Abstract: The provided is a method and system for trajectory prediction based on Cro-IntentFormer. The method starts by preprocessing vehicle trajectory data collected by sensors to produce raw data suitable for model input. Vehicles are treated as nodes, and the distance between vehicles serves as the basis for determining whether there is an edge between two vehicle nodes. A physical relationship graph is constructed and, along with the raw data, input into a spatio-temporal feature extraction module to obtain the spatio-temporal features of the trajectory. The spatio-temporal feature matrix is then input into an intent prediction module to determine the predicted intentions of the vehicles. Based on the intent information output by the intent prediction module, a semantic relationship graph is reconstructed and input, along with the raw data, into the spatio-temporal feature extraction module to derive the semantic features of the trajectory.

Abstract: The present disclosure relates to semiconductor processing methods for anisotropic film growth. The method includes heating a substrate positioned in a processing chamber. The method includes flowing one or more process gases over the substrate. The one or more process gases include trichlorosilane (TCS) and hydrochloric acid. The method includes depositing one or more layers on one or more fins on the substrate. The deposition of the one or more layers includes forming the one or more layers at a first growth rate along a first dimension and a second growth rate along a second dimension, and the second growth rate is faster than the first growth rate.

Abstract: Systems and methods for payload management systems are illustrated. One embodiment includes a delivery mechanism. A mechanical linkage in the delivery mechanism includes rocking bars mounted to: a chassis and a first cross bar The mechanical linkage includes linear actuators that include piston-type actuators configured to move at least one payload in and out of a compartment. One end of each linear actuator is mounted to an individual rocking bar. The mechanical linkage includes at least one grapple, wherein each grapple comprises a hook mounted to a claw; and is mounted to a second cross bar. The hook is configured to open and close around the at least one payload; and rotate around the claw. The delivery mechanism includes a control circuit configured to open, close, and rotate the hook using a grapple motor and/or an end-of-travel switch; and to move the linear actuators relative to the rocking bars.

Abstract: A planarization method includes the following steps. A silicon layer is deposited on a substrate, and a top surface of the silicon layer includes a lower portion and a bump portion protruding upwards from the lower portion. An ion bombardment etching process is performed to the silicon layer for reducing a surface step height of the silicon layer. The top surface of the silicon layer is etched by the ion bombardment etching process to become a post-etching top surface, and a distance between a topmost portion of the post-etching top surface and a bottommost portion of the post-etching top surface in a vertical direction is less than a distance between a topmost portion of the bump portion and the lower portion in the vertical direction before the ion bombardment etching process. Subsequently, a chemical mechanical polishing process is performed to the post-etching top surface of the silicon layer.

Abstract: A backing film removal system comprises a separating mechanism configured to separate a first portion of a first backing film on a first side of a material segment and a second portion of a second backing film on a second side of the material segment from a material layer of the material segment, wherein the second side is opposite the first side. The backing film removal system also includes a clamping mechanism that is actuatable to apply a clamping force to secure the material layer and the second portion together. A separator assembly includes a gripping mechanism configured to grip the first portion. At least one of the gripping mechanism or the clamping mechanism is movable to draw the first portion gripped by the gripping mechanism away from the material layer to remove a remaining portion of the first backing film from the material layer.

Abstract: A semiconductor device includes a substrate, a first conductive feature disposed in a top portion of the substrate, an etch stop layer formed of a metal oxide composite and disposed on a top surface of the substrate, and a second conductive feature disposed on and through the etch stop layer and in contact with the first conductive feature. The metal oxide composite contains a metal element represented by M, and a top surface of the etch stop layer includes an M—O—X group, O representing oxygen, and X representing an element other than hydrogen.

Abstract: A resealable package configured for heating in a microwave oven having at least one vent capable of relieving an internal pressure from an interior space of the package during heating. To protect the integrity of a resealable fastener, such as a zipper reclose feature, the at least one vent is capable of functioning at a low pressure below about 3.0 psi and preferably below about 1.4 psi. The at least one vent includes a specifically shaped outer portion and inner portion integrated into a package seal to allow for a controlled rupture or separation of this seal at the location of the at least one vent. This at least one vent can be formed directly into a seal of the package through a specifically shaped seal bar used during package formation.

Abstract: A semiconductor wafer is prepared with the silicon {111} crystalline plane parallel to the major surfaces of the wafer. After preparation of the wafer with the desired {111} crystalline plane orientation, integrated circuit semiconductor dies may be defined in one of the major surfaces of the wafer. Stress defects may then be formed in the wafer in a {111} crystalline plane at a depth corresponding to the final thickness of the wafer. Cracks propagate from the stress defects in the plane of the stress defects, effectively cleaving the wafer in two at the desired finished thickness of the wafer.

Abstract: A microelectromechanical sensing device includes a substrate, a plurality of support structures and a sensing structure. The sensing structure is supported by the plurality of support structures and is disposed above the substrate. The sensing structure includes a first dielectric layer, an electrode layer, a sensing layer and a second dielectric layer. The first dielectric layer has a dielectric top surface coplanar with the support top surface of each of the support structures. The electrode layer is disposed on the first dielectric layer and directly contacts the plurality of support structures. The sensing layer is disposed on the first dielectric layer and a projection of the sensing layer toward the substrate does not overlap the plurality of support structures. The second dielectric layer is disposed on the electrode layer and the sensing layer, wherein the first dielectric layer and the second dielectric layer are made of the same material.

Abstract: A three-dimensional human head reconstruction method, an electronic device and a non-transient computer-readable storage medium are provided. The method includes: acquiring a target portrait image; inputting the target portrait image into a target model to obtain an output result of the target model; wherein the target model is obtained by pre-training with a plurality of training samples which are generated according to a sample portrait image and a sample three-dimensional human head model, the sample three-dimensional human head model is obtained by iteratively fitting a standard three-dimensional human face statistical model according to two-dimensional feature information related to a portrait in the sample portrait image, and the two-dimensional feature information includes human face feature points and a human head projection contour line; and generating, according to the output result, a target three-dimensional human head model corresponding to the target portrait image.

Abstract: A quantitative prediction method for gas content of deep marine shale includes: obtaining raw data of known wells; establishing relationship formulas between pore specific surface areas and adsorbed gas contents of a known well in an area as an adsorbed gas content quantitative prediction model; establishing relationship formulas between pore volumes and free gas contents of the known well as a free gas content quantitative prediction model; summing the adsorbed gas contents and corresponding free gas contents to obtain total gas contents; calculating adsorbed gas contents, free gas contents and total gas contents of the known wells; drawing a predicted adsorbed gas content contour map, a predicted free gas content contour map and a predicted total gas content contour map; and reading an adsorbed gas content, a free gas content and a total gas content of an unknown well in the area from the above contour maps.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A pressure monitor for vehicle tire inflation includes a hollow hand-held portion, a pressure digital indicator, an airflow control valve sleeve, a quick fit interface, an inflation hose, a valve core joint assembly and an air relief valve, wherein the hollow hand-held portion has a top end threaded with the pressure digital indicator and a bottom end provided with a dual end threaded part, a lower portion of the dual end threaded part is threadably provided with the airflow control valve sleeve, an end of the airflow control valve sleeve is provided with the quick fit interface, the inflation hose is hermetically connected and provided at one side of a top portion of the hollow hand-held portion, an end of the inflation hose is provided with a quick connect threaded part, and the valve core joint assembly is provided at an end of the quick connect threaded part.

Abstract: Disclosed in the present disclosure is a busbar structure, including a plurality of conductive busbars arranged in a first direction, two adjacent conductive busbars being provided vertically flipped over, in which the conductive busbar includes a first conductive unit for being connected to positive electrodes of cells and a second conductive unit for being connected to negative electrodes of cells, the first conductive unit and the second conductive unit are arranged in a second direction, each conductive busbar is used to connect the cells, arranged in two adjacent zigzagged cell rows along the second direction, in series along the first direction in a zigzag pattern, respectively.

