Abstract: The present invention concerns an on-vehicle air-conditioner, resolving problems of the prior art, and allowing to perform cooling, heating, dehumidification or others efficiently even for vehicles of low waste heat, such as hybrid cars taking electricity and gasoline as energy source, idle stop coping cars or battery cars taking only electricity as energy source, or other vehicles, by cooling by loading a refrigeration circuit, using for example CO2 refrigerant, and provided with an electrically driven two-stage compression system compressor, and at the same time, installing a refrigerant heat exchanger for cooling the refrigerant, compressed in the first stage in a way to exchange heat with the car interior air, and using conveniently also for heating together with the heat of the cooling water for cooling the engine.

Abstract: A semiconductor device includes a semiconductor substrate which has a plurality of semiconductor device formation regions and alignment mark formation region having the same planar size as that of the semiconductor device formation region, a plurality of post electrodes which are formed in each semiconductor device formation region, and an alignment post electrode which is formed in the alignment mark formation region and smaller in number than the post electrodes formed in each semiconductor device formation region.

Abstract: In a heat pump apparatus that having a refrigerating cycle including a compressor 1, a gas cooler 3, a pressure reducing device 5 and an evaporator 7 and is designed so that water can be heated by the gas cooler, refrigerant such as CO2 or the like working in a supercritical area is filled and used at a high-pressure side in the refrigerating cycle and a radiator 21 is equipped between the exit of the gas cooler and the pressure reducing device. The refrigerant temperature at the exit of the radiator is kept to a substantially fixed temperature irrespective of the temperature of hot water to the gas cooler.

Abstract: The present invention concerns an on-vehicle air-conditioner, resolving problems of the prior art, and allowing to perform cooling, heating, dehumidification or others efficiently even for vehicles of low waste heat, such as hybrid cars taking electricity and gasoline as energy source, idle stop coping cars or battery cars taking only electricity as energy source, or other vehicles, by cooling by loading a refrigeration circuit, using for example CO2 refrigerant, and provided with an electrically driven two-stage compression system compressor, and at the same time, installing a refrigerant heat exchanger for cooling the refrigerant, compressed in the first stage in a way to exchange heat with the car interior air, and using conveniently also for heating together with the heat of the cooling water for cooling the engine.

Abstract: The back surface of a semiconductor wafer having a plurality of chip-forming regions each provided with a plurality of connection pads on the surface is bonded to a dicing tape, followed by fully cutting the semiconductor wafer along a cut line so as to form a cutting groove. Then, a front side protective film is formed on the front surface. The front side protective film has an open portion exposing the central portion of the connection pad, and is filled in the cutting groove. After formation of a columnar electrode connected to the connection pad via a wiring, a sealing film is formed on the front side protective film. Further, the cutting groove filled with the front side protective film is cut in substantially the center in the width direction, followed by peeling off the dicing tape so as to form individual semiconductor devices each forming a chip.

Abstract: A heat pump type hot water supply apparatus (10) for heating water by refrigerant heat and stocking the hot water thus achieved including: a heat pump unit (11) having a refrigerant circuit using natural refrigerant, the refrigerant circuit including a compressor (16) for compressing refrigerant, a heat-pump heat exchanger (18) and a refrigerant-water heat exchanger (27) for performing the heat exchange between refrigerant and water to achieve hot water; a hot water supply unit (12) including a hot water supply tank (26) for stocking the hot water achieved by the refrigerant-water heat exchanger (27) of the heat pump unit (11) and supplying the hot water thus stocked; and a water pipe (36) through which the refrigerant-water heat exchanger (27) of the heat pump unit (11) and the hot water supply tank (26) of the hot water supply unit (12) are connected to each other to circulate hot-water/water between the refrigerant-water heat exchanger (27) and said hot water supply tank (26).

Abstract: A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on the lower surface of the base film, on the bump electrodes, followed by allowing the bump electrodes to project through the sealing film under pressure and heat. The thickness of the sealing film is smaller than the height of the bump electrode, and thus the bump electrode projects through the sealing film. Particles for lowering the thermal expansion coefficient are dispersed in the sealing film to allow the sealing layers to exhibit a thermal expansion coefficient differing in its thickness direction such that the thermal expansion coefficient in the layer which is close to the semiconductor substrate is close to that of the semiconductor substrate.

