Abstract: Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap.

Abstract: Acoustic wave device includes: a piezoelectric substrate; a first IDT located on the piezoelectric substrate; and a second IDT located on the piezoelectric substrate and connected in series to the first IDT, wherein the first IDT and the second IDT share a single common bus bar as a first bus bar of two bus bars of the first IDT and a first bus bar of two bus bars of the second IDT, and the common bus bar has a width not more than two times a wavelength of an acoustic wave propagating through the first and second IDTs, the common bus bar connects to no dummy electrode finger facing a tip of an electrode finger connected to a second bus bar of the two bus bars of the first IDT and the second IDT across a gap.

Abstract: A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.

Abstract: A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.

Abstract: More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.

Abstract: A duplexer includes two surface acoustic wave filter having different band center frequencies, and a phase matching circuit that matches the phases of the two surface acoustic wave filters to each other. In this duplexer, one of the two surface acoustic wave filters is a ladder type surface acoustic wave filter, while the other one of the two surface acoustic wave filters includes two or more dual-mode type surface acoustic wave filters that are connected in parallel.

Abstract: A surface acoustic wave device includes a piezoelectric substrate on which resonators having comb-like electrodes are formed; and a silicon substrate that is directly bonded to the piezoelectric substrate and is less expansive than the piezoelectric substrate, a cavity being formed in the silicon substrate and being located below at least one of the resonators.

Abstract: A surface acoustic wave resonator includes a piezoelectric substrate, and a SAW resonator having an interdigital transducer. The interdigital transducer satisfies 0.15L?W?0.45L where W is the total of widths of all electrode fingers that form the interdigital transducer, and L is a length of the said interdigital transducer in a direction of SAW propagation.

Abstract: A duplexer includes a multilayer package, SAW filters that have different band center frequencies and are provided in the multilayer package, and a phase matching line that matches phases of the SAW filters and are provided in the multilayer package. A ground pattern with respect to the phase matching line is provided on a mount surface of the multilayer package.

Abstract: A surface acoustic wave device includes multiple SAW resonators formed on a piezoelectric substrate and connected in a ladder arrangement, the piezoelectric substrate having a polarization inverted region on which either a series-arm resonator or a parallel-arm resonator is formed.

Abstract: An acceleration sensor includes a piezoelectric single-plate having a weight part and a detection part. The piezoelectric single-plate is, for example, an X-cut plate of LiNbO3.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.

Abstract: An acceleration sensor includes a piezoelectric single-plate having a weight part and a detection part. The piezoelectric single-plate is, for example, an X-cut plate of LiNbO3.

Abstract: A duplexer includes two surface acoustic wave filter having different band center frequencies, and a phase matching circuit that matches the phases of the two surface acoustic wave filters to each other. In this duplexer, one of the two surface acoustic wave filters is a ladder type surface acoustic wave filter, while the other one of the two surface acoustic wave filters includes two or more dual-mode type surface acoustic wave filters that are connected in parallel.

Abstract: More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.

Abstract: A surface acoustic wave device includes a piezoelectric substrate on which resonators having comb-like electrodes are formed; and a silicon substrate that is directly bonded to the piezoelectric substrate and is less expansive than the piezoelectric substrate, a cavity being formed in the silicon substrate and being located below at least one of the resonators.

Abstract: A surface acoustic wave device includes multiple SAW resonators formed on a piezoelectric substrate and connected in a ladder arrangement, the piezoelectric substrate having a polarization inverted region on which either a series-arm resonator or a parallel-arm resonator is formed.

Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.