Abstract: The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Abstract: A surface acoustic wave filter capable of obtaining a low insertion loss and wide bandwidth characteristic is provided. The surface acoustic wave filter includes a piezoelectric substrate; a pair of reflective electrodes formed on the piezoelectric substrate; and a plurality of comb electrodes formed between the pair of reflective electrodes on the piezoelectric substrate, wherein, in regard to the neighboring two comb electrodes among the plurality of comb electrodes, an electrode pitch of one comb electrode is set so that continuously varying phases of surface acoustic waves respectively generated by the two comb electrodes are obtained in a gap opposite to an outermost finger electrode of the other neighboring comb electrode.

Abstract: An electronic circuit device includes filters, and a 90-degree hybrid circuit connected to the filters. The 90-degree hybrid circuit may have first and second output terminals. The first terminal of the 90-degree hybrid circuit is connected to an input terminal of one of the filters, and the second terminal thereof is connected to an input terminal of another one of the filters. The 90-degree hybrid circuit may include at least one of phase lines and lumped constant circuit elements.

Abstract: A surface acoustic wave filter capable of obtaining a low insertion loss and wide bandwidth characteristic is provided. The surface acoustic wave filter includes a piezoelectric substrate; a pair of reflective electrodes formed on the piezoelectric substrate; and a plurality of comb electrodes formed between the pair of reflective electrodes on the piezoelectric substrate, wherein, in regard to the neighboring two comb electrodes among the plurality of comb electrodes, an electrode pitch of one comb electrode is set so that continuously varying phases of surface acoustic waves respectively generated by the two comb electrodes are obtained in a gap opposite to an outermost finger electrode of the other neighboring comb electrode.

Abstract: An electronic device includes a package substrate made of an insulator, a device chip that is flip-chip mounted on the package substrate, and a seal portion sealing the device chip. The seal portion includes sidewalls made of solder. The whole seal portion including the sidewalls may be made of solder. The electronic device may include a metal layer provided on the seal portion.

Abstract: A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.

Abstract: The present invention permits further miniaturization and shortening of a surface acoustic wave device while avoiding the influence of the surface acoustic wave device on the inductance value and performance index (Q value) of the spiral inductor. The chip on which the spiral inductor is formed is flip-chip mounted in a package together with another surface acoustic wave device chip. The package is provided with a hermetically sealed lid. A conductor pattern is formed on a face of the package that opposes the spiral inductor. Further, the overlap between the region of the spiral inductor and the conductor pattern is 7% or less.

Abstract: A surface acoustic wave apparatus is configured to avoid destruction from static electricity. The surface acoustic wave apparatus includes a piezoelectric substrate; a surface acoustic wave element having at least one interdigital electrode made up of a conductive film on the piezoelectric substrate; and a thin film electrically connected between terminals connecting to electrode fingers of the interdigital electrode, the thin film showing varistor characteristics formed on the piezoelectric substrate.

Abstract: Improvement on an insertion loss, as well as phase balance, is obtained in surface acoustic wave device.

Abstract: A balanced filter includes a package having an input ground metal pattern and an output ground metal pattern, and a filter chip having an inphase filter and an antiphase filter, which filters are mounted on the package, at least one of the inphase and antiphase filters having an input ground terminal connected to the input ground metal pattern and an output ground terminal connected to the output ground metal pattern, the input and output ground terminals of said at least one of the inphase and antiphase filters being separate from each other on the filter chip.

Abstract: A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.

Abstract: A surface acoustic wave device includes a surface acoustic wave resonator. The surface acoustic wave resonator includes comb-like electrodes and reflection electrodes provided on both sides of the comb-like electrodes, and each of the reflection electrodes has at least two different pitches. It is thus possible to suppress the ripple components.

Abstract: The present invention provides a surface acoustic wave device that allows a plurality of surface acoustic wave filters to be formed on a single chip and permits greater miniaturization. The surface acoustic wave device comprises a piezoelectric substrate, a first surface acoustic wave resonator formed on the piezoelectric substrate, and a second surface acoustic wave resonator formed on the piezoelectric substrate in the surface acoustic wave propagation direction of the first surface acoustic wave resonator. The positions in which the first and second surface acoustic wave resonators are formed on the piezoelectric substrate are in an at least partially overlapping relationship in a surface acoustic wave propagation region that is defined by virtually extending the respective openings of the first and second surface acoustic wave resonators.

Abstract: A surface acoustic wave (SAW) device includes a SAW chip including comb-like electrodes arranged on a piezoelectric substrate, and a package on which the SAW chip is flip-chip mounted, the package including an interconnection that connects the comb-like electrodes. Resonators are connected to signal interconnection pads through the interconnection pattern. IDTs in a three-IDT multimode filter are respectively connected to the signal interconnection pads via another interconnection pattern. The signal interconnection pads are connected to a signal interconnection provided on a chip mounting surface with bumps. Then, a part of the interconnection pattern connecting the resonators is extracted onto the package. It is thus possible to design the interconnections on the package flexibly and thereby easy to adjust the impedance of the interconnections that connect the resonators.

Abstract: A SAW filter includes multiple SAW resonators. The multiple SAW resonators, which are connected in series, are connected any one of between a signal input terminal and a ground that is the closest thereto and between a signal output terminal and another ground that is the closest thereto. The SAW resonators have substantially equal electrostatic capacitances. It is thus possible to protect the SAW resonators without providing a sacrificial electrode for electrostatic breakdown, and thereby possible to configure the SAW filter having a high reliability against the electrostatic discharge.

Abstract: Surface acoustic wave (SAW) filter includes SAW resonators, a discharge induction pattern is provided between a ground and at least one of a signal input terminal and a signal output terminal, and the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators. Since the discharge induction pattern has multiple gaps that are narrower than gaps that exist inside electrode patterns of the SAW resonators, it is possible to induce the electrostatic discharge without fault. The multiple gaps are provided so as to protect the SAW resonators against multiple times of electrostatic discharge.

Abstract: An acoustic wave device includes a device substrate on which electrodes, first terminals, and a first metal seal layer located along an outer periphery are formed, a supporting substrate on which second terminals to be connected to the first terminals, and a second metal seal layer to be joined to the first metal seal layer are formed, and a conductive seal film provided on an outer surface of the device substrate, an outer surface of the first metal seal layer, and an outer surface of the second metal seal layer. The electrodes and the first and second terminals are hermetically sealed with the first and second metal seal layers and the seal film.

Abstract: A surface acoustic wave (SAW) filter includes a piezoelectric substrate, a first interdigital transducer (IDT) for input and a second IDT for output that are provided on the piezoelectric substrate, the first IDT and the second IDT being arranged in a propagation direction, and a shield electrode arranged between the first IDT and the second IDT and/or between interconnection lines that connect the first IDT and the second IDT, at least one of the first IDT and the second IDT being of a longitudinal coupling multi-mode type having a balanced operation. Thus, it is possible to suppress a stray capacitance between the first IDT and the second IDT, and thereby to improve the symmetry of balanced operation signals.

Abstract: Improvement on an insertion loss, as well as phase balance, is obtained in surface acoustic wave device.

Abstract: A surface acoustic wave device includes: a substrate; a pair of reflection electrodes that are formed on the substrate; and drive electrodes that are interposed between the reflection electrodes. In this surface acoustic wave device, the pitches in each of the reflection electrodes vary according to a predetermined variation pattern. With this structure, the suppression on spurious signals and the shape factor (the sharpness of the cut-off region of the pass band) can be improved at the same time.