Abstract: A sealing film is formed by a screen printing method. In this case, the temperature of the printing table is set at about 30 to 50° C. by the heat generation from a planar heater arranged within the printing table. A liquid sealing resin having a relatively high viscosity of about 500,000 to 1,500,000 cPS is used for forming the sealing film. However, the liquid sealing film is warmed by the printing table to about 30 to 50° C. As a result, the viscosity of the liquid sealing resin is lowered to about 50,000 to 200,000 cPS. After the curing, the viscosity of the sealing film is brought back to the original value of about 500,000 to 1,500,000 cPS.

Abstract: A heat pump type hot water supply apparatus (10) for heating water by refrigerant heat and stocking the hot water thus achieved including: a heat pump unit (11) having a refrigerant circuit using natural refrigerant, the refrigerant circuit including a compressor (16) for compressing refrigerant, a heat-pump heat exchanger (18) and a refrigerant-water heat exchanger (27) for performing the heat exchange between refrigerant and water to achieve hot water; a hot water supply unit (12) including a hot water supply tank (26) for stocking the hot water achieved by the refrigerant-water heat exchanger (27) of the heat pump unit (11) and supplying the hot water thus stocked; and a water pipe (36) through which the refrigerant-water heat exchanger (27) of the heat pump unit (11) and the hot water supply tank (26) of the hot water supply unit (12) are connected to each other to circulate hot-water/water between the refrigerant-water heat exchanger (27) and said hot water supply tank (26).

Abstract: A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The semiconductor device is mounted to another circuit substrate via the bump electrodes. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on the lower surface of the base film, on the bump electrodes, followed by allowing the bump electrodes to project through the sealing film under pressure and heat. The thickness of the sealing film is smaller than the height of the bump electrode, and thus the bump electrode projects through the sealing film. The stress derived from the difference in thermal expansion coefficient between the semiconductor substrate and the circuit substrate is absorbed by the projecting portion of the bump electrode.

Abstract: The back surface of a semiconductor wafer having a plurality of chip-forming regions each provided with a plurality of connection pads on the surface is bonded to a dicing tape, followed by fully cutting the semiconductor wafer along a cut line so as to form a cutting groove. Then, a front side protective film is formed on the front surface. The front side protective film has an open portion exposing the central portion of the connection pad, and is filled in the cutting groove. After formation of a columnar electrode connected to the connection pad via a wiring, a sealing film is formed on the front side protective film. Further, the cutting groove filled with the front side protective film is cut in substantially the center in the width direction, followed by peeling off the dicing tape so as to form individual semiconductor devices each forming a chip.

Abstract: A resin sealing film is formed on a silicon substrate by using a printing mask and a squeegee. The side surface in the tip portion of the squeegee is substantially V-shaped, and the printing is performed by pushing the tip portion of the squeegee into the gap between adjacent bump electrodes. As a result, the sealing film is formed in a manner to be depressed in the region between adjacent bump electrodes so as to facilitate the swinging movement of the bump electrodes. It follows that, in a temperature cycle test performed after the silicon substrate is mounted to a circuit substrate, the stress derived from the difference in thermal expansion coefficient between the silicon substrate and the circuit substrate is absorbed by the bump electrode.

Abstract: This application discloses a film wiring board for directly mounting an electronic parts such as an IC chip, on which a protective film having an opening can be formed in one step by a screen printing. This film wiring board has wiring patterns including connection pads and lead wires. Connection electrodes of the IC chip are connected to the connection pads via soldering bumps. Since the width of each of the lead wires is comparatively small at 10 .mu.m-30 .mu.m, the once molten solder when the connection is done is kept on the corresponding connection pad by the surface tension and is prevented from flowing from the connection pad to the corresponding lead wire. Therefore, since the opening of the protective film need not have a function for stopping the flow of the solder, there may be no problem if the opening is comparatively enlarged.

Abstract: An X-ray exposure apparatus comprises an X-ray beam generating source and an exposure apparatus body including an alignment optical system. The exposure apparatus body is set independently from the X-ray beam generating source and the exposure apparatus body is located to be swingable wtih respect to the base such as a floor, through the elastic member. Thereafter, the exposure apparatus body is raised by a raising mechanism, for example, comprising a plurality of vertically expandable air cushions, in a floating manner. A height position and an inclination of the exposure apparatus body are adjusted by controlling the raising mechanism individually so that the axis of the X-ray beam generated from the X-ray source substantially coincides with the optical axis as measurement reference of the alignment optical system. The exposure apparatus body is then secured to this adjusted position by means of the securing mechanism comprising adjusting bolts and clamping bolts, for example.

