Abstract: Three-dimensional data can be easily and automatically generated using existing non-three-dimensional data in the form of isometric drawings or the like, without resorting to three-dimensional arrangement adjustment CAD. In three-dimensional data generation unit 120, data edition unit 122, generates a spreadsheet data that includes information relating to a plurality of node points on a continuous arrangement route of target components by interactive process with a user, and stores the data in storage unit 130. Three-dimensional data conversion unit 123, on the basis of spreadsheet data, arranges the node points in a three-dimensional space, connects node points having a predetermined relationship using line segments, and imparts cross-sectional shapes to the connected line segments, to carry out thereby conversion into target component arrangement three-dimensional data.

Abstract: A semiconductor device includes: a base plate; a semiconductor element provided on the base plate; a holder provided on an opposite side of the semiconductor element from the base plate and holding terminals electrically connected to the semiconductor element; a casing surrounding the semiconductor element and opposed to a side surface of the holder; and a sealing resin filled among the base plate, the casing, and the holder. The side surface of the holder is provided with a first protrusion protruding toward the casing. The first protrusion is nearer to the base plate than a major surface of the holder on an opposite side from the base plate. A surface of the first protrusion on an opposite side from the base plate is at least partly buried in the sealing resin.

Abstract: A frequency dividing circuit includes: a D-type flip flop that outputs frequency-divided signal synchronized with input clock and reverse phase signal corresponding to the frequency-divided signal; a variable delay circuit that generates a delay feedback signal delayed by a specific delay time from the reverse phase signal input from the D-type flip flop and feeds back the delay feedback signal to the D-type flip flop; and a delay adjusting circuit that detects a phase difference between the reverse phase signal input from the D-type flip flop and the delay feedback signal input from the variable delay circuit, obtains detected results, and outputs to the variable delay circuit a control signal to perform control so that the delay time becomes time required to ensure setup/hold time of the D-type flip flop, based on the detected results.

Abstract: The present invention reduces the number of diagrams and the workload of management and the like, by aggregating spools of a common format, in plant design technology using a three-dimensional CAD system. Format specific data which is stored separately according to spool format is obtained by aggregating the respective spools in the internal data, which is generated by a data acquisition means, into respective common formats by a spool aggregation means.

Abstract: A frequency dividing circuit includes: a D-type flip flop that outputs frequency-divided signal synchronized with input clock and reverse phase signal corresponding to the frequency-divided signal; a variable delay circuit that generates a delay feedback signal delayed by a specific delay time from the reverse phase signal input from the D-type flip flop and feeds back the delay feedback signal to the D-type flip flop; and a delay adjusting circuit that detects a phase difference between the reverse phase signal input from the D-type flip flop and the delay feedback signal input from the variable delay circuit, obtains detected results, and outputs to the variable delay circuit a control signal to perform control so that the delay time becomes time required to ensure setup/hold time of the D-type flip flop, based on the detected results.

Abstract: More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.

Abstract: A trigger signal generator for outputting a trigger signal having a lower frequency than that of an input signal, the trigger signal generator including: a frequency divider circuit for dividing a frequency of the input signal; and a synchronizing circuit including a synchronizer for synchronizing the frequency-divided signal with the input signal.

Abstract: A sampling device for repetitive sampling a measured signal includes a measured signal sampling circuit for sampling the measured signal, a reference signal generating circuit for generating a reference signal having a predetermined frequency, a sampling circuit for sampling the reference signal generated by the reference signal generating circuit, and a frequency converting circuit for generating a strobe signal from a clock signal being synchronized with the measured signal, the strobe signal causing the sampling circuit and the measured signal sampling circuit to execute sampling.

Abstract: The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Abstract: A slide rail has a pair of inside rails in which V-grooves having a V shape in cross section are formed in a lengthwise direction in outside faces of the pair of inside rails which have inside faces provided so as to face each other. V-grooves are formed in inside faces of a pair of outside rails provided outside of both the inside rails, and the outside rails are moved relative to the inside rails by spherical bodies provided between both the V-grooves. A stay has ends which are supported on the inside faces of both the inside rails substantially opposing the V-grooves of the inside rails, and the stay is provided with a regulation mechanism for adjusting and maintaining a distance between both the inside rails.

Abstract: The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Abstract: There is provided a cable wiring construction capable of preventing troubles caused by breaking of cable. A curl cord 15 is extended from a unit body 11 under a seat 1, and a controller 16 is provided at a tip end of the curl cord 15. A backboard is fixed to a back surface 22 of a seat back 21 with clips, and a locking member is provided between the backboard and the seat back 21. An upper loop portion and a lower loop portion at both ends of the locking member are fixed to the seat back 21 together with the backboard by clips. A locking portion 41 tied to the curl cord 15 is provided in an intermediate portion of both loop portions, and the proximal ends of the locking portion 41 are positioned in a state of being held between the seat back 21 and the backboard, so that the locking portion 41 for the curl cord 15 is provided on the seat back 21. A height position of the curl cord 15 in the locking portion 41 is set so as to be higher than a seat cushion 51.

Abstract: A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

Abstract: A method of transferring a pattern of a mask onto shot areas on a substrate determines two sets of parameters in a single model equation. The parameters in one of the two sets relate to arrangement of a plurality of shot areas on the substrate, and the parameters in the other set relate to the shot areas per se. The mask and the substrate are moved relatively in accordance with the determined parameters.

Abstract: A low cost automotive power window switch having few window operating switches uses a single switch to select which of the four windows to operate, and to control the window locks. The power window switch has a window operating switch 3 for raising and lowering each of the car windows, and a mode selector switch 2 for switching between the windows. The mode selector switch 2 also has a window lock switch function for locking and unlocking the windows.

Abstract: There is provided a cable wiring construction capable of preventing troubles caused by breaking of cable. A curl cord 15 is extended from a unit body 11 under a seat 1, and a controller 16 is provided at a tip end of the curl cord 15. A backboard is fixed to a back surface 22 of a seat back 21 with clips, and a locking member is provided between the backboard and the seat back 21. An upper loop portion and a lower loop portion at both ends of the locking member are fixed to the seat back 21 together with the backboard by clips. A locking portion 41 tied to the curl cord 15 is provided in an intermediate portion of both loop portions, and the proximal ends of the locking portion 41 are positioned in a state of being held between the seat back 21 and the backboard, so that the locking portion 41 for the curl cord 15 is provided on the seat back 21. A height position of the curl cord 15 in the locking portion 41 is set so as to be higher than a seat cushion 51.

Abstract: There is provided a slide rail capable of preventing troubles caused by a transverse shift. In the slide rail, a pair of inner rails are formed on a swivel upper, and a pair of center rails are arranged on an outside of the inner rails. V-grooves are provided in an outside surface of each inner rail and in an inside surface of the center rail, and steel balls positioned by a holding element are housed between both the V-grooves. First and second sprocket supporting brackets 53, 54 are fixed to inside faces of the inner rails, and a stay 71 is supported on both the sprocket supporting brackets 53, 54. In one end portion of the stay 71, a cylindrical portion 73 which is inserted rotatably in a circular hole 66 in a first sprocket shaft 63 is provided, and in the other end portion thereof, an external thread portion 75 which is threadedly inserted in a threaded hole 68 in a second sprocket shaft 64 is provided.

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec