Patents by Inventor Osamu Kagaya

Osamu Kagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220021100
    Abstract: An antenna unit for glass according to the present invention is installed on the indoor side of a glass sheet, and transmits and receives electromagnetic waves at the indoor side through the glass sheet.
    Type: Application
    Filed: October 1, 2021
    Publication date: January 20, 2022
    Applicants: AGC Inc., NTT DOCOMO, INC.
    Inventors: Tetsuya HIRAMATSU, Ryuta SONODA, Osamu KAGAYA, Kentaro OKA, Akira SAITO, Kensuke MIYACHI, Akinobu UEDA, Yoshiyuki KAWANO, Jun ANDOU, Taku YAMAZAKI
  • Patent number: 11224120
    Abstract: Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance H1 between the pair of strip conductors and the ground conductor layer is twice or more a distance H2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: January 11, 2022
    Assignee: Lumentum Japan, Inc.
    Inventors: Osamu Kagaya, Koyu Takahashi, Yoshikuni Uchida
  • Publication number: 20210376462
    Abstract: A wireless communication device includes a base material; a directivity control array and a wiring disposed on the base material, the directivity control array having a plurality of unit elements disposed in a certain two-dimensional pattern, and the wiring connected to a DC power supply to apply a DC voltage to desired unit elements; the wireless communication device further comprising a controller to control the DC voltage to be applied to the desired unit elements.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: AGC Inc.
    Inventors: Qiang CHEN, Hiroyasu SATO, Osamu KAGAYA, Toshiki SAYAMA
  • Publication number: 20210359488
    Abstract: Each semiconductor device includes a semiconductor laser unit and an optical modulator unit. Each transmission line is configured to transmit a drive signal to the optical modulator unit. Each resistor is provided for the transmission line and configured to terminate the drive signal. Each first conductive pattern is connected to one electrode of the semiconductor laser unit and one electrode of the optical modulator unit. Each chip capacitor has one electrode connected to another electrode of the semiconductor laser unit through a bonding wire. Each chip capacitor has another electrode connected to the first conductive pattern that is connected to the semiconductor laser unit. Each second conductive pattern is connected to the resistor, directly or through a DC blocking capacitor. Each third conductive pattern is connected to each of the first conductive pattern and the second conductive pattern through a conductive via hole in the chip carrier.
    Type: Application
    Filed: April 6, 2021
    Publication date: November 18, 2021
    Inventor: Osamu KAGAYA
  • Patent number: 11165135
    Abstract: An antenna unit for glass according to the present invention is installed on the indoor side of a glass sheet, and transmits and receives electromagnetic waves at the indoor side through the glass sheet.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: November 2, 2021
    Assignees: AGC Inc., NTT DOCOMO, INC.
    Inventors: Tetsuya Hiramatsu, Ryuta Sonoda, Osamu Kagaya, Kentaro Oka, Akira Saito, Kensuke Miyachi, Akinobu Ueda, Yoshiyuki Kawano, Jun Andou, Taku Yamazaki
  • Publication number: 20210239925
    Abstract: In an optical module, optical signal output having satisfactory waveform and intensity can be obtained. A differential transmission line includes a first differential transmission line, which has a first characteristic impedance and is connected to a drive IC, a second differential transmission line, which has a second characteristic impedance and is connected to a light output element, the second characteristic impedance being smaller than the first characteristic impedance, and connecting portions configured to connect the first differential transmission line and the second differential transmission line in series with each other. A resistive element is arranged between the connecting portions. The resistive element has a resistance value that is set to a value with which an absolute value of a reflection coefficient for a signal traveling from the second differential transmission line side to the first differential transmission line side is 0.10 or less.
    Type: Application
    Filed: January 22, 2021
    Publication date: August 5, 2021
    Inventor: Osamu KAGAYA
  • Publication number: 20210210857
    Abstract: An antenna system includes a glass plate having a thickness of 1.1 mm or more and a dielectric loss tangent of 0.005 or more at 28 GHz, and an antenna located away from one of surfaces of the glass plate, wherein a ratio of electric power radiated from the antenna to electric power input into the antenna is defined as a radiation efficiency, and when an effective wavelength of an electromagnetic wave at a predetermined frequency is 10 GHz or more is denoted as Ag and the radiation efficiency as ?0 [dB] when the glass plate and the antenna are in contact, and is denoted as ??g/2 [dB] when a distance between the one of the surfaces and the antenna is ?g/2, the glass plate and the antenna are arranged to obtain the radiation efficiency of ?A [dB] that satisfies ?A??0+(??g/2??0)×0.1.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Applicant: AGC Inc.
    Inventors: Toshiki SAYAMA, Ryota OKUDA, Takeshi MOTEGI, Osamu KAGAYA
  • Patent number: 11057986
    Abstract: The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: July 6, 2021
    Assignee: Lumentum Japan, Inc.
    Inventor: Osamu Kagaya
  • Publication number: 20210191011
    Abstract: A radio-wave transmitting substrate includes a dielectric substrate, and, on at least one main surface of the dielectric substrate, a heat-ray reflection film including an electroconductive film, and an opening where the electroconductive film is absent in a plan view. At least a part of the at least one main surface in a plan view is a radio-wave transmitting region. The radio-wave transmitting region is a region where every 1-cm square unit region in the region satisfies the following expression (a): L>802.6×S?503.7. L is an overall length (unit: mm/cm2) of a boundary between the heat-ray reflection film and the opening in the unit region, and S is a proportion of an area occupied by the heat-ray reflection film in the unit region.
