Abstract: A method for assembling a secondary battery cell module by using an assembling jig including a plurality of guide rods disposed on a jig plate includes: mounting a lower frame on the jig plate while the guide rods are inserted into a plurality of arranging through-holes of the lower frame; disposing a plurality of battery cells on the lower frame; mounting an upper frame on the battery cells while the guide rods are inserted into a plurality of arranging through-holes of the upper frame; fastening the upper frame and the lower frame together; and separating the assembling jig from the upper frame and the lower frame.

Abstract: A percutaneous absorption preparation is disclosed. The percutaneous absorption preparation contains donepezil for treatment of dementia, wherein the preparation includes: (a) donepezil or its pharmaceutically acceptable salt as active component, (b) propylene glycol monocaprylate as solubilizer, and (c) styrene-isoprene-styrene block copolymer (“SIS”) as adhesive. The percutaneous absorption preparation has low skin irritation and high skin penetration.

Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a semiconductor substrate and a source. The source has a first conductivity type and a first insulator separates the source from the semiconductor substrate. The semiconductor device further comprises a drain. The drain has a second conductivity type that is opposite from the first conductivity type, and a second insulator separates the drain from the semiconductor substrate. In an embodiment, the semiconductor further comprises a semiconductor body between the source and the drain, where the semiconductor body is spaced away from the semiconductor substrate.

Abstract: An object of the present invention is to provide a polishing composition which can make the removal rate of a metal material and the removal rate of a resin material the same or close to each other in a chemical mechanical polishing process, which can accordingly avoid or suppress the occurrence of a step difference. The polishing composition contains: abrasive grains containing silica, with at least a part of hydrogen atoms constituting a silanol group located on a surface of the silica being substituted with a cation of at least one metal atom M selected from the group consisting of aluminum, chromium, titanium, zirconium, iron, zinc, tin, scandium, and gallium; and a dispersing medium. The pH of the polishing composition is more than 2 and 7 or less.

Abstract: A method includes forming a conductive feature through a first dielectric layer, sequentially forming a second dielectric layer and a third dielectric layer over the first dielectric layer, and etching the third dielectric layer to form an opening. A first width of the opening at a top surface of the third dielectric layer is greater than a second width of the opening at a first interface between the third dielectric layer and the second dielectric layer. The method also includes etching the second dielectric layer until the opening extends to the conductive feature, thereby forming an enlarged opening, and forming a metal material in the enlarged opening. A third width of the enlarged opening at the first interface is equal to or less than a fourth width of the enlarged opening at a second interface between the second dielectric layer and the first dielectric layer.

Abstract: A probe card includes a circuit board, a fixing member, and a plurality of probes. The fixing member is fixed on the circuit board and has a through opening therein. The fixing member has opposite first and second sidewalls defining the through opening. Each of the probes includes an arm portion and a tip portion. One end of the arm portion is connected to the circuit board. The tip portion extends from the arm portion. The arm portions of the probes extend in substantially a same direction inclined to a direction perpendicular to the first sidewall of the fixing member in a top view.

Abstract: An interconnect structure, along with methods of forming such, are described. In some embodiments, the method includes forming a first dielectric layer over one or more devices, forming a first conductive feature in the first dielectric layer, and forming two dielectric features over the first dielectric layer and the first conductive feature. At least one of the two dielectric features has a first width, and each dielectric feature includes a first low-k dielectric layer, an oxide layer, and a first etch stop layer. The method further includes forming a second conductive feature between the two dielectric features, and the second conductive feature has a second width substantially the same as the first width.

Abstract: Proposed is a tire with self-generation and sound absorption and, more particularly, is a tire with self-generation and sound absorption that operates an electronic module through self-power generation and has improved sound absorption performance. The tire with self-generation and sound absorption includes: a wall structure formed on a surface of an inner liner of the tire; a sound absorber spaced apart upward from the inner liner with both ends coupled to the wall structure and blocking sound generated by surfaces of treads and a road surface; and an electronic unit disposed on the surface of the inner liner and positioned between the inner liner and the sound absorber.

