Patents by Inventor Omkar Karhade

Omkar Karhade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11056466
    Abstract: Systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages are provided. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A gap forms between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. Additionally, interstitial gaps form between each of the PoP semiconductor packages disposed on an organic substrate. A curable fluid material, such as a molding compound, may be flowed both in the interstitial spaces between the PoP semiconductor packages and into the gap between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 6, 2021
    Assignee: Intel Corporation
    Inventors: Omkar Karhade, Christopher L. Rumer, Nitin Deshpande, Robert M. Nickerson
  • Publication number: 20200412041
    Abstract: A wide bandwidth signal connector plug, comprising a plurality of signal pins having a first anchor portion and a first mating portion, and a plurality of ground pins having a second anchor portion and a second mating portion. The plurality of ground pins is adjacent to the plurality of signal pins. The plurality of signal pins has a first thickness and the plurality of ground pins has a second thickness that is greater than the first thickness. The first anchor portion has a first width and the second anchor portion has a second width that is greater than the first width.
    Type: Application
    Filed: June 27, 2019
    Publication date: December 31, 2020
    Inventors: Zhenguo Jiang, Omkar Karhade, Sri Chaitra Chavali, William Lambert, Zhichao Zhang, Mitul Modi
  • Publication number: 20200273811
    Abstract: IC package including a material preform comprising graphite. The material preform may have a thermal conductivity higher than that of other materials in the package and may therefore mitigate the formation of hot spots within an IC die during device operation. The preform may have high electrical conductivity suitable for EMI shielding. The preform may comprise a graphite sheet that can be adhered to a package assembly with an electrically conductive adhesive, applied, for example over an IC die surface and a surrounding package dielectric material. Electrical interconnects of the package may be coupled to the graphite sheet as an EMI shield. The package preform may be grounded to a reference potential through electrical interconnects of the package, which may be further coupled to a system-level ground plane. System-level thermal solutions may interface with the package-level graphite sheet.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Debendra Mallik, Mitul Modi, Sanka Ganesan, Edvin Cetegen, Omkar Karhade, Ravindranath Mahajan, James C. Matayabas, Jr., Jan Krajniak, Kumar Singh, Aastha Uppal
  • Publication number: 20200273784
    Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra fine pitch (e.g., a pitch that is greater than or equal to 150 ?m, etc.); (ii) a large die to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.
    Type: Application
    Filed: December 30, 2017
    Publication date: August 27, 2020
    Inventors: Debendra MALLIK, Robert L. SANKMAN, Robert NICKERSON, Mitul MODI, Sanka GANESAN, Rajasekaran SWAMINATHAN, Omkar KARHADE, Shawna M. LIFF, Amruthavalli ALUR, Sri Chaitra J. CHAVALI
  • Publication number: 20200273772
    Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Aastha Uppal, Omkar Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang, Nitin Deshpande, Mitul Modi, Edvin Cetegen, Sanka Ganesan, Yiqun Bai, Jan Krajniak, Kumar Singh
  • Publication number: 20200273775
    Abstract: Package assemblies with a molded substrate comprising fluid conduits. The fluid conduits may be operable for conveying a fluid (e.g., liquid and/or vapor) through some portion of the package substrate structure. The fluid conveyance may improve thermal management of the package assembly, for example removing heat dissipated by one or more integrated circuits (ICs) of the package assembly.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Inventors: Omkar Karhade, Mitul Modi, Edvin Cetegen, Aastha Uppal
  • Publication number: 20200273768
    Abstract: IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate any hot spots that develop at the IC die surface during operation. The heat spreading material may be applied to surface of the IC die.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Applicant: Intel Corporation
    Inventors: Omkar Karhade, Nitin Deshpande, Mitul Modi, Edvin Cetegen, Aastha Uppal, Debendra Mallik, Sanka Ganesan, Yiqun Bai, Jan Krajniak, Kumar Singh
  • Publication number: 20200243956
    Abstract: An RF chip package comprises a housing and one or more conductive contacts designed to electrically connect the RF chip package to other conductive contacts. The housing includes a first substrate, a 3-D antenna on the first substrate, and a second substrate. The second substrate includes a plurality of semiconductor devices and is bonded to the first substrate. An interconnect structure allows for electrical connection between the first and second substrates. In some cases, the first substrate is flip-chip bonded to the second substrate or is otherwise connected to the second substrate by an array of solder balls. By integrating both the 3-D antenna and RF circuitry together in the same chip package, costs are minimized while bandwidth is greatly improved compared to a separately machined 3-D antenna.
