Abstract: A measuring method and system for body-shaped data are provided. The measuring method comprises: performing a feature extraction on an apparel image to obtain a plurality of apparel feature points by a feature positioning module; performing a contour extraction on the apparel image to obtain an apparel boundary by an image segmentation module; calculating at least one shift value of the apparel feature points relative to the apparel boundary based on the apparel feature points and the apparel boundary by a processing module; correcting at least one of the apparel feature points according to the at least one shift value by the processing module, and projecting the corrected at least one of the apparel feature points to a three-dimensional model and obtaining at least one body-shaped data according to the apparel feature points on the three-dimensional model by the processing module.

Abstract: This specification provide computer-implemented methods, and apparatuses for data transmission protocol execution and data storage. Execution of a data transmission protocol includes an initiator and a receiver. In an example execution process, a first application serving as the initiator encapsulates protocol information related to a transmission handshake protocol, ciphertext data obtained by encrypting target privacy data using an encryption method determined based on the protocol information, signature information obtained by digitally signing the ciphertext data and the protocol information using a private key, field content of an attestation field, and the like into a data transmission unit. The attestation field is used to fill a remote attestation report that includes public key information of the initiator.

Abstract: Disclosed herein are a method for providing a virtual keyboard service that pays a cryptocurrency reward in consideration of an association between a keyboard NFT and a word NFT and an apparatus therefor. The use of a virtual keyboard by a user having a keyboard NFT may be monitored based on an application, the ability of the keyboard NFT may be measured in consideration of the attribute of the keyboard NFT that changes depending on the amount of usage of the virtual keyboard and the amount of usage of a word of a word NFT mapped to the user, an amount of cryptocurrency corresponding to the ability of the keyboard NFT may be mined while the virtual keyboard is being used, and the mined cryptocurrency may be paid to the user as a reward.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer and external electrodes disposed on the body, wherein the internal electrodes include Ni and oxide including Al, and a content of Al is 3 at % or more and 5 at % or less compared to the Ni.

Abstract: A wireless communication device includes a receiver circuit, a phase shift control circuit, and a digital phase-locked loop (DPLL) circuit. The receiver circuit includes a down-converter circuit that is used to apply down-conversion to an input signal according to a local oscillator (LO) signal. The phase shift control circuit is used to generate a phase shift signal. The DPLL circuit is used to generate the LO signal locked to an initial frequency under a frequency-lock state. In response to the phase shift signal, the DPLL circuit is further used to make the LO signal have a different frequency without leaving the frequency-lock state.

Abstract: A display compensation module, a display compensation method and a display device are provided. The display compensation module includes a search circuit, a compensation control circuit and a compensation circuit. The search circuit is configured to obtain compensation information corresponding to the display gray-scale value of the M-th row in the N-th frame of display data and the display gray-scale value of the M-th row in the (N?1)-th frame of display data, and when the compensation information indicates that the display gray-scale values of at least part of columns of sub-pixels in the M-th row in the display panel increase from the (N?1)-th frame to the N-th frame, apply the first control signal to the compensation control circuit; N is an integer greater than 1, M is a positive integer.

Abstract: The devices, systems, and methods discussed herein involve a first UE device transmitting a request for inter-UE coordination (ICC) information to a second UE device. The request for IUC information is transmitted within a set of physical resources containing control information indicating a Destination Layer 2 identifier (Destination L2 ID) associated with the second UE device. The second CE device transmits the IUC information to the first UE device. The first UE device selects, based at least partially on the IUC information, communication resources to be used for communication with the second UE device.

Abstract: Systems and methods for enterprise type pretrained models for voice interfaces include the generation and validation of enterprise type pretrained models utilizing input associated with the enterprise type at issue. Once generated and validated, when a user command is received, the speech processing system may check to determine if a customized model is available, and if not, may query the enterprise type model to provide a response to the user command.

Abstract: The devices, systems, and methods discussed herein include a first user equipment (UE) device receiving, from a base station, discovery resource pool configuration information indicating a first Uu link Reference Signal Received Power (RSRP) threshold, a second Uu link RSRP threshold, and a third Uu link RSRP threshold. The first UE device measures an RSRP value of a Uu link between the base station and the first UE device. The first UE device selects a discovery resource pool for discovery transmissions based on a comparison of the measured RSRP value relative to the first, second, and third llu link RSRP thresholds.