Abstract: A thermal print head includes a plurality of selective electrodes formed on a substrate, a common electrode formed on the substrate at a distance from the selective electrodes, and a fiber mounted on the substrate at a position between the common electrode and the selective electrodes. The fiber projects higher than the top surfaces of the common and selective electrodes, and is fixed to the substrate by an adhesive having a top surface which is upwardly inclined toward the fiber. Heat resistive films overlay the fiber and adhesive and electrically connect the selective electrodes to the common electrode.

Abstract: An X-ray radiation apparatus comprises a synchrotron 11 that generates X rays, an X-ray reflecting mirror 13 that reflects X rays emitted from the synchrotron 11, a mirror driving mechanism that enlarges the X-ray illumination area by oscillating the mirror 13, a beryllium window 14 that is connected to the synchrotron-side housing base containing the mirror 13 by means of a bellows 17 and that allows the X rays reflected by the mirror 13 to be taken out of the vacuum environment, and a window driving mechanism 18 that moves the window 14 along with the movement of the X-ray illumination position by oscillating the window 14 in synchronization with the oscillation of the mirror 13. With this arrangement, the X rays coming from the window 14 pass through the X-ray mask 15 and fall upon the specimen 16 to replicate the mask pattern into the specimen.

Abstract: A bonding structure and a bonding method for connecting an IC unit having an insulating sheet to connecting terminals arranged on a substrate. The insulating sheet has an elongated opening which is formed along one side of said insulating sheet and has on its one surface a plurality of conductive metal leads adhered thereto which stretch over the elongated opening. Portions of the metal leads which stretch over the elongated opening are solder-plated to serve as connecting portions. The connecting portions of the metal leads are heated and pressed into the opening with use of a heat-pressing head which has a width narrower than the opening, thereby being soldered to the connecting terminals. The metal lead is formed with inclined parts at its positions corresponding to both sides of the portion depressed by the heat-pressing head and solder pools are formed between the inclined parts and the connecting terminals.

Abstract: A distance between a mask and a wafer is set such that exposure light beams emerged from the mask are converged by the projection lens to be focused on the wafer. Two light beams with same wavelength of the alignment light beam emerge from a first point (b) which is located far away from the mask, and are focused on the wafer or neighborhood of it by the projection lens. Two mask marks of diffraction gratings are formed on the mask and spaced at a predetermined distance from each other. When the alignment light beams are applied to the mask marks, two diffracted light beams of predetermined order emerge individually from the mask marks in such a manner that the respective optical axes of the two diffracted light beams, which are directed oppositely to of the diffracted light beams, intersect each other on the first point. Thus, the diffracted light beams advance as if the diffracted light beams were the two light beams emerging from the first point.

Abstract: A distance between a mask and a wafer is set such that exposure light beams emerged from the mask are converged by the projection lens to be focused on the wafer. According to the present invention, two mask marks of diffraction gratings are formed on the mask and spaced at a predetermined distance from each other. When the alignment light beams are applied to the mask marks, two diffracted light beams of predetermined order emerge individually from the mask marks in such a manner that the respective optical axes of the two diffracted light beams, which are directed opposite to the advancing direction of the diffracted light beams, intersect each other one the first point. Thus, the diffracted light beams advance as if the diffracted light beams were the two light beams emerging from the first point. Therefore, the two diffracted light beams can be focused on the wafer or neighborhood of it. The diffracted light beams can be incident on a wafer mark which is formed on the wafer and is diffraction grating.

Abstract: A denture base contains an elastic support for supporting at least one artificial tooth and fittings fixed to the elastic support for removably positioning the denture base. The elastic support is made of a hydrogel prepared by a process comprising a casting step of casting into a mold an aqueous solution containing more than 5 wt % and not more than 40 wt % of a polyvinyl alcohol having a degree of hydrolysis of not less than 95 mol % and an average polymerization degree of not less than 700, a freezing step of cooling the cast aqueous solution to a temperature of not higher than - (minus) 10.degree. C. to obtain a frozen mass, a thawing step of thawing the frozen mass, and one to seven additional cyclic processing steps each including the freezing and thawing steps.