Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Abstract: An example apparatus includes: a semiconductor substrate; a mechanical resonator supported by the substrate, the mechanical resonator including an array of capacitors; and a plasmonic infrared (IR) absorber including an array of metal structures. The mechanical resonator is between the substrate and the IR absorber.

Abstract: A circuit includes a semiconductor substrate and an integrated passive device. The integrated passive device is on a surface of the semiconductor substrate. The integrated passive device is in a metal layer on the semiconductor substrate. The metal layer is at least tens of micrometers thick. The integrated passive device may be an inductor or a capacitor in some examples.

Abstract: This disclosure relates to techniques for selecting a low power measurement mode (LPM mode). A wireless device may enter an idle mode, determine that it is stationary, and enter an LPM mode. In the LPM mode, the wireless device may perform cell measurements at a reduced frequency.

Abstract: A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of ?/4, where ? represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

Abstract: An apparatus for an optical detector includes a bulk acoustic wave (BAW) resonator including a piezoelectric layer and a metal layer, an acoustic Bragg mirror on the BAW resonator and including a first acoustic impedance layer and a second acoustic impedance layer different than the first acoustic impedance layer, and a plasmonic metasurface on the acoustic Bragg mirror and including structures of geometric patterns arranged in an array.

Abstract: This disclosure relates to techniques for selecting a low power measurement mode (LPM mode). A wireless device may enter an idle mode, determine that it is stationary, and enter an LPM mode. In the LPM mode, the wireless device may perform cell measurements at a reduced frequency.

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Abstract: In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: An antenna integrated in a device package is formed such that at least a portion of the antenna is elevated with respect to a substrate of the device package. The entire antenna and its functionality are positioned within a space extending vertically upwardly from a footprint of the substrate that contains circuitry of the device. The boundary of the space is defined by the perimeter of an over mold positioned on the substrate and encapsulating the circuitry.

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

Abstract: A door locking device for a smart door apparatus (10) is provided comprising an interior door handle positionable on an interior side of a door; an exterior door handle positionable on an exterior side of the door (14); a lock for the door (14) which is coupled to the interior door handle, the lock having a deadbolt which is activatable by actuation of the interior door handle; a controller for automatically generating an alert signal in the event of activation of the deadbolt; and a wireless communication module associated with the controller, the wireless communication module automatically transmitting the alert signal in the event of activation of the deadbolt.

Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.

Abstract: A differential nondispersive infrared (NDIR) sensor incorporates an infrared (IR) chopper and multiple multi-bit digital registers to store and compare parameter ratio values, as may be digitally calibrated to corresponding temperature values, from chopper clock cycle portions in which a plasmonic MEMS detector is irradiated by the IR chopper with such values from chopper clock cycle portions in which the IR detector is not irradiated by the IR chopper. The plasmonic MEMS detector is referenced to a reference MEMS device via a parameter-ratio engine. The reference device can include a broadband IR reflector or can have a lower-absorption metasurface pattern giving it a lower quality factor than the plasmonic detector. The resultant enhancements to accuracy and precision of the NDIR sensor enable it to be used as a sub-parts-per-million gas concentration sensor or gas detector having laboratory, commercial, in-home, and battlefield applications.

Abstract: The invention is directed to an improved abacus and related calculating method. The improved abacus and method are adapted to perform mathematical operations including addition, subtraction, multiplication, division and factoring. Additional mathematical operations are performable using described techniques. The improved abacus has a frame divided into an upper and lower section by a horizontal bar. The abacus includes a plurality of rods in which each rod contains four movable beads on the upper section of each rod and one movable bead on the lower section of each rod. The beads in the upper section have a value of two and the bead in the lower section has a value of one. Beads moved toward the bar are counted while those beads away from the bar are not counted. The improved abacus also includes a unit indicator, mathematical operational signs and positive and negative sliding indicators signs on the frame.

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.

Abstract: A device comprises an integrated circuit (IC) die, a substrate, a printed circuit board (PCB), an antenna, and a waveguide stub. The IC die is affixed to the substrate, which comprises a signal launch on a surface of the substrate that is configured to emit or receive a signal. The substrate and the antenna are affixed to the PCB, such that the signal launch and a waveguide opening of the antenna are aligned and comprise a signal channel. The waveguide stub is arranged as a boundary around the signal channel. In some implementations, the waveguide stub has a height of ?/4, where ? represents a wavelength of the signal. In some implementations, the antenna includes the waveguide stub; in others, the substrate includes the waveguide stub.

Abstract: In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.