Abstract: A method of aligning each of a plurality of processing areas arranged on a substrate with a predetermined transfer position in a static coordinate system XY for defining a moving position of said substrate, a pattern of a mask being transferred to each of the plurality of processing areas, the method comprising the steps of: wherein each of the plurality of processing areas has a specific point and a plurality of marks for alignment arranged by a predetermined positional relationship with respect to said specific point; measuring coordinate positions of a predetermined number of marks selected from several processing areas of the plurality of processing areas on the static coordinate system XY; calculating a plurality of parameters in a model equation expressing the regularity of arrangement of the plurality of processing areas by performing a statistic calculation by use with the measured plurality of coordinate positions, arrangement coordinate values upon the design of the specific points of the several pr

Abstract: A method of obtaining an optimum exposure condition of a step-and-scan exposure apparatus, the step-and-scan exposure apparatus synchronously moving a mask and a substrate relative to an illumination light to transfer a pattern of the mask onto a plurality of shot areas on the substrate, the method comprising the steps of determining an unevenness of an illuminance of the illumination light, adjusting the illumination light to change the illuminance within a predetermined range, inputting a plurality of first exposure conditions into the step-and-scan exposure apparatus, testing the plurality of first exposure condition in a step-and-repeat mode.

Abstract: A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: The present invention relates, to an exposure method, exposure apparatus, and the like having a configuration for effectively preventing color inconsistencies from occurring due to defocusing upon scanning exposure. In particular, the exposure method and apparatus according to the present invention control the scanning exposure according to the positional relationship between a substrate and a detection area for detecting a focus state of the substrate, the positional relationship between individual shot areas on the substrate the positional relationship between a shot area on the substrate and an edge of the substrate, or the like.

Abstract: A surface acoustic wave device with an electrode structure that suppresses the deterioration of a withstand voltage against an overvoltage such as a surge voltage or noise applied to a balanced signal terminal is provided. A serial resonator 5 that blocks a voltage is disposed among IDTs 7, 9, 11 and a signal output terminal 3 of the surface acoustic wave device. In addition, a serial resonator 6 is disposed among the IDTs 7, 9, 11, and a signal output terminal 4. The serial resonators 5 and 6 operate as part of IDTs to extract a desired band signal. The structure of the serial resonator 5 should be almost the same as that of the serial resonator 6.

Abstract: A method of aligning each of a plurality of processing areas arranged on a substrate with a predetermined transfer position in a static coordinate system XY for defining a moving position of said substrate, a pattern of a mask being transferred to each of the plurality of processing areas, the method comprising the steps of: wherein each of the plurality of processing areas has a specific point and a plurality of marks for alignment arranged by a predetermined positional relationship with respect to said specific point; measuring coordinate positions of a predetermined number of marks selected from several processing areas of the plurality of processing areas on the static coordinate system XY; calculating a plurality of parameters in a model equation expressing the regularity of arrangement of the plurality of processing areas by performing a statistic calculation by use with the measured plurality of coordinate positions, arrangement coordinate values upon the design of the specific points of the several pr

Abstract: A surface acoustic wave element constituted by forming a comb electrode and a terminal electrode on a piezoelectric element and a base substrate including an element connection terminal and an external connection terminal are opposed to each other, the terminal electrode and the element connection terminal are connected to each other, and the peripheries of the base substrate and the surface acoustic wave element are sealed with a sealing member and bonded to each other.

Abstract: A method of aligning each of a plurality of processing areas arranged on a substrate with a predetermined transfer position in a static coordinate system XY for defining a moving position of said substrate, a pattern of a mask being transferred to each of the plurality of processing areas, the method comprising the steps of: wherein each of the plurality of processing areas has a specific point and a plurality of marks for alignment arranged by a predetermined positional relationship with respect to said specific point; measuring coordinate positions of a predetermined number of marks selected from several processing areas of the plurality of processing areas on the static coordinate system XY; calculating a plurality of parameters in a model equation expressing the regularity of arrangement of the plurality of processing areas by performing a statistic calculation by use with the measured plurality of coordinate positions, arrangement coordinate values upon the design of the specific points of the several pr

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec

Abstract: A low cost automotive power window switch having few window operating switches uses a single switch to select which of the four windows to operate, and to control the window locks. The power window switch has a window operating switch 3 for raising and lowering each of the car windows, and a mode selector switch 2 for switching between the windows. The mode selector switch 2 also has a window lock switch function for locking and unlocking the windows.

Abstract: A two-step operation switch device, in which intervals between a common fixed contact and other fixed contacts juxtaposed to the common fixed contact are kept as wide as possible so that insulating properties between the contacts are maintained in a normal state. The common fixed contact 11, first fixed contacts 12, 13, and second fixed contacts 14, 15 are disposed on an insulating plate 1. A movable contacting piece 2 has a first contacting piece 21 slid in a first region, in which the common fixed contact 11 and the first fixed contacts 12 and 13 are juxtaposed, and a second contacting piece 22 slid in a second region, in which the common fixed contact 11 and the second fixed contacts 14 and 15 are juxtaposed. Intervals W2 between the common fixed contact 11 and the second fixed contacts 14 and 15 in the second region Z2 are wider than intervals between the common fixed contact 11 and the first fixed contacts 12 and 13 in the first region Z1.

