Abstract: A printed board unit includes a mother board 60, and a first board unit 70-1 and a second board unit 70-2 that face each other and are vertically mounted onto the mother board 60 with connector devices 100-1 and 100-2. The first board unit 70-1 has memory mounting boards 81-1 horizontally mounted to a region near the lower end of a vertically standing daughter board 71-1. The second board unit 70-2 has memory mounting boards 81-2 horizontally mounted to a region near the upper end of a vertically standing daughter board 71-2. The memory mounting boards 81-1 of the first board unit 70-1 are arranged on the lower side, while the memory mounting boards 81-2 of the second board unit 70-2 are arranged on the upper side.

Abstract: A method for manufacturing a semiconductor device includes forming a plurality of gate electrodes on a semiconductor substrate, forming an etching prevention film over the surface of the adjacent gate electrodes and on the semiconductor substrate between the adjacent gate electrodes, and forming an organic insulation film having heat-resistance on the etching prevention film. The method further includes removing the organic insulation film above the gate electrodes in such a manner that the organic insulation film remains between the gate electrodes, forming an interlayer insulation film on a laminate section obtained by the organic insulation film removing step, forming a contact hole by removing the interlayer insulation film on the remaining organic insulation film with a width wider than the distance between the gate electrodes, and exposing the semiconductor substrate between the gate electrodes by removing the organic insulation film and the etching prevention film remaining inside the contact hole.

Abstract: An optical pickup drive device has first through third reference plates parallel to each other and interconnected by three or fourth pivotal support members or connecting arms by which the first through third reference plates are pivotally supported. An optical pickup is mounted on the first reference plate. Drive mechanisms for driving the optical pickup in directions parallel to the second reference plate are disposed on the first and third reference plates, or the pivotal support members. With this arrangement, the drive device allows the optical pickup to read a signal with stable accuracy against external vibrations and shocks applied to the drive device.

Abstract: An improved gasket where the openings in the gasket which fit around the cylinder bores is provided with a grommet which is generally U-shaped in cross-section, having spaced ends at least one of which is bent inwardly to engage the bore wall of the grommet to securely hold the grommet in place in the gasket opening.