Abstract: A photonics-electronics convergence switch with which, even if an optical network system is built by combining a plurality of packet switches, the amount of processing in the packet switches does not increase, the optical network system operates with low electric power consumption, and this enables wide-range optical communication between the nodes of a communication origin and of a communication partner, includes a network processor that is an electronic circuit configured to control the functions of the packet switch, a plurality of optical transmitter-receivers having photoelectric conversion functions, and a plurality of optical switches.

Abstract: Provided is a refrigeration apparatus which can reduce outlet pressure of a refrigerator even in overload conditions and which can improve refrigeration capacity by liquefying a refrigerant in an intermediate cooler. When outlet pressure of a refrigerator 2 is higher than critical pressure, a control apparatus 60 performs control to reduce the opening degree of a decompression electric valve 31 at the upstream side of an intermediate cooler 30. Thereby, the refrigerant is liquefied by gas-liquid separation in the intermediate cooler 30, so that the refrigerator outlet pressure is made less than the critical pressure, and the liquid refrigerant can be sent to a showcase 3. As a result, the specific enthalpy of the refrigerant at the inlet side of main diaphragm means 41 of the showcase 3 can be reduced, and thereby, the cooling effect can be increased.

Abstract: An air conditioner having a refrigeration cycle including a compressor, a radiator, a pressure-reducing device and an evaporator, a total heat exchanger for performing heat-exchange between outdoor air and air under cooling operation using the evaporator for a room to be air-conditioned, and for ventilating the room to be air-conditioned, and a desiccant rotor having a moisture adsorbing area for adsorbing moisture in the outdoor air when the outdoor air is introduced, and regenerating the moisture adsorbing area by heat of the radiator, the outdoor air successively flowing through the total heat exchanger, the evaporator and the moisture adsorbing area in this order and then entering the room to be air-conditioned.

Abstract: In a laundry washing/drying machine involving drying by a heat pump cycle, in an initial stage of the drying operation the heat within an air circulation path is deficient and therefore it is impossible to effect quick heating of air on a drum inlet side up to a sufficiently high temperature. According to the present invention there is provided a drying unit capable of raising the drum inlet air temperature quickly up to a sufficiently high temperature in an initial stage of the drying operation and thereby shortening the drying time.

Abstract: A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.

Abstract: An air conditioner having a refrigeration cycle including a compressor, a radiator, a pressure-reducing device and an evaporator, a total heat exchanger for performing heat-exchange between outdoor air and air under cooling operation using the evaporator for a room to be air-conditioned, and for ventilating the room to be air-conditioned, and a desiccant rotor having a moisture adsorbing area for adsorbing moisture in the outdoor air when the outdoor air is introduced, and regenerating the moisture adsorbing area by heat of the radiator, the outdoor air successively flowing through the total heat exchanger, the evaporator and the moisture adsorbing area in this order and then entering the room to be air-conditioned.

Abstract: A semiconductor device includes a semiconductor substrate which has a plurality of semiconductor device formation regions and alignment mark formation region having the same planar size as that of the semiconductor device formation region, a plurality of post electrodes which are formed in each semiconductor device formation region, and an alignment post electrode which is formed in the alignment mark formation region and smaller in number than the post electrodes formed in each semiconductor device formation region.

Abstract: In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.

Abstract: First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped.

Abstract: First, a trench formed in parts of a semiconductor wafer, a sealing film and others corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entirety including the separated silicon substrates from being easily warped.

Abstract: First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped.

Abstract: In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.

Abstract: A multi-stage refrigeration system is provided. The refrigeration system includes a first compression element which produces a first compressed refrigerant stream. A mixer combines the first compressed refrigerant stream with an auxiliary refrigerant stream. A second compression element is coupled to the mixer and produces a second compressed refrigerant stream. A first heat exchanger receives the second compressed refrigerant stream and generates a cooled stream. A stream splitter receives the cooled stream and provides first and second output streams. A first expansion valve receives the first output stream and controls the flow of the first output stream and a second expansion valve receives the second output stream and controls the flow of the second output stream. A second heat exchanger generates the auxiliary refrigerant stream provided to the mixer.

Abstract: A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.

Abstract: In a laundry washing/drying machine involving drying by a heat pump cycle, in an initial stage of the drying operation the heat within an air circulation path is deficient and therefore it is impossible to effect quick heating of air on a drum inlet side up to a sufficiently high temperature. According to the present invention there is provided a drying unit capable of raising the drum inlet air temperature quickly up to a sufficiently high temperature in an initial stage of the drying operation and thereby shortening the drying time.

Abstract: A washing and drying machine has an object to improve a drying efficiency of a laundry and reduce a drying time, and includes an outer drum; an inner drum rotated in this outer drum and having a substantially cylindrical shape to constitute a storage chamber therein; a takeout port which is constituted in one end surface of a cylinder of this inner drum in an axial direction and via which the laundry is to be taken or introduced; a plurality of through holes which are formed around a side surface of the cylinder of the inner drum and in the other end surface of the cylinder in the axial direction and from which water is discharged during the washing and through which circulation air for drying circulates during the drying; and a blowing regulation unit which blows the air for drying into the storage chamber from the side of one end or the other end of the cylinder of the inner drum in the axial direction and which allows the air to flow from the through holes on the other end side or from the one end side and

Abstract: A semiconductor device includes a semiconductor substrate which has a plurality of semiconductor device formation regions and alignment mark formation region having the same planar size as that of the semiconductor device formation region, a plurality of post electrodes which are formed in each semiconductor device formation region, and an alignment post electrode which is formed in the alignment mark formation region and smaller in number than the post electrodes formed in each semiconductor device formation region.

Abstract: A heat pump apparatus that having a refrigerating cycle including a compressor, a gas cooler, a pressure reducing device and an evaporator and is designed so that water can be heated by the gas cooler. A refrigerant such as CO2 or the like working in a supercritical area is filled and used at a high-pressure side in the refrigerating cycle and a radiator is equipped between the exit of the gas cooler and the pressure reducing device. The refrigerant temperature at the exit of the radiator is kept at a substantially fixed temperature irrespective of the temperature of hot water to the gas cooler.

Abstract: A multi-stage refrigeration system is provided. The refrigeration system includes a first compression element which produces a first compressed refrigerant stream. A mixer combines the first compressed refrigerant stream with an auxiliary refrigerant stream. A second compression element is coupled to the mixer and produces a second compressed refrigerant stream. A first heat exchanger receives the second compressed refrigerant stream and generates a cooled stream. A stream splitter receives the cooled stream and provides first and second output streams. A first expansion valve receives the first output stream and controls the flow of the first output stream and a second expansion valve receives the second output stream and controls the flow of the second output stream. A second heat exchanger generates the auxiliary refrigerant stream provided to the mixer.

Abstract: The present invention concerns an on-vehicle air-conditioner, resolving problems of the prior art, and allowing to perform cooling, heating, dehumidification or others efficiently even for vehicles of low waste heat, such as hybrid cars taking electricity and gasoline as energy source, idle stop coping cars or battery cars taking only electricity as energy source, or other vehicles, by cooling by loading a refrigeration circuit, using for example CO2 refrigerant, and provided with an electrically driven two-stage compression system compressor, and at the same time, installing a refrigerant heat exchanger for cooling the refrigerant, compressed in the first stage in a way to exchange heat with the car interior air, and using conveniently also for heating together with the heat of the cooling water for cooling the engine.