Abstract: The invention relates to a method for improving the fluidity and/or the spreadability of the native lung surfactant in a human or animal in need of such treatment, wherein the human or animal is administered with a fluorocarbon composition. The invention further relates to therapeutic compositions comprising a fluorocarbon, optionally in combination with a phospholipid, and their use as lung surfactant supplements.

Abstract: In a filter circuit (1), a common mode choke (2) and a normal mode choke (3) have extremely high and low impedances, respectively, for common mode signals received through two input terminals (1a and 1b). The chokes have the opposite impedance characteristics for differential signals. In particular, the difference in impedance is large. Furthermore, the normal mode choke (3) is installed as a previous stage of the common mode choke (2). Accordingly, common mode noises which enter the two input terminals (1a and 1b) penetrate the normal mode choke (3), but neither penetrate the common mode choke (2) nor are reflected from the common mode choke (2). In particular, common mode currents flow through the normal mode choke (3) but do not flow through the common mode choke (2).

Abstract: The digital map data processing system of the invention aims to improve the appearance of a map without increasing the labor in automatic generation of road polygons required for generation of map data. The digital map data processing system of the invention reads network data 40, which expresses multiple roads by nodes and links, and generates polygon data 50 including road polygons by processing the network data 40. The road polygon generation process includes generation of rectangular polygons of specified widths about respective links, generation of edge lines around polygons, and elimination of unnecessary edge lines. The digital map data processing system selectively applies a suitable terminal processing technique to specify terminal geometry of each object polygon, based on connection with each connection polygon and geometries and attributes of the object polygon and the connection polygon. This desirably improves the appearance at a connection of adjacent polygons.

Abstract: A decryption device includes: an internal-key storage section for storing an internal-key; a content-key storage section for storing a content-key; a determination section for determining whether or not a value of the content-key storage section in its initial state and a current value of the content-key storage section are different; and an operation section, the operation section including a first decrypting section which, when an encrypted content-key is input to the operation section, decrypts the encrypted content-key using the internal-key so as to obtain a content-key and stores the content-key in the content-key storage section, and a second decrypting section which, when an encrypted content is input to the operation section and the determination section determines that the value of the content-key storage section in its initial state and the current value of the content-key storage section are different, decrypts the encrypted content using the current value of the content-key storage section as a c

Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

Abstract: An antenna apparatus including a feed element excited by first and second wireless frequency signals, first non-feed elements for controlling directivity with respect to the first wireless frequency signal, second non-feed elements for controlling directivity with respect to the second wireless frequency signal, second variable-reactance circuits disposed between the second non-feed elements and ground, filters for passing the first frequency band and cutting off the second frequency band, which are connected to the first non-feed elements, and first variable-reactance circuits disposed between the filters and the ground.

Abstract: First and second transmission lines and are connected to each other in series. A first terminator is connected to the first transmission line in parallel, and is provided externally of a semiconductor device. A second terminator is connected to the second transmission line in parallel, and is provided inside the semiconductor device. The values of the first and second terminator are adjusted so that the combined resistance value of first and second terminator and the second transmission line matches with the impedance of the first transmission line. Impedance matching of the entire transmission line can be achieved with this simple construction, thus, a stable, high quality signal can be transmitted.

Abstract: An antenna apparatus including a feed element excited by first and second wireless frequency signals, first non-feed elements for controlling directivity with respect to the first wireless frequency signal, second non-feed elements for controlling directivity with respect to the second wireless frequency signal, second variable-reactance circuits disposed between the second non-feed elements and ground, filters for passing the first frequency band and cutting off the second frequency band, which are connected to the first non-feed elements, and first variable-reactance circuits disposed between the filters and the ground.

Abstract: A surface acoustic wave device includes a piezoelectric substrate that does not restore the pyroelectric effect, and a method for manufacturing the same. A surface acoustic wave element housed in a package includes a piezoelectric substrate having a specific resistance in the range of about 1.0×107 ?·cm to about 1.0×1013 ?·cm. Pads are electrically connected to an external electrode with a solder. The space between the package and a cap of the package is sealed with a sealing material. At least one of the solder and the sealing material has a melting point of about 300° C. or less.

Abstract: There is disclosed a radio communication system in which a constitution of a base station and further a control station can be simplified. A radio communication system according to the present invention converts a received signal received by a plurality of antenna elements in a base station to a signal of different frequency band, and then conflates the converted signal in order to generate sub-carrier wave multiplex signal. The signal is converted to an optical signal, and then the optical signal is transmitted to a control station via an optical fiber. Or the control station performs weighting to phase of the transmitted signal transmitted from a plurality of antennas of a base station, and then performs frequency conversion to different frequency band, and then conflates the converted signal in order to generate the sub-carrier wave multiplex signal. The signal is converted to an optical signal, and then an optical signal is transmitted to the base station side via the optical fiber.

Abstract: There is disclosed a radio communication system in which a constitution of a base station and further a control station can be simplified. A radio communication system according to the present invention converts a received signal received by a plurality of antenna elements in a base station to a signal of different frequency band, and then conflates the converted signal in order to generate sub-carrier wavemultiplex signal. The signal is converted to an optical signal, and then the optical signal is transmitted to a control station via an optical fiber. Or the control station performs weighting to phase of the transmitted signal transmitted from a plurality of antennas of a base station, and then performs frequency conversion to different frequency band, and then conflates the converted signal in order to generate the sub-carrier wave multiplex signal. The signal is converted to an optical signal, and then an optical signal is transmitted to the base station side via the optical fiber.

Abstract: Fine-pitch first and second bonding pads are formed on a chip along its perimeter. The first bonding pads are formed at the peripheral parts on the chip, while the second bonding pads are formed inside the peripheral parts. An ESD protection circuit is connected to the first bonding pad, and an I/O circuit is connected to the second bonding pad. First and second bonding wires connect the first and second bonding pads to the same package pin, respectively. The second bonding wire is configured to be sufficiently longer than the first bonding wire, regardless of the pitch of the first bonding pads.

Abstract: A signal receiver (11) receives an analog signal via a twisted pair cable (31). An A/D converter (12) converts the analog signal to a digital signal. A phase detection unit (14) detects the phase of the digital signal, and generates a reception timing signal. A transmission timing generation unit (15) controls, based on the reception timing signal, timing for a transmission processing unit (16) to output the digital signal such that the reception signal (point A) and a transmission signal (point D) are different in phase by a predetermined degree. The transmission processing unit (16) outputs, in accordance with the timing, a digital signal obtained by performing mapping on data inputted from a connection device (20). A D/A converter (17) converts the digital signal to an analog signal. A signal transmitter (18) transmits the analog signal via a twisted pair cable (32).

Abstract: A surface acoustic wave device includes at least four surface acoustic wave elements that are arranged to have an unbalanced-to-balanced conversion function. In a surface acoustic wave element on the balanced side, the phase between the input and output terminals is 180 degrees shifted so that the phase difference between the outputs on the balanced side becomes substantially 180 degrees.

Abstract: A receiver includes a noise reduction circuit for eliminating noise from a differential signal transmitted through a differential transmission line, and a data recovery circuit for recovering data from a differential signal outputted from the noise reduction circuit. The noise reduction circuit includes common-mode chokes for reflecting common-mode noise superimposed on an input differential signal, and a common-mode noise reduction circuit