Abstract: A method for transferring a viscous material into a syringe that has a plug dividing a syringe interior into a first sub-chamber and a second sub-chamber, where a radial clearance exists between the plug and the syringe, includes transferring the viscous material from a container into the first sub-chamber to fill the first sub-chamber while allowing air initially present within the first sub-chamber to flow into the second sub-chamber via the radial clearance, and flowing a first volume of the viscous material into but not through the radial clearance such that the viscosity of the first volume of the viscous material and the radial clearance cooperate to block a flow of a second volume of the viscous material into the radial clearance and prevent the second volume of the viscous material from leaking from the first sub-chamber into the second sub-chamber.

Abstract: An apparatus for filling a syringe by transferring a viscous material from a container into the syringe includes a container having an interior that holds the viscous material and a plunger that expels the viscous material from the container. A syringe is connected to the container for receiving the viscous material at an entrance opening. The syringe includes a plug that separates the syringe into first and second sub-chambers and a rod contacting the plug and applying a force in the direction of the entrance opening. An assisting device assists in moving the rod away from the entrance opening as the first subchamber fills with the viscous material.

Abstract: A cap filled with fluid sealant is produced for subsequent attachment to an exposed portion of a fastener, such as a bolt head. The cap has a shell made of a synthetic resin formed in a generally hemispherical, hollow shape, and a recess defined by an inner surface of the shell in a generally hemispherical shape. The method includes filling the recess with a fluid sealant, which contains a mixture of a thermosetting substance and a curing agent that is freezable prior to curing, such that while the sealant is frozen, no curing takes place, and when the sealant is subsequently heated and thawed, its original fluidity is restored and curing of the thermosetting substance restarts. The sealant is then frozen while the sealant is filled in the cap. Subsequently the sealant is thawed and any condensation that forms on the sealant or the cap during the thawing is removed by drying.

Abstract: An apparatus for filling a syringe by transferring a viscous material from a container into the syringe includes a container having an interior that holds the viscous material and a plunger that expels the viscous material from the container. A syringe is connected to the container for receiving the viscous material at an entrance opening. The syringe includes a plug that separates the syringe into first and second sub-chambers and a rod contacting the plug and applying a force in the direction of the entrance opening. An assisting device assists in moving the rod away from the entrance opening as the first subchamber fills with the viscous material.

Abstract: Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit.

Abstract: A method and apparatus are disclosed for transferring and filling a viscous material from a container into a syringe while preventing the ingress of gas into the viscous material during the process of filling the syringe with the viscous material, but without requiring a housing for holding both the container and the syringe in an air-tight manner. The method includes inserting a plunger into the container that holds the viscous material and inserting a first plug, which permits gas flow in one direction, into the syringe. Then, the container is coupled to the syringe, a rod is inserted into the syringe such that the rod engages with the first plug, and the plunger is pushed within the container, thereby extruding the viscous material from the container. As a result, the extruded viscous material is transferred into the syringe and the syringe is filled with the viscous material.

Abstract: A plunger is fittable within a cylinder of a pneumatic dispenser that discharges a viscous material. The plunger has a first portion located at the front, and a second portion located at the rear. The second portion is a hollow structure and has a circumferential wall. An inner circumferential surface of this circumferential wall has a tapered surface. The circumferential wall has a thickness dimension that decreases in the axial direction moving away from the first portion. Therefore, the circumferential wall easily displaces in the radial direction, because the bending stiffness decreases in the axial direction moving away from the first portion. The first portion is a solid structure that is more rigid than the second portion. The first portion also has a partition wall surface that separates the inner chamber of the second portion from the solid section of the first portion.

Abstract: Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit.

Abstract: Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit.

Abstract: A method and apparatus are disclosed for transferring and filling a viscous material from a container into a syringe while preventing the ingress of gas into the viscous material during the process of filling the syringe with the viscous material, but without requiring a housing for holding both the container and the syringe in an air-tight manner. The method includes inserting a plunger into the container that holds the viscous material and inserting a first plug, which permits gas flow in one direction, into the syringe. Then, the container is coupled to the syringe, a rod is inserted into the syringe such that the rod engages with the first plug, and the plunger is pushed within the container, thereby extruding the viscous material from the container. As a result, the extruded viscous material is transferred into the syringe and the syringe is filled with the viscous material.

Abstract: A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the semiconductor wafer into semiconductor elements and packaging the semiconductor element over the prepared package substrates.

Abstract: Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit.

Abstract: A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the semiconductor wafer into semiconductor elements and packaging the semiconductor element over the prepared package substrates.

Abstract: An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.

Abstract: A semiconductor device, includes a package substrate having a first surface and a second surface opposite to the first surface, and a semiconductor element installed in the first surface of the package substrate. The package substrate includes a plurality of first land pads disposed in the first surface, second land pads disposed in the second surface and a second testing-dedicated pad disposed in the second surface.

Abstract: A semiconductor device, includes a package substrate having a first surface and a second surface opposite to the first surface, and a semiconductor element installed in the first surface of the package substrate. The package substrate includes a plurality of first land pads disposed in the first surface, second land pads disposed in the second surface and a second testing-dedicated pad disposed in the second surface.

Abstract: A method for manufacturing a semiconductor device includes preparing two substrates having a first and a second surface and having first and second pads and a second testing-dedicated pad, the first pads in the first surface, the second pads in the second surface and arranged with an inter-pad distance that is larger than that for the first pad, and the second testing-dedicated pad being in the second surface; coupling a wafer with a apparatus, and inspecting the wafer with a probe card, the wafer having a LSI, which is an object of an inspection, the apparatus applicable signal to the LSI formed in the wafer, and measurable electrical characteristics of the LSI formed in the wafer, and the probe card having one of the two substrates; dicing the wafer into semiconductor elements containing the LSI; and packaging the semiconductor element over the other of the two substrates.

Abstract: An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.

Abstract: A method for manufacturing a semiconductor device includes preparing two substrates having a first and a second surface and having first and second pads and a second testing-dedicated pad, the first pads in the first surface, the second pads in the second surface and arranged with an inter-pad distance that is larger than that for the first pad, and the second testing-dedicated pad being in the second surface; coupling a wafer with a apparatus, and inspecting the wafer with a probe card, the wafer having a LSI, which is an object of an inspection, the apparatus applicable signal to the LSI formed in the wafer, and measurable electrical characteristics of the LSI formed in the wafer, and the probe card having one of the two substrates; dicing the wafer into semiconductor elements containing the LSI; and packaging the semiconductor element over the other of the two substrates.

Abstract: A probe card and a method of inspecting semiconductor devices, capable of reducing necessity of a means for cleaning a probe, and of improving throughput of the inspection, are provided, in which a contact portion to be brought into contact with an electrode pad and a cutting edge portion are provided side by side at the end portion of the probe, and the measurement is carried out under overdrive, so as to allow the cutting edge portion to scrub any oxide film or foreign matters off from the surface of the electrode pad, to thereby allow the contact portion to contact with the refreshed surface of the electrode pad.