Abstract: A filter includes: a first acoustic wave filter having acoustic wave filters cascaded, an input stage of the acoustic wave filters including a first multimode filter; a second acoustic wave filter having acoustic wave filters cascaded, an input stage of these acoustic wave filters including a second multimode filter having an aperture length different from that of the first multimode filter, the second acoustic wave filter receiving an unbalanced in signal applied to the first acoustic wave filter, and having a pass band that does not overlap with that of the first acoustic wave filter.

Abstract: A surface acoustic wave device includes a surface acoustic wave resonator. The surface acoustic wave resonator includes comb-like electrodes and reflection electrodes provided on both sides of the comb-like electrodes, and each of the reflection electrodes has at least two different pitches. It is thus possible to suppress the ripple components.

Abstract: A SAW filter includes multiple SAW resonators. The multiple SAW resonators, which are connected in series, are connected any one of between a signal input terminal and a ground that is the closest thereto and between a signal output terminal and another ground that is the closest thereto. The SAW resonators have substantially equal electrostatic capacitances. It is thus possible to protect the SAW resonators without providing a sacrificial electrode for electrostatic breakdown, and thereby possible to configure the SAW filter having a high reliability against the electrostatic discharge.

Abstract: Surface acoustic wave (SAW) filter includes SAW resonators, a discharge induction pattern is provided between a ground and at least one of a signal input terminal and a signal output terminal, and the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators. Since the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators, it is possible to induce the electrostatic discharge without fault. The multiple gaps are provided so as to protect the SAW resonators against multiple times of electrostatic discharge.

Abstract: There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.

Abstract: A filter includes a first filter that is connected between an input node and an output node and is a surface acoustic wave filter, and a second filter that is provided between the input node and the output node and is connected in parallel with the first filter. The first filter has a total number N1 of pairs of electrode fingers of interdigital transducers and the second filter having a total number N2 of pairs of electrode fingers of interdigital transducers, in which N1 is greater than N2.

Abstract: A package for an electronic device includes a cavity that houses an electronic element, and grooves or holes formed on or in sidewalls that define the cavity. The grooves or holes extend from an open side of the cavity so as not to reach a bottom side of the package.

Abstract: A surface acoustic wave (SAW) filter includes a piezoelectric substrate, a first interdigital transducer (IDT) for input and a second IDT for output that are provided on the piezoelectric substrate, the first IDT and the second IDT being arranged in a propagation direction, and a shield electrode arranged between the first IDT and the second IDT and/or between interconnection lines that connect the first IDT and the second IDT, at least one of the first IDT and the second IDT being of a longitudinal coupling multi-mode type having a balanced operation. Thus, it is possible to suppress a stray capacitance between the first IDT and the second IDT, and thereby to improve the symmetry of balanced operation signals.

Abstract: A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.

Abstract: A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The first and second substrates have respective joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.

Abstract: A surface acoustic wave filter capable of obtaining a low insertion loss and wide bandwidth characteristic is provided. The surface acoustic wave filter includes a piezoelectric substrate; a pair of reflective electrodes formed on the piezoelectric substrate; and a plurality of comb electrodes formed between the pair of reflective electrodes on the piezoelectric substrate, wherein, in regard to the neighboring two comb electrodes among the plurality of comb electrodes, an electrode pitch of one comb electrode is set so that continuously varying phases of surface acoustic waves respectively generated by the two comb electrodes are obtained in a gap opposite to an outermost finger electrode of the other neighboring comb electrode.

Abstract: A balanced filter includes a package having an input ground metal pattern and an output ground metal pattern, and a filter chip having an inphase filter and an antiphase filter, which filters are mounted on the package, at least one of the inphase and antiphase filters having an input ground terminal connected to the input ground metal pattern and an output ground terminal connected to the output ground metal pattern, the input and output ground terminals of said at least one of the inphase and antiphase filters being separate from each other on the filter chip.

Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.

Abstract: A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10?12/?·cm to 10?6/?·cm.

Abstract: A surface acoustic wave (SAW) device includes a SAW chip including comb-like electrodes arranged on a piezoelectric substrate, and a package on which the SAW chip is flip-chip mounted, the package including an interconnection that connects the comb-like electrodes. Resonators are connected to signal interconnection pads through the interconnection pattern. IDTs in a three-IDT multimode filter are respectively connected to the signal interconnection pads via another interconnection pattern. The signal interconnection pads are connected to a signal interconnection provided on a chip mounting surface with bumps. Then, a part of the interconnection pattern connecting the resonators is extracted onto the package. It is thus possible to design the interconnections on the package flexibly and thereby easy to adjust the impedance of the interconnections that connect the resonators.

Abstract: A surface acoustic wave apparatus is configured to avoid destruction from static electricity. The surface acoustic wave apparatus includes a piezoelectric substrate; a surface acoustic wave element having at least one interdigital electrode made up of a conductive film on the piezoelectric substrate; and a thin film electrically connected between terminals connecting to electrode fingers of the interdigital electrode, the thin film showing varistor characteristics formed on the piezoelectric substrate.

Abstract: The present invention provides a surface acoustic wave device that allows a plurality of surface acoustic wave filters to be formed on a single chip and permits greater miniaturization. The surface acoustic wave device comprises a piezoelectric substrate, a first surface acoustic wave resonator formed on the piezoelectric substrate, and a second surface acoustic wave resonator formed on the piezoelectric substrate in the surface acoustic wave propagation direction of the first surface acoustic wave resonator. The positions in which the first and second surface acoustic wave resonators are formed on the piezoelectric substrate are in an at least partially overlapping relationship in a surface acoustic wave propagation region that is defined by virtually extending the respective openings of the first and second surface acoustic wave resonators.

Abstract: A surface acoustic wave device includes: interdigital transducers; first electrode pads that are connected to the interdigital transducers through wire patterns; and a piezoelectric substrate on which the interdigital transducers, the first electrode pads, and the wire patterns, are formed. In this surface acoustic wave device, at least one of the first electrode pads is not connected to a ground pattern, and the piezoelectric substrate has a conductivity in the range of 10?12/?·cm to 10?6/?·cm.

Abstract: Efficient transverse energy confinement, and provision of a surface acoustic wave filter having preferable characteristics of both insertion loss and shape factor are obtained. In the surface acoustic wave filter, electrode fingers of one comb electrode are laid in a state of being inserted to the electrode fingers of the other comb electrode, and a thick film thicker than each plurality of electrode fingers is produced in a partial area of the bus bar, and a tip gap is provided between the top of each plurality of electrode fingers and the end face of the opposed bus bar, with a distance therebetween set not greater than 0.2? (where, ? is one period of the comb electrode).

Abstract: A surface acoustic wave device for implementing an attenuation characteristic outside of the pass band and the narrow band characteristics, preferably for use as a filter. The surface acoustic wave device includes a piezoelectric substrate, interdigital transducers formed on the piezoelectric substrate, and first and second reflectors disposed on the sides of the interdigital transducers. Each of the first and second reflectors includes an open electrode block with a plurality of electrically independent electrode fingers, and a short electrode block with a plurality of electrode fingers of which both ends are electrically shorted.