Abstract: An audio signal processing method and a mobile apparatus are provided. In the method, a target direction in multiple sound-reception directions and a target distance corresponding to the target direction is determined according to multiple first audio signals in the sound-reception directions received by an embedded microphone. A target algorithm is selected from multiple blind signal separation (BSS) algorithms according to the target direction and the target distance. The first audio signal received by the embedded microphone at the target direction is set as a secondary signal of the target algorithm, and the second audio signal received by an external microphone is set as a primary signal of the target algorithm. The audio signal of the primary sound source is separated from the primary signal and the secondary signal through the target algorithm. Accordingly, the microphone path merely outputs a single audio signal of the primary sound source.

Abstract: A communication device having cross-platform communication function includes a signal transmitting module, a positioning module and a processing module. The positioning module receives the coordinate of the current location thereof. The processing module is corresponding to a mobile device, and connected to the signal transmitting module and the positioning module. The processing module receives the coordinate to generate the location information of the communication device, and transmits the location information to the mobile device and a nearby mobile device close to the mobile device via the signal transmitting module, such that the location information is transmitted to a cloud processing system via the mobile device and/or the nearby mobile device.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A method by a rendering device includes receiving a request to render multiple surfaces corresponding to multiple virtual objects to be concurrently displayed on an augmented-reality (AR) headset. The method further includes that the AR headset is connected to the rendering device via a wireless link. In response to a determination that a network quality of the wireless link is below a threshold condition, the method further includes selecting a first subset of the multiple surfaces that are higher priority than a second subset of the plurality of surfaces. The method includes transmitting the fist subset of multiple surfaces to the AR headset for display and transmitting the second subset of multiple surfaces to the AR headset for display after transmitting the first subset. This method includes rendering the surfaces in accordance with a set of rendering parameters so as to satisfy one or more network constraints.

Abstract: A motor coil, which is a metal coil formed by a metal wire, the thickness of the metal wire is gradually decreased from the first end portion of the metal wire to the second end portion of the metal wire and any cross-sectional area of the metal wire is equal. The metal coil is a plural laminated layer of the metal wires forming a spiral shape along a surrounding direction. A motor stator comprises a stator core set having a plurality of teeth and the metal coil being sleeved on the outer surface of each stator core set, so that the first and the second end portion will face toward a motor core portion and outer portion respectively. The metal wire has a polymer layer on the outer surface, and an insulative coating is provided between the polymer layer and the metal wire.

Abstract: A semiconductor device includes a conductive structure, a first dielectric layer, a second dielectric layer and a liner layer. The conductive structure is located on a substrate. The first dielectric layer covers the conductive structure and the substrate. The second dielectric layer is located on the first dielectric layer. An air gap is present in the first dielectric layer and the second dielectric layer, and is located above the conductive structure. The liner layer covers and surrounds a middle portion of the air gap.

Abstract: The present application discloses a semiconductor structure and a method for manufacturing a semiconductor structure. The semiconductor structure includes at least one bottom die and a plurality of top dies. The semiconductor structure further includes a redistribution layer (RDL) formed on the at least one bottom die, and a plurality of micro bumps formed on the RDL. The top dies is stacked on the bottom die with their front sides being attached to the micro bumps. The RDL allows communication between a top die and the bottom die and allows the communication between adjacent top dies. The die-stacking structure enables greater computation capability within a smaller area.

Abstract: Provided are a composition for an organic optoelectronic device, an organic optoelectronic device, and a display device, the composition for an organic optoelectronic device including a Pt dopant represented by Chemical Formula 1, a first host including an electron transport group represented by Chemical Formula 2, and a second host including at least one hole transport group, wherein a HOMO energy level of the second host is higher than a HOMO energy level of the first host, and a difference between a LUMO energy level of the first host and the HOMO energy level of the second host is greater than 2.505 eV. Details of Chemical Formula 1 and Chemical Formula 2 are as defined in the specification.

Abstract: An embodiments may be related to a display device. A display device may include display layer and an antenna. The display layer may comprise a first display area including an exposed area and a cover area, a folding display area adjacent to the first display area, and a second display area adjacent to the folding area. The antenna disposed on the exposed area of the first display area, wherein the second display area covers the cover area of the first display area and exposes the exposed area of the first display area, when the folding display area is folded.

Abstract: Provided is a method of fabricating the semiconductor memory device. A stack layer, which includes sacrificial layers and first insulating interlayers alternately stacked, is formed. The sacrificial layers are positioned at an uppermost layer of the stack layer. A plurality of channel holes are formed through the stack layer. A first channel pillar is formed in each of the channel holes. A mold layer is formed on the stack layer with the first channel pillar. The mold layer includes a mold hole configured to partially expose the first channel pillar. A second channel pillar is formed in the mold hole. The mold layer and the sacrificial layer at the uppermost layer of the stack layer are then removed.