Abstract: A semiconductor device having a transistor and a rectifier includes: a current path; a first main electrode having a rectifying function and arranged on one end of the current path; a second main electrode arranged on the other end of the current path; an auxiliary electrode arranged in a region of the current path between the first main electrode and the second main electrode; a third main electrode arranged on the one end of the current path apart from the first main electrode along a direction intersecting the current path; and a control electrode arranged in a region of the current path between the second main electrode and the third main electrode. The transistor includes the current path, the second main electrode, the third main electrode, and the control electrode. The rectifier includes the current path, the first main electrode, the second main electrode, and the auxiliary electrode.

Abstract: A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, receiving DC power from the DC power source via the first die pad, and having a terminal opposite to the first die pad connected to a first output terminal, and a second switching element provided on the second die pad, receiving the DC power from the DC power source via the second die pad, and connected to the first output terminal, and having a terminal opposite to the second die pad.

Abstract: To provide a semiconductor device in which a rectifying element capable of reducing a leak current in reverse bias when a high voltage is applied and reducing a forward voltage drop Vf and a transistor element are integrally formed on a single substrate. A semiconductor device has a transistor element and a rectifying element on a single substrate. The transistor element has an active layer formed on the substrate and three electrodes (source electrode, drain electrode, and gate electrode) disposed on the active layer. The rectifying element has an anode electrode disposed on the active layer, a cathode electrode which is the drain electrode, and a first auxiliary electrode between the anode electrode and cathode electrode.

Abstract: A switch device comprised of a wide band gap semiconductor is provided. The switch device comprises a drain, a source, a gate and a gate voltage clamp circuit, which is connected between a signal terminal, to which a signal for driving the gate is input, and the gate through a series circuit of a capacitor and a resistance, and which comprises a diode and a voltage limiter circuit provided between the drain and the gate.

Abstract: A sol-gel liquid for use in forming an individualized electromechanical conversion film of an electromechanical conversion element by inkjet methods, including a lead zirconate titanate (PZT) or the PZT and other metal complex oxides; and an organic solvent having properties surrounded by A, B, C, D, E and F in triangular composition diagram of FIG. 3, and having a viscosity of from 3 to 13 mPa·s, a surface tension of 30±5 mN/m and a dehydration rate of from 70 to 80% relative to pure water.

Abstract: A method for manufacturing an electromechanical transducer film including a lower electrode and plural layers of a sol-gel solution film formed on the lower electrode by an inkjet method, the method including the steps of a) modifying a surface of the lower electrode, b) forming a first sol-gel solution film on the surface of the lower electrode by ejecting droplets of a sol-gel solution to the surface of the lower electrode, and c) forming a second sol-gel solution film on the first sol-gel solution film by ejecting droplets of the sol-gel solution to a surface of the first sol-gel solution film. Adjacent dots formed on the surface of the lower electrode by the droplets ejected in step b) overlap each other. Adjacent dots formed on the surface of the first sol-gel solution film by the droplets ejected in step c) do not overlap each other.

Abstract: A main semiconductor region grown on a substrate has formed on its surface a pair of main electrodes spaced from each other, a gate electrode between the main electrodes, and a pair of diode-forming electrodes spaced farther away from the gate electrode than are the main electrodes. Making ohmic contact with the main semiconductor region, the pair of main electrodes serve both as drain or source of a HEMT switch and as cathodes of a pair of Schottky diodes integrated with the HEMT switch. Both gate electrode and diode-forming electrodes are in Schottky contact with the main semiconductor region.

Abstract: A monolithic switching device including a main semiconductor region configured to provide a current-carrying channel as in the form of two-dimensional electron gas. Disposed symmetrically on a surface of the main semiconductor region are two main electrodes to be coupled to an electric circuit for switching control, two gate electrodes for individually controlling current flow between the main electrodes through the current-carrying channel, and two diode-forming electrodes electrically connected respectively to the two main electrodes. The device operates in either Switch On Mode, Switch Off Mode, Negative Current Mode, or Positive Current Mode depending upon voltages applied to the two gate electrodes.

Abstract: A semiconductor device having a GaN-based main semiconductor region formed on a silicon substrate via a buffer region. Source, drain and gate electrodes are formed on the main semiconductor region, and a back electrode on the back of the substrate. The substrate is constituted of two semiconductor regions of opposite conductivity types, with a pn junction therebetween which is conducive to a higher voltage-withstanding capability between the drain and back electrodes.