    Type: Application
    Filed: January 26, 2019
    Publication date: July 30, 2020
    Applicant: INTEL CORPORATION
    Inventors: ZHENGUO JIANG, OMKAR KARHADE, SRICHAITRA CHAVALI, ZHICHAO ZHANG, JIMIN YAO, STEPHEN SMITH, XIAOQIAN LI, ROBERT L. SANKMAN
  • Publication number: 20200227332
    Abstract: An integrated circuit package may be formed having at least one heat dissipation structure within the integrated circuit package itself. In one embodiment, the integrated circuit package may include a substrate; at least one integrated circuit device, wherein the at least one integrated circuit device is electrically attached to the substrate; a mold material on the substrate and adjacent to the at least one integrated circuit device; and at least one heat dissipation structure contacting the at least one integrated circuit, wherein the at least one heat dissipation structure is embedded either within the mold material or between the mold material and the substrate.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 16, 2020
    Applicant: Intel Corporation
    Inventors: Kumar Abhishek Singh, Omkar Karhade, Nitin Deshpande, Mitul Modi, Edvin Cetegen, Aastha Uppal, Debendra Mallik, Sanka Ganesan, Yiqun Bai, Jan Krajniak, Manish Dubey, Ravindranath Mahajan, Ram Viswanath, James C. Matayabas, JR.
  • Publication number: 20200203254
    Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Applicant: INTEL CORPORATION
    Inventors: Kedar Dhane, Omkar Karhade, Aravindha R. Antoniswamy, Divya Mani
  • Publication number: 20200105701
    Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan H. Lu, Omkar Karhade, Shawna M. Liff
  • Publication number: 20200098727
    Abstract: A wire-bond memory die is coupled to a system-on-chip processor where the processor is flip-chip mounted on a semiconductor package substrate, and the wire-bond memory die is also flip-chip configured through a redistribution layer that pins out to a series of pillars that contact the semiconductor package substrate. The wire-bond memory die is stacked on the processor and the redistribution layer overhangs the processor to contact the series of pillars.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Debendra Mallik, Robert L. Sankman, Sanka Ganesan, George Vakanas, Omkar Karhade, Sri Chaitra Jyotsna Chavali, Zhaozhi George Li, Holly A. Sawyer
  • Publication number: 20200076046
    Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 5, 2020
    Inventors: Omkar KARHADE, William J. LAMBERT, Xiaoqian LI, Sidharth DALMIA
  • Publication number: 20200066659
    Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Applicant: Intel Corporation
    Inventors: William J. Lambert, Omkar Karhade, Martin Rodriguez, Gregorio R. Murtagian
  • Publication number: 20200051956
    Abstract: A semiconductor package is disclosed. The semiconductor package includes a package substrate, at least one bottom die coupled to the package substrate, at least one interposer coupled to the package substrate and a top die above the at least one bottom die and the at least one interposer and coupled to the at least one bottom die and the at least one interposer. The semiconductor package also includes a plurality of pillars that connect the top die to the package substrate through the at least one interposer.
    Type: Application
    Filed: August 9, 2018
    Publication date: February 13, 2020
    Inventors: Omkar KARHADE, Nitin DESHPANDE, Debendra MALLIK
  • Publication number: 20190385983
    Abstract: Systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages are provided. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A gap forms between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. Additionally, interstitial gaps form between each of the PoP semiconductor packages disposed on an organic substrate. A curable fluid material, such as a molding compound, may be flowed both in the interstitial spaces between the PoP semiconductor packages and into the gap between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.
    Type: Application
    Filed: August 27, 2019
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: OMKAR KARHADE, CHRISTOPHER L. RUMER, NITIN DESHPANDE, ROBERT M. NICKERSON
  • Patent number: 10461003
    Abstract: An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: October 29, 2019
    Assignee: Intel Corporation
    Inventors: Omkar Karhade, Kedar Dhane
  • Patent number: 10438930
    Abstract: Systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages are provided. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A gap forms between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package. on an organic substrate. A curable fluid material, such as a molding compound, may be flowed both in the interstitial spaces between the PoP semiconductor packages and into the gap between the upper surface of the first semiconductor package and the lower surface of the second semiconductor package.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 8, 2019
    Assignee: Intel Corporation
    Inventors: Omkar Karhade, Christopher L. Rumer, Nitin Deshpande, Robert M. Nickerson
  • Publication number: 20190103385
    Abstract: The present disclosure is directed to systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A thermally conductive member that includes at least one thermally conductive member may be disposed between the first semiconductor package and the second semiconductor package. The thermally conductive member may include: a single thermally conductive element; multiple thermally conductive elements; or a core that includes at least one thermally conductive element. The thermally conductive elements are thermally conductively coupled to an upper surface of the first semiconductor package and to the lower surface of the second semiconductor package to facilitate the transfer of heat from the first semiconductor package to the second semiconductor package.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Applicant: Intel Corporation
    Inventors: OMKAR KARHADE, ROBERT L. SANKMAN, NITIN A. DESHPANDE, MITUL MODI, THOMAS J. DE BONIS, ROBERT M. NICKERSON, ZHIMIN WAN, HAIFA HARIRI, SRI CHAITRA J. CHAVALI, NAZMIYE ACIKGOZ AKBAY, FADI Y. HAFEZ, CHRISTOPHER L. RUMER
  • Publication number: 20190104610
    Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a first substrate comprising a first die, wherein an underfill material is disposed on a first surface of the first substrate adjacent the first die; and a second substrate disposed on the first substrate, wherein the second substrate comprises at least one opening disposed over the first die, wherein the at least one opening is at least partially filled with the underfill material.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Applicant: Intel Corporation
    Inventors: Robert Nickerson, Nitin Deshpande, Omkar Karhade, Thomas De Bonis