Abstract: A method for visual commonsense reasoning (VCR) to infer information from an image is provided. The method may separate a VCR matter into a visual commonsense understanding (VCU) matter and a visual commonsense inference (VCI) matter. The method may provide a visual content of the image using a VCU model. The method may provide conclusions based on content of the image using a VCI model.

Abstract: The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second surface facing each other; forming an insulating layer on the first surface or second surface using an insulating film; and forming an upper layer including an upper distribution layer and an upper surface connection layer on the insulating layer. The forming of the insulating layer May include a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film.

Abstract: An object display apparatus and a method thereof are provided. The object display apparatus includes a sensor, such as a light detection and ranging (LiDAR) device, and a processor. The processor determines an object located in front of a vehicle based on contour points in a first frame obtained via the sensor at a first time, determines at least one of lane information, longitudinal position information, lateral position information, classification information, number information, or size information, determines whether the object is included in a first group among a plurality of groups, sorts the object at least one other object included in the first group, determines a priority of the object among all objects identified in the first frame, based on a priority of the first group and a result of the sorting, and selects the object as a display target in a second frame.

Abstract: A semiconductor package may include a package substrate, a first semiconductor die electrically and mechanically coupled to the package substrate, a second semiconductor die electrically and mechanically coupled to the package substrate, and a reinforcement structure mechanically coupled to at least a first vertical surface of the first semiconductor die and a second vertical surface of the second semiconductor die, such that the reinforcement structure surrounds less than an entirety of the first semiconductor die and the second semiconductor die. The semiconductor package may include an underfill material formed between a top surface of the package substrate and bottom surfaces of the first semiconductor die and the second semiconductor die. The reinforcement structure may include a polymer material located in a space between the first semiconductor die and the second semiconductor die. The polymer material may be a polymer matrix composite having a greater modulus than the underfill material.

Abstract: A barcode image recognition device includes a camera module, an input component, a processing module, a storage module, an output module, and a display. The input component is coupled to the camera module, and the processing module is coupled to the camera module. The processing module includes a first artificial neural network, a conversion module, a second artificial neural network, and a comparison module. The first artificial neural network identifies the first target image of each target object in the default images captured by the camera module. The second artificial neural network identifies the second target image in the captured image captured by the camera module. The storage module is coupled to the processing module. The output module is coupled to the comparison module and the storage module. The display is coupled to the output module.

Abstract: A semiconductor device has a substrate and an electrical component disposed over a first surface of the substrate. An antenna is disposed over a second surface of the substrate. An absorbing material is disposed over the second surface of the substrate around the antenna. The absorbing material is thin and flexible to be workable over the second surface of the substrate. The absorbing material has a plurality of openings to accommodate the antenna and the antenna extends above the absorbing material. A first encapsulant can be deposited over the antenna and second surface of the substate prior to the absorbing material. A second encapsulant is deposited over the electrical component. A shielding material is disposed over the encapsulant and electrical component. An electrical connector is disposed over the first surface of the substrate. The substrate, electrical component, first encapsulant, second encapsulant, shielding material, and electrical connector constitute an antenna-on-package.

Abstract: An autoencoding device for a synthesizable molecule generative model may include a memory configured to store chemical reaction data, chemical reaction learning information, and molecular structure information; and a processor configured to learn a neural network for a molecular generative model based on the chemical reaction data, the chemical reaction learning information, and the molecular structural information. The molecular generative model may include: a reaction sequence encoder configured to generate a latent space based on the chemical reaction learning information; a seed molecule encoder configured to generate an embedding space based on seed structural information for a seed molecule that is a final product of chemical reaction; and a decoder configured to output a reconstruction reaction sequence by decoding a reaction molecule predictive neural network and a reaction template prediction model generated from the latent space and the embedding space.

Abstract: A semiconductor device has a semiconductor wafer or substrate including a plurality of semiconductor die. A plurality of first bumps is formed over an active surface of the semiconductor wafer. A plurality of second bumps is formed within a saw street of the semiconductor wafer separating the plurality of semiconductor die. A top surface of the first bumps is coplanar with a top surface of the second bumps. The second bumps are formed within a first saw street of the semiconductor wafer and further within a second saw street of the semiconductor wafer different from the first saw street. The first bumps are electrically connected to the semiconductor die to provide a function for the semiconductor die. The second bumps are dummy bumps that have no electrical function for the semiconductor die. The semiconductor wafer is singulated through the saw street and second bumps.

Abstract: The present disclosure relates to an object recognition apparatus and method, and the object recognition apparatus includes a sensor and a processor. The processor may determine, based on sensing information of the sensor, longitudinal position information, and lateral position information, determine, lane information determine whether at least one other object, which is different from the object and which is identified as a moving object or a stationary object, is located within the lane in which the object is located, assign a reliability value to the object, wherein a first value corresponds to the reliability value for the object based on the at least one other object being located within the lane in which the object is located, or a second value smaller than the first value as the reliability value, and determine the object as a moving object or a stationary object.