Abstract: A device capable of bidirectional on-off switching control of an electric circuit. Included is a normally-on HEMT connected between a pair of terminals of the device. A normally-off MOSFET of relatively low antivoltage strength is connected between the HEMT and one of the pair of terminals, and another similar MOSFET between the HEMT and the other of the terminal pair. A diode is connected in inverse parallel with each MOSFET, and two other diodes are connected between the gate of the HEMT and the pair of terminals respectively. The switching device as a whole is normally off.

Abstract: A silicon-made low-forward-voltage Schottky barrier diode is serially combined with a high-antivoltage-strength high-electron-mobility transistor made from a nitride semiconductor that is wider in bandgap than silicon. The Schottky barrier diode has its anode connected to the gate, and its cathode to the source, of the HEMT. This HEMT is normally on. The reverse voltage withstanding capability of the complete device depends upon that between the drain and gate of the HEMT.

Abstract: In a method of manufacturing an inkjet head, a silicon dioxide (SiO2) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO2) layer. A silicon oxide (SiOx, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO2) layer is formed at the interface of the glass layer and silicon oxide (SiOx, x<2) layer, anodically bonding the two layers.

Abstract: An aspect of the present invention inheres in a semiconductor device includes a semiconductor region, a source electrode and a drain electrode, which are provided on a main surface of the semiconductor region, a gate electrode exhibiting normally-off characteristics, the gate electrode being provided above the main surface of the semiconductor region while interposing a p-type material film therebetween, and being arranged between the source electrode and the drain electrode, and a fourth electrode that is provided on the main surface of the semiconductor region, and is arranged between the gate electrode and the drain electrode.

Abstract: A high electron mobility transistor is disclosed which has a main semiconductor region formed on a silicon substrate. The main semiconductor region is a lamination of a buffer layer on the substrate, an electron transit layer on the buffer layer, and an electron supply layer on the electron transit layer. A source, drain, and gate overlie the electron supply layer. Also formed on the electron supply layer is a surface-stabilizing organic semiconductor overlay which is of p conductivity type in contrast to the n type of the electron supply layer.

Abstract: In a method of manufacturing an inkjet head, a silicon dioxide (SiO2) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO2) layer. A silicon oxide (SiOx, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO2) layer is formed at the interface of the glass layer and silicon oxide (SiOx, x<2) layer, anodically bonding the two layers.

Abstract: To coat a solution on both surfaces continuously in such a state that an edge portion of the substrate is so constructed as to be fixed, and the substrate is attached to a substrate fixing frame having a positioning mechanism.

Abstract: A monolithic switching device including a main semiconductor region configured to provide a current-carrying channel as in the form of two-dimensional electron gas. Disposed symmetrically on a surface of the main semiconductor region are two main electrodes to be coupled to an electric circuit for switching control, two gate electrodes for individually controlling current flow between the main electrodes through the current-carrying channel, and two diode-forming electrodes electrically connected respectively to the two main electrodes. The device operates in either Switch On Mode, Switch Off Mode, Negative Current Mode, or Positive Current Mode depending upon voltages applied to the two gate electrodes.

Abstract: A device capable of bidirectional on-off switching control of an electric circuit. Included is a normally-on HEMT connected between a pair of terminals of the device. A normally-off MOSFET of relatively low antivoltage strength is connected between the HEMT and one of the pair of terminals, and another similar MOSFET between the HEMT and the other of the terminal pair. A diode is connected in inverse parallel with each MOSFET, and two other diodes are connected between the gate of the HEMT and the pair of terminals respectively. The switching device as a whole is normally off.

Abstract: A main semiconductor region grown on a substrate has formed on its surface a pair of main electrodes spaced from each other, a gate electrode between the main electrodes, and a pair of diode-forming electrodes spaced farther away from the gate electrode than are the main electrodes. Making ohmic contact with the main semiconductor region, the pair of main electrodes serve both as drain or source of a HEMT switch and as cathodes of a pair of Schottky diodes integrated with the HEMT switch. Both gate electrode and diode-forming electrodes are in Schottky contact with the main semiconductor region.

Abstract: In a method of manufacturing an inkjet head, a silicon dioxide (SiO2) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO2) layer. A silicon oxide (SiOx, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO2) layer is formed at the interface of the glass layer and silicon oxide (SiOx, x<2) layer, anodically bonding the two layers.