Abstract: A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface formed with a metal bump projected therefrom and which is bonded to the connection surface of the solid device as directing its functional surface to the connection surface and maintaining a predetermined distance between the functional surface and the connection surface; and a connecting member containing a low melting point metal having a lower solidus temperature than that of the connection electrode and the bump, and interconnecting the connection electrode and the bump. A sum of a height of the connection electrode and a height of the bump is not less than a half of the predetermined distance.

Abstract: The invention provides a wiring board (2,15) to which a semiconductor chip (3) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode (14) that is formed on a bonding surface (2a, 15a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film (6) that is formed on the bonding surface and that has an opening (6a) to expose the connection electrode, and a low-melting-point metallic part (16) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.

Abstract: A semiconductor chip according to the present invention is a semiconductor chip having a circuit forming region, in which an internal circuit including a function element is formed, on the middle portion of the surface thereof, and having the surface thereof opposed to and joined to the surface of a solid-state device.

Abstract: A lighting lamp 1 using LED lamps as a light source can include a delay circuit 5, a power supply control unit 6, and a timer circuit 7. The delay circuit 5 can be configured to cause the luminous intensity of the LED lamps to rise along a predetermined slope upon turning on the lighting lamp. The power supply control unit and the timer circuit can be configured to cause the luminous intensity of the LED lamps to fall along a predetermined slope which has an inflection point P at a predetermined time point along the slope.

Abstract: A method of fabricating a lead frame for a semiconductor device having a semiconductor chip resin-sealed therein. The lead frame includes a lead to be electrically connected to the semiconductor chip within sealing resin and to be sealed into the sealing resin such that at least a part of its mounting surface is exposed from the sealing resin. The method includes a lead forming step for forming the lead, and a side edge coining step for subjecting a side edge of a sealed surface, which is a surface on the opposite side of the mounting surface, of the lead to coining processing from the side of the sealed surface, to form a slipping preventing portion. The slipping preventing portion is to project sideward from the lead and to have a slipping preventing surface between the mounting surface and the sealed surface of the lead.

Abstract: A semiconductor device provided with a first semiconductor chip having a first functional surface formed with a first functional element and a first rear surface, a second semiconductor chip having a second functional surface which is formed with a second functional element, the second functional surface having a region opposed to the first functional surface of the first semiconductor chip and a non-opposed region defined outside the opposed region, a connection member electrically connecting the first functional element and the second functional element, an insulation film continuously covering the non-opposed region of the second semiconductor chip and the first rear surface of the first semiconductor chip, a rewiring layer provided on a surface of the insulation film, a protective resin layer covering the rewiring layer, and an external connection terminal projecting from the rewiring layer through the protective resin layer.

Abstract: A method of fabricating a lead frame for a semiconductor device having a semiconductor chip resin-sealed therein. The lead frame includes a lead to be electrically connected to the semiconductor chip within sealing resin and to be sealed into the sealing resin such that at least a part of its mounting surface is exposed from the sealing resin. The method includes a lead forming step for forming the lead, and a side edge coining step for subjecting a side edge of a sealed surface, which is a surface on the opposite side of the mounting surface, of the lead to coining processing from the side of the sealed surface, to form a slipping preventing portion. The slipping preventing portion is to project sideward from the lead and to have a slipping preventing surface between the mounting surface and the sealed surface of the lead.

Abstract: A packaging substrate according to the present invention is a packaging substrate to which a semiconductor chip having a plurality of connection metal bodies on a surface thereof is bonded with the surface opposed to the packaging substrate and comprises a wiring provided on a bonding surface to which the semiconductor chip is bonded, a plurality of electrode parts provided on the bonding surface and electrically connected to the wiring, a wiring protective layer for coating and protecting the wiring, electrode openings formed by partly opening the wiring protective layer for separately exposing each of the electrode parts from the wiring protective layer, and escape openings each formed in continuation with each of the electrode openings in the wiring protective layer for introducing therein a part of the connection metal body to be connected to each of the electrode parts to escape.

Abstract: A method of fabricating a lead frame for a semiconductor device having a semiconductor chip resin-sealed therein. The lead frame includes a lead to be electrically connected to the semiconductor chip within sealing resin and to be sealed into the sealing resin such that at least a part of its mounting surface is exposed from the sealing resin. The method includes a lead forming step for forming the lead, and a side edge coining step for subjecting a side edge of a sealed surface, which is a surface on the opposite side of the mounting surface, of the lead to coining processing from the side of the sealed surface, to form a slipping preventing portion. The slipping preventing portion is to project sideward from the lead and to have a slipping preventing surface between the mounting surface and the sealed surface of the lead.

Abstract: A semiconductor device includes a substrate, and the substrate is, on its surface, formed with wiring patterns onto which a resist is formed. Because an outer peripheral edge line of the resist passes over througholes, the outer peripheral edge line of the resist never comes close to the wiring patterns and be in parallel thereto. Specifically, since the plurality of througholes are arranged in a matrix fashion on the substrate, a direction to which each of the wiring patterns extends from each of the througholes is sure to form a predetermined angle with respect to a direction that the througholes are aligned. Accordingly, even if an outer periphery edge portion of the resist which passes over the througholes flows into an outside thereof, a thin film of the resist is not formed in a long thin shape, and a plating film is not formed in a long thin shape on the thin film.

Abstract: An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate, and a protective member (4) bonded to the substrate (1) to cover the IC chip (2). A clearance (S) is provided between the protective member (4) and the IC chip (2) for avoiding direct contact of the protective member (4) with the IC chip (2). The clearance (S) is loaded with a filler (6) having a low modulus of elasticity, as required. The protective member (4) includes a reinforcing member (8).