Abstract: A semiconductor package includes: a first semiconductor chip; a second semiconductor chip stacked on the first semiconductor chip; an underfill material layer interposed between the first semiconductor chip and the second semiconductor chip; and a first dam structure disposed on the first semiconductor chip. The first dam structure extends along an edge of the second semiconductor chip and includes unit dam structures apart from each other with a slit therebetween. A vertical level of an upper surface of the first dam structure is located between a vertical level of a lower surface of the second semiconductor chip and a vertical level of an upper surface of the second semiconductor chip. A first sidewall of the first dam structure is in contact with the underfill material layer and includes a flat surface parallel to a sidewall of the second semiconductor chip that faces the first sidewall of the first dam structure.

Abstract: Disclosed is a method of diagnosing a vehicle including an electric motor performed in the vehicle. The method includes acquiring first to third measurement values for a temperature, a voltage, and a current associated with the electric motor from one or more sensors installed for the electric motor, calculating first to third scores for a predetermined diagnostic factor based on each of the first to third measurement values, reading a weight for each of the temperature, the voltage, and the current with regard to the predetermined diagnostic factor from a database installed in the vehicle, and calculating a comprehensive diagnostic score for the predetermined diagnostic factor based on the weight for each of the first to third scores and the predetermined diagnostic factor.

Abstract: A semiconductor device has a carrier. An electrical component is disposed over the carrier. An encapsulant is deposited over the electrical component. A conductive layer is formed over the encapsulant. The conductive layer is deposited as a plurality of graphene-coated metal balls in a matrix. The conductive layer is sintered by intensive pulsed light (IPL) irradiation.

Abstract: Disclosed are a device and a method for user authentication using a security card. The device comprises: a card reader which acquires a face image stored in the card; an infrared light source which emits infrared rays toward a user; an infrared camera which acquires an infrared image including the facial region of the user; a color camera which acquires a color image including the facial region of the user; and a control unit which determines a result of user authentication on the basis of at least one of the infrared image, the color image, and the face image, and generates a control. The control unit performs a liveness test and determines a result of face authentication on the basis of information about the facial region shown in at least one of the color image and the infrared image and on the basis of the face image.

Abstract: Provided is a semiconductor package including a lower package substrate including lower insulating layers, a first semiconductor device mounted on the lower package substrate, a core layer on the lower package substrate to be laterally spaced apart from the first semiconductor device, an encapsulation material surrounding the first semiconductor device and covering an upper portion of the core layer, an upper package substrate disposed on the encapsulation material, the upper package substrate including a first upper redistribution layer and a second upper redistribution layer; wherein a first line width and a first line spacing of a first fine pattern of the first upper redistribution pattern are greater than or equal to a corresponding second line width and a corresponding second line spacing of a second fine pattern of the second upper redistribution pattern, respectively.

Abstract: Systems and methods are provided for recommending benefit types of benefit items to offer within a membership platform.

Abstract: A semiconductor package includes: a first semiconductor chip including a first substrate and a first through electrode passing through the first substrate, wherein the first substrate has a first active surface and a first non-active surface; a chip structure including a plurality of second semiconductor chips stacked on the first semiconductor chip, wherein each second semiconductor chip includes a second substrate and a second through electrode passing through the second substrate; and a third semiconductor chip disposed on the chip structure, and including a third substrate, wherein the first substrate has a first width and a first thickness, wherein the second substrate has a second width and a second thickness, and the third substrate has a third width and a third thickness, wherein the third thickness is thicker than the second thickness, and the third width is greater than the second width.

Abstract: Proposed is a method for product recommendation by a server. The method may include receiving a gift recommendation request from a first user terminal for a second user, checking available basic information of the second user, and determining a first recommendation information based on the basic information, wherein the first recommendation information comprises a first recommendation reason and at least one product related to the first recommendation reason. The method may also include determining a second recommendation information not based on the basic information, wherein the second recommendation information comprises a second recommendation reason and at least one product related to the second recommendation reason. The method may further include providing recommendation information comprising the first and second recommendation information to the first user terminal. The first recommendation information may be prioritized for display over the second recommendation information.

Abstract: Proposed is a bobbin for a superconducting motor by which cooling performance can be obtained and structural stability can be expected. The bobbin for a motor includes a bobbin body on which a superconducting coil is wound and a reinforcement including a reinforced plastic including reinforcing fiber and surrounding a side surface of the bobbin body.

Abstract: A Metaverse Laboratory (ML) is a self-contained comprehensive research and development (R&D) laboratory facility for hybrid modeling and simulation, conceptual and engineering design, prototyping, and experimentation in an operational environment (real, virtual, or augmented) by analyzing consequences based on simulated or actual (live) inputs from either human actors and/or predetermined scenarios. A physical facility encloses a rendering area configured to receive projected images and physical devices or objects. User interaction may be accompanied by image rendering goggles in conjunction with physical interactions with vehicles, objects and/or other users disposed in the rendering area. Computing equipment for driving a rendered scenario directs the outputs including visual and tactile feedback according to the scenario, and input from sensors and users in the rendering area determines a computed response.

Abstract: Provided is a cooling guide structure of a motor, which may effectively cool a coil by being provided with a cooling guide including a guide part for spraying oil cooling the coil to various parts of the coil.