Abstract: A gas infusion tank for a beverage machine includes a tank body defining a holding space for accommodating beverages. A mixing element includes a mixing chamber, an ascending pipe, and a descending pipe. A top of the ascending pipe is fluidly connected to the mixing chamber and a bottom of the ascending pipe has a liquid inlet. The liquid inlet is fluidly connected to the holding space. A top of the descending pipe is fluidly connected to the mixing chamber and a bottom of the descending pipe includes a liquid outlet in fluid communication with the nozzle. A gas intake hole connects the holding space with the mixing chamber.

Abstract: The present application discloses a conversion apparatus from a chip package to a waveguide, a radio frequency apparatus and a radar apparatus. The conversion apparatus includes: a first metal layer as a metal ground layer, a second metal layer, a third metal layer, a shielding metallization via, a conversion via, and a dielectric substrate disposed between different metal layers to function as a support; the second metal layer is configured to lay an RF trace; the third metal layer is configured to dispose a patch element; a capacitance formed between the RF trace and patch element introduces capacitance characteristic; multiple shielding metallization vias are ground vias around the patch element and RF trace for guiding RF signal propagation; at least one conversion metallization via is disposed on one end of the RF trace close to the patch element, for connecting the RF trace and patch element and introducing inductance characteristic.

Abstract: A retrofit tubular lamp having a single switch device configured to selectively connect a first end and a second end of an input interface together. When the two ends are connected, a converter is bypassed whilst supplying power to a light emitting arrangement of the lamp. When the two ends are disconnected, power is provided to the light emitting arrangement via the converter. The single switch device is further configured so that, when disconnecting the two ends from one another, a creepage distance between the two ends is equal to or greater than a predetermined safety distance (i.e. a safety creepage is created).

Abstract: A wall socket, including: a rear housing, having a box body located on the inner side and a positioning flange located on the outer side and integrated with the box body; and a pressing plate, buckled with the positioning flange of the rear housing by means of a plurality of detachable buckles so as to seal a wiring terminal, a zero wire connecting piece, a live wire connecting piece, a zero wire insertion grip, a live wire insertion grip, and a ground wire insertion grip in the box body of the rear housing. The zero wire connecting piece and/or the live wire connecting piece have a heat dissipation plane attached to the inner wall of the box body of the rear housing, and the outer wall of the box body of the rear housing corresponding to the position of the heat dissipation plane is attached to a wall.

Abstract: The present application belongs to the field of lamps and lanterns, and more particularly, relates to a lampshade assembly. The lampshade assembly includes a first lampshade and a second lampshade, wherein the first lampshade is arranged to sleeve the outside of the second lampshade; a lamp housing heat-dissipation channel is formed between the first lampshade and the second lampshade; lampshade heat-dissipation holes are formed in the first lampshade; and a light-condensing channel is arranged in the second lampshade. In the present application, this lampshade assembly can play a role in preventing light leakage, and can also better dissipate heat from a lamp through the lamp housing heat-dissipation channel and the lampshade heat-dissipation holes.

Abstract: Embodiments of the present disclosure provides a heat dissipation equipment cabinet. The heat dissipation equipment cabinet comprises: a cabinet comprising a front wall, a rear wall and a pair of sidewalls perpendicular to the front wall, at least one of the front and rear walls comprising at least one cabinet air inlet arranged at bottom and at least one cabinet air outlet arranged at top; and a plurality of drawer assemblies spaced apart from at least one of the pair of sidewalls to form a cabinet heat dissipation channel, a drawer heat dissipation channel communicating with the cabinet heat dissipation channel being formed between every two adjacent drawer assemblies of the plurality of drawer assemblies, and wherein each of the plurality of drawer assemblies has a drawer air inlet and a drawer air outlet. This can improve the heat dissipation effect of the equipment cabinet.