Abstract: A semiconductor device includes a substrate, and the substrate is formed with a wiring pattern on its surface. The wiring pattern includes electrodes, wire-bonding (WB) pads and connecting portions for connecting the electrodes and the WB pads. The WB pads are so formed that the lengthwise directions thereof are in parallel or approximately in parallel to lines, in radiative form, extending from the center of a die-bonding (DB) area. Accordingly, if a chip having a first size is die-bonded within the DB area, bonding wires become approximately in parallel to the lengthwise directions of the WB pads. Even if a chip having a second size smaller than the first size but the same shape is die-bonded, the bonding wires are also in parallel to the lengthwise directions of the WB pads. Thus, since one substrate can be used regardless of the size of a chip, there is no need to prepare a plurality of wiring patterns for each size of chips.

Abstract: The objectives of the present invention is to provide smaller, lighter and less expensive structure in a starting device for discharge lamp for car use so as to prevent breakage due to vibrations etc. The device having the following arrangement realizes the above-mentioned objective. A starting device for a discharge lamp comprises a socket for mounting the discharge lamp and starting members such as a starting transformer etc. where the starting transformer comprises a bobbin having a core-less structure and a primary coil and a secondary coil wound around the bobbin.

Abstract: A vehicle discharge lighting unit can include a bulb mounting slot provided in a resin base. The mounting slot has a channel diameter that fits with an outer bulb of a lamp. A flange can be provided for mounting the resin base to a reflector. A burner band mounting section of the base can extend towards the lamp along a discharge chamber direction and project within the reflector. The driver case can also be separated into a front case and a rear case. The resin base and the driver case can therefore be most appropriately shaped while also having improved dielectric strength. When either of the base or the driver case is defective, only the part that is defective needs to be replaced.

Abstract: A semiconductor device includes first and second semiconductor chips. The first semiconductor chip is formed with a plurality of first electrodes on a surface thereof, while the second semiconductor chip is formed with a plurality of second electrodes on a surface thereof. These surfaces are positioned facing to each other, thereby connecting between the first electrode and the second electrode. The respective surfaces are formed with circuit elements. The circuit elements are covered by the first semiconductor chip and the second semiconductor chip The first semiconductor chip and the second semiconductor chip at their connecting portions are encapsulated by a synthetic resin that is excellent in moisture resistance. The first semiconductor chip and the second semiconductor chip are entirely packaged by a second synthetic resin that is excellent in adhesibility.

Abstract: A semiconductor device includes a substrate, and the substrate is, on its surface, formed with wiring patterns onto which a resist is formed. Because an outer peripheral edge line of the resist passes over througholes, the outer peripheral edge line of the resist never comes close to the wiring patterns and be in parallel thereto. Specifically, since the plurality of througholes are arranged in a matrix fashion on the substrate, a direction to which each of the wiring patterns extends from each of the througholes is sure to form a predetermined angle with respect to a direction that the througholes are aligned. Accordingly, even if an outer periphery edge portion of the resist which passes over the throuholes flows into an outside thereof, a thin film of the resist is not formed in a long thin shape, and a plating film is not formed in a long thin shape on the thin film.

Abstract: One of the objectives of the present invention are to provide smaller, lighter and less expensive structure in a starting device for discharge lamp for car use so as to prevent breakage due to vibrations etc . . . And another objective is to attain simultaneous electrical and structural connections between a high voltage electrode and a coil of a starting transformer. The device having the following constitution realizes the above-mentioned objectives. A starting device for a discharge lamp comprises a socket equipped with a high voltage electrode and a grounding electrode, a bobbin with a core-less structure, a starting transformer comprising a primary coil and a secondary coil wound around the bobbin. A screw electrode is arranged at the center of the end face of the bobbin. One end of the screw electrode is connected to an output terminal of the high voltage side of the secondary coil on the starting transformer.

Abstract: A semiconductor device includes a substrate, and the substrate is formed with a wiring pattern on its surface. The wiring pattern includes electrodes, wire-bonding (WB) pads and connecting portions for connecting the electrodes and the WB pads. The WB pads are so formed that the lengthwise directions thereof are in parallel or approximately in parallel to lines, in radiative form, extending from the center of a die-bonding (DB) area. Accordingly, if a chip having a first size is die-bonded within the DB area, bonding wires become approximately in parallel to the lengthwise directions of the WB pads. Even if a chip having a second size smaller than the first size but the same shape is die-bonded, the bonding wires are also in parallel to the lengthwise directions of the WB pads. Thus, since one substrate can be used regardless of the size of a chip, there is no need to prepare a plurality of wiring patterns for each size of chips.

Abstract: In the method of manufacturing an IC module (1) including a resin packaging process using upper and lower dies (5) for forming a cavity (50) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (2) on which an IC chip (3) is placed and a coil (20A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (50). When a substrate (2) on which an antenna coil (20) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (28) having an equal and almost equal height to the height of the cavity (50) on the substrate (2), housing it in the cavity (50), and introducing a melted resin. Instead of forming the spacer (28) on the substrate (2), a substrate (2) housed in a cavity (50) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.

Abstract: The objectives of the present invention is to provide smaller, lighter and less expensive structure in a starting device for discharge lamp for car use so as to prevent breakage due to vibrations etc. The device having the following arrangement realizes the above-mentioned objective. A starting device for a discharge lamp comprises a socket for mounting the discharge lamp and starting members such as a starting transformer etc. where the starting transformer comprises a bobbin having a core-less structure and a primary coil and a secondary coil wound around the bobbin.