    Type: Application
    Filed: March 4, 2021
    Publication date: June 24, 2021
    Applicant: AGC Inc.
    Inventors: Shimpei MORITA, Kouichirou TAKAHASHI, Osamu KAGAYA, Takato KAJIHARA, Akiyo NOGAMI
  • Publication number: 20210127481
    Abstract: Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.
    Type: Application
    Filed: January 6, 2021
    Publication date: April 29, 2021
    Inventor: Osamu KAGAYA
  • Patent number: 10960646
    Abstract: A window member includes a transparent substrate, wherein in plan view of the window member, the transparent substrate itself includes a first region, and a second region having higher radio-wave transmissivity than the first region. The transparent substrate may include a first glass sheet, and a second glass sheet which is laminated to the first glass sheet via an intermediate film.
    Type: Grant
    Filed: October 27, 2018
    Date of Patent: March 30, 2021
    Assignee: AGC INC.
    Inventors: Osamu Kagaya, Masaru Shiina, Kotaro Enomoto, Kazuhiro Nakano
  • Patent number: 10904997
    Abstract: Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 26, 2021
    Assignee: Lumentum Japan, Inc.
    Inventor: Osamu Kagaya
  • Publication number: 20210021051
    Abstract: A slot array antenna includes a dielectric layer, a power feeding unit, a first coplanar waveguide formed in a conductor layer provided on one surface of the dielectric layer, and a second coplanar waveguide formed in the conductor layer, wherein each of the first coplanar waveguide and the second coplanar waveguide includes a first end part connected to a point to which the power feeding unit is connected or situated in proximity and at least one second end part connected to at least one slot formed in the conductor layer.
    Type: Application
    Filed: October 6, 2020
    Publication date: January 21, 2021
    Applicant: AGC Inc.
    Inventors: Qiang CHEN, Osamu KAGAYA, Toshiki SAYAMA, Takeshi MOTEGI
  • Publication number: 20200196438
    Abstract: Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance Hi between the pair of strip conductors and the ground conductor layer is twice or more a distance H2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 18, 2020
    Inventors: Osamu KAGAYA, Koyu TAKAHASHI, Yoshikuni UCHIDA
  • Publication number: 20200161741
    Abstract: An antenna unit for glass according to the present invention is installed on the indoor side of a glass sheet, and transmits and receives electromagnetic waves at the indoor side through the glass sheet.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 21, 2020
    Applicants: AGC Inc., NTT DOCOMO, INC.
    Inventors: Tetsuya HIRAMATSU, Ryuta SONODA, Osamu KAGAYA, Kentaro OKA, Akira SAITO, Kensuke MIYACHI, Akinobu UEDA, Yoshiyuki KAWANO, Jun ANDOU, Taku YAMAZAKI
  • Patent number: 10638548
    Abstract: A window glass for a vehicle includes a glass plate; and a conductor placed on a surface of the glass plate. The conductor includes a conductive film and a strip electrode for applying a DC voltage to the conductive film. The strip electrode is formed to have a gap between the strip electrode and an outer edge of the conductive film, and is positioned between the outer edge of the conductive film and an outer edge of the glass plate in a plan view of the glass plate. The window glass for the vehicle includes a terminal part for electrically connecting the strip electrode to a transmission line.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: April 28, 2020
    Assignee: AGC INC.
    Inventor: Osamu Kagaya
  • Patent number: 10609812
    Abstract: Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance Hi between the pair of strip conductors and the ground conductor layer is twice or more a distance H2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: March 31, 2020
    Assignee: Lumentum Japan, Inc.
    Inventors: Osamu Kagaya, Koyu Takahashi, Yoshikuni Uchida
  • Patent number: 10597001
    Abstract: A plate for an electro-thermal window includes a heatable transparent conductive film, and bus bars that feed power to the transparent conductive film. The bus bars include a left bus bar connected to a left side edge and a right bus bar connected to a right side edge of the transparent conductive film. The transparent conductive film is divided into regions by a slit continuously or discontinuously formed from the left bus bar to the right bus bar. The regions include first and second regions. A distance between the left bus bar and the right bus bar of the first region is shorter than a distance between the left bus bar and the right bus bar of the second region. A width of the first region in a direction orthogonal to the slit is shorter than a width of the second region in the direction.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 24, 2020
    Assignee: AGC Inc.
    Inventors: Osamu Kagaya, Hiromasa Tominaga, Tomohiro Takahashi
  • Publication number: 20200068703
    Abstract: The present invention provides a printed circuit board comprising: a dielectric layer (130) ; N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventor: Osamu KAGAYA
  • Publication number: 20200045808
    Abstract: Provided is a printed circuit board realizing selective inhibition of electromagnetic noise and enabling high-density arrangement of differential transmission lines without increasing cost. The printed circuit board includes a pair of strip conductors (first layer), a first resonance conductor plate, a ground conductive layer (together with a second layer) including an opening portion, a second resonance conductor plate (third layer), a third resonance conductor plate (fourth layer), first via holes connecting the first and second resonance conductor plates, a second via hole connecting the second and third resonance conductor plates, and third via holes connecting the third resonance conductor plate and the ground conductive layer, wherein a polygon obtained by sequentially connecting centers of the adjacent third via holes overlaps so as to include the first resonance conductor plate, and center-to-center distance between the adjacent third via holes is 0.
    Type: Application
    Filed: June 28, 2019
    Publication date: February 6, 2020
    Inventor: Osamu KAGAYA