract: In various exemplary embodiments, a solar cell is provided, including a layer structure having at least one photovoltaic layer; and a plurality of contact wires running on the surface of the layer structure. The contact wires are wire-bonded radially with respect to their axis onto the surface of the layer structure.

Abstract: In various embodiments, a method for patterning the surface of a solder-covered photovoltaic cell connector on the light-incidence side of a photovoltaic cell is provided. The method may include heating at least a part of the solder-covered photovoltaic cell connector which is in contact with the surface of the photovoltaic cell; patterning at least a part of the surface of the heated part of the solder-covered photovoltaic cell connector so that a predetermined surface pattern is formed; and cooling the photovoltaic cell connector by means of which the pattern is fixed on the solder-covered surface of the photovoltaic cell connector.

Abstract: In various embodiments, a photovoltaic module may include: a plurality of photovoltaic cells, at least one photovoltaic cell of the number of photovoltaic cells comprising: a first plurality of contact wires on a front of the photovoltaic cell; and a second plurality of contact wires on a rear of the photovoltaic cell. The first plurality of contact wires and the second plurality of contact wires may be arranged offset with respect to one another.

Abstract: In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell.

Abstract: An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell.

Abstract: A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a defined dimension. The method further comprises processing the substrate with a plasma comprising hydrogen in order to etch the second portion of the carbon material, wherein the defined dimension of the intersection of the first and second portion of the carbon material substantially suppresses etching of the first enclosed portion of the carbon material in a self-limiting way.

Abstract: A stress relief layer between a single-crystal semiconductor substrate and a deposited silicon nitride layer or pad nitride is formed from thermally produced silicon nitride. The stress relief layer made from thermally produced silicon nitride replaces a silicon dioxide layer or pad oxide which is customary at this location for example in connection with mask layers. After patterning of a mask, which includes a protective layer portion formed from deposited silicon nitride, the material which is provided according to the invention for the stress relief layer reduces the restrictions imposed for subsequent process steps, such as for example wet-etching steps, acting both on the semiconductor substrate or structures in the semiconductor substrate and also on the stress relief layer.

Abstract: A method of making an integrated circuit comprises providing a substrate and forming a structure on the substrate comprising a first enclosed portion of a carbon material and a second portion of the carbon material, wherein an intersection of the first and second portion of the carbon material has a defined dimension. The method further comprises processing the substrate with a plasma comprising hydrogen in order to etch the second portion of the carbon material, wherein the defined dimension of the intersection of the first and second portion of the carbon material substantially suppresses etching of the first enclosed portion of the carbon material in a self-limiting way.

Abstract: A method of fabricating an integrated device on a substrate with an exposed surface region is disclosed. One embodiment provides introducing a first component into the exposed surface region of the substrate. A material is provided on the exposed surface region. The material on the exposed surface region is cured and the first component release from the exposed surface region of the substrate.