Abstract: A switch assembly with internal electronic components that enables easy assembly and is dustproof, and that can be oriented relative to the main board of a power window control switch or other devices with a lesser degree of limitation and has a wide variety of applications. A plurality of electronic components are mounted to one side of a plate 1. A plurality of switch electrodes 3 are formed in the other side of the plate 1. A switch case 6 is resiliently fit over the base plate 1. The switch case 6 includes an elongated aperture 61 within which a lever 41 of a switch operating mechanism 4 is loosely fit, pawls 62 adapted for resilient engagement with the base plate 1, projections 63 and a base 64. The switch operating mechanism 4 holds a movable contact 5. The switch case 6 defines a space 65 adjacent to the switch operating mechanism 4 and the movable contact 5. The switch electrodes 3 are sealably contained within the space 65 when the switch case 6 is resiliently fit over the base plate 1.

Abstract: A projection exposure method and apparatus are disclosed, which can perform a focusing operation with respect to a partly omitted shot exposed at a peripheral portion of a photosensitive substrate such as a wafer. In the projection exposure method and apparatus, when a prohibition band having a predetermined width is set from the edge of the substrate, and exposure is to be performed with respect to a shot area having a portion located only within the prohibition band and the remaining portion located outside the edge of the substrate, a focus detection point is shifted to the boundary line of the prohibition band on the substrate, and a focusing operation is performed. Thereafter, the focus detection point is moved to an original target shot exposure position to perform exposure.

Abstract: A projection exposure apparatus has a structure in which the deviation in a focusing direction between a portion on a wafer which a focus sensor detects during exposure and a desired portion in a shot area is detected, and an offset corresponding to the deviation detected is applied to the focus sensor.

Abstract: A ceramic composition which forms, when sintered, a dielectric having a crystal structure represented by the general formula:[Pb.sub.1-x A.sub.x ].sub.[A] (B.sub.1,B.sub.2).sub.[B] O.sub.3where A is at least one element selected from the group consisting of Ca, Sr, Ba, Ag, La and Nd, B.sub.1 is at least one element selected from the group consisting of Mg, Zn, Ni, Co, Fe, Mn and In, B.sub.2 is at least one element selected from the group consisting of Nb, W, Ta and Sb, x is 0 to 0.5, and the molar ratio of [A]/[B] is 0.995 or more, but 0.99 or less.

Abstract: A ceramic capacitor includes at least two opposing electrodes, and a dielectric ceramic composition arranged between the electrodes, wherein the ceramic composition is represented by a formula (Pb.sub.1-x Ae.sub.x) (Zr.sub.1-y Ti.sub.y)O.sub.3 (wherein x represents 0.15 to 0.90, y represents 0 to 0.80, and Ae represents at least one type of an element selected from the group consisting of Ca and Sr), and has a composition in which assuming that the total number of moles of elements constituting a site A consisting of Pb and Ae is (A) and that the total number of moles of elements constituting a site B consisting of Zr and Ti is (B), (A)/(B) is 1.00 or less. The site A of the dielectric ceramic composition may be partially substituted with Ba. The dielectric ceramic composition may be obtained by adding Nb, Cu, Bi, Mn, Co, Ag, Si, Ta, Mg, Zn, W and/or Ni to a composition which is represented by a formula (Pb.sub.1-x Ae.sub.x) (Zr.sub.1-y Ti.sub.y)O.sub.3 (wherein x represents 0.15 to 0.90, y represents 0 to 0.

Abstract: A high-dielectric constant ceramic composite is provided in which an appropriate amount of glass component is added to a composite of the BaTiO.sub.3 -PbMO.sub.3 group having a low temperature coefficient in the dielectric constant thereof. The added glass component serves to maintain the satisfactory properties of the ceramic composite even after various types of reliability tests.

Abstract: A fiber grid reinforcement is of a flat shape and has first and second directions perpendicular to each other. The fiber grid reinforcement includes a plurality of first fiber bundles, a plurality of second fiber bundles, and a resin material. The first fiber bundles are generally disposed along the first direction and generally parallel to one another. Each of the first fiber bundles includes at least one first group of fibers. The second fiber bundles are generally disposed along the second direction and generally parallel to one another. Each of the second fiber bundles inbcludes at least one second group of fibers. The second fiber bundles intersect perpendicular to the first fiber bundles at intersecting sections so as to form a grid structure. The first group and the second group of fibers are layered alternately at the intersecting sections in such a manner that at least one outermost layer is the second group. The resin material bonds fibers in each group, and bonds the groups to one another.