Abstract: A connector housing includes a hole having a minimum size that a lead section of a connector terminal to penetrate, and a guide wall which is formed along an outer peripheral of the hole, and is protruded in a direction which a lead section protrudes from the connector housing to a bending section of the lead section, wherein, by which inner walls of the guide wall is mutually and directly in contact with side surfaces of the lead section over a height near a top end side of the lead section in a bending section of the lead section from an outer peripheral of the hole, a sealing structure is formed from the bending section of the lead section to an interior of the connector housing.

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Abstract: A connector housing includes a hole having a minimum size that a lead section of a connector terminal to penetrate, and a guide wall which is formed along an outer peripheral of the hole, and is protruded in a direction which a lead section protrudes from the connector housing to a bending section of the lead section, wherein, by which inner walls of the guide wall is mutually and directly in contact with side surfaces of the lead section over a height near a top end side of the lead section in a bending section of the lead section from an outer peripheral of the hole, a sealing structure is formed from the bending section of the lead section to an interior of the connector housing.

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Abstract: [Problem] To provide a file management system and file management method that are able to perform a backup process efficiently by means of a configuration that uses a virtual file system metadatabase from a backup process side also. [Solution] The file management system is provided with a virtual drive controller (110) that controls a virtual drive (5), a metadatabase (210) that contains information for associating a virtual file and a physical file that is saved in a storage device (6), a backup controller (120) that manages the backup process of a file, and a backup status management database (220) used in backup process management. The virtual drive controller (110) registers updated file information in the backup status management database (220). The backup controller (120) references the backup status management database (220) and the metadatabase (210), and backs up the file.

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract: There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

Abstract: A motor controller and a production method thereof are provided to be capable of lowering the stress applied to joint parts of terminals and a board as much as possible, even if a thermal load or external force is applied to the connector, and in addition, capable of achieving a sufficient coupling strength when arranged in proximity to the electric motor. In the motor controller, there are provided: a first securing section (56a) and a second securing section (56b) configured to secure a connector (50) to the case (20) at an outer circumference of a connector housing (53) of the connector (50); and a positioning section (58) configured to position the connector (50) to the case (20), when the connector (50) is inserted into the connector receiving depression section (22a).

Abstract: A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

Abstract: A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

Abstract: There is provided a connector capable of realizing simple assembly and prevention of entering of foreign matter. A connector terminal (56) includes an insertion part (56a) that has a terminal metal fitting to be electrically connected with an external connection terminal, and a pin (56d) fixed to the insertion part (56a) and has a bent shape. The connector terminal (56) is held by a connector housing (55). In this situation, the connector housing (55) has a hole (57) that has a size at which the pin (56a) can penetrate from a tip side, and a guide wall (57d) formed along an outer circumference of the hole (57) and projects in a direction in which the pin (56d) projects from the connector housing (55).

Abstract: A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector (101) includes plural pin-shaped terminals (110) arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member (120) configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals (110) at a predefined pitch.

Abstract: A motor controller and a production method thereof are provided to be capable of lowering the stress applied to joint parts of terminals and a board as much as possible, even if a thermal load or external force is applied to the connector, and in addition, capable of achieving a sufficient coupling strength when arranged in proximity to the electric motor. In the motor controller, there are provided: a first securing section (56a) and a second securing section (56b) configured to secure a connector (50) to the case (20) at an outer circumference of a connector housing (53) of the connector (50); and a positioning section (58) configured to position the connector (50) to the case (20), when the connector (50) is inserted into the connector receiving depression section (22a).

Abstract: There is provided a connector capable of realizing simple assembly and prevention of entering of foreign matter. A connector terminal (56) includes an insertion part (56a) that has a terminal metal fitting to be electrically connected with an external connection terminal, and a pin (56d) fixed to the insertion part (56a) and has a bent shape. The connector terminal (56) is held by a connector housing (55). In this situation, the connector housing (55) has a hole (57) that has a size at which the pin (56a) can penetrate from a tip side, and a guide wall (57d) formed along an outer circumference of the hole (57) and projects in a direction in which the pin (56d) projects from the connector housing (55).