Abstract: The present invention provides a metal-plastic composite material having excellent adhesive strength and formability and a method for manufacturing the same, and specifically, the present invention provides a metal-plastic composite material and a method for manufacturing the same comprising: a metal layer; and a plastic layer on at least one surface of the metal layer, wherein a thin film layer formed of a silane coupling agent is provided between the metal layer and the plastic layer, and the metal layer and the plastic layer are bonded by covalent bonding with the silane coupling agent.

Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.

Abstract: The present invention is about an image encoding/decoding method and apparatus. According to present invention, a method of decoding an image, the method comprising, deriving an initial motion vector of a current block; deriving a refined motion vector by using the initial motion vector; and generating a prediction block of the current block by using the refined motion vector.

Abstract: Provided are a display panel, a preparation method thereof, and a display device. The display panel includes a display substrate and a touch panel. The touch panel includes multiple touch electrodes. At least one of the touch electrodes includes multiple grid patterns enclosed by metal wires. At least one of the grid patterns includes a first edge, second edge, third edge and fourth edge that form a ring. The first edge and the third edge extend in a second direction. The second edge and the fourth edge extend in a first direction. A shape of the grid pattern includes a first curved ring, a second curved ring, a third curved ring, or a fourth curved ring. A first edge and third edge of the first curved ring are curves curved towards a direction opposite to the first direction.

Abstract: A scan-type display apparatus includes an LED array and a data driver. The LED array has a common anode configuration, and includes multiple scan lines, multiple data lines and multiple LEDs. The data driver includes multiple data driving circuits, each of which includes a current driver and a detector. The current driver has an output terminal connected to the data line corresponding to the data driving circuit, and outputs one of a drive current and a clamp voltage at the output terminal of the current driver based on a pulse width control signal. The detector is connected to the current driver, and generates a detection signal that indicates whether any one of the LEDs connected to the data line corresponding to the data driving circuit is short circuited based on a detection timing signal and a feed-in voltage related to a voltage at the output terminal of the current driver.

Abstract: A touch screen may be formed from a display and perimeter touch electrodes. Touches detected at one or more of the perimeter touch electrodes can be imputed to touch on a region of the display of the touch screen adjacent to the perimeter touch electrodes. In some examples, the perimeter touch electrodes comprise segmented frit metal arranged around the perimeter of the display (e.g., frit metal used to encapsulate the display). In some examples, the perimeter touch electrodes can be coupled to one or more touch sensing circuits via switching circuitry. In some examples, the switching circuitry can be operated based on control signals shared with the display circuitry.

Abstract: An electronic system includes a fan module, an embedded controller, a reference microphone, an error microphone, an active noise cancellation controller, and a micro speaker module. The reference microphone is configured to output a wide-band noise signal associated with the operation of the fan module. The error microphone is configured to output an error signal by detecting the noise level during the operation of the electronic system. According to the wide-band noise signal, the error signal and the fan information provided by the embedded controller, the active noise cancellation controller calculates the narrow-band noises and the wide-band noises generated by the fan module, and drives the micro speaker module accordingly for providing a noise cancellation signal. The error signal may be reduced to zero by adaptively adjusting the noise cancellation signal for canceling the noises generated during the operation of the electronic system.

Abstract: A system and method for displaying changes to a number of entries between page views is provided.

Abstract: There is provided a recognition system adaptable to a portable device or a wearable device. The recognition system senses a body heat using a thermal sensor, and performs functions such as the living body recognition, image denoising and body temperature prompting according to detected results.

Abstract: Apparatus, methods, and systems for determining acoustic velocity behind casing or tubing in a subterranean wellbore. A method may include obtaining a plurality of waveform data sets corresponding to a plurality of propagation path regimes and obtaining a total wavefield across the receiver array. The method may also include determining a Green's function representing each of the plurality of propagation path regimes and determining a noise wavefield by convolving the Green's functions and a known transmitted pressure signal corresponding to the plurality of waveform data sets. The method may also include generating a reduced-noise wavefield by subtracting the noise wavefield from the total wavefield and estimating the acoustic velocity of a formation behind the casing or tubing from the reduce-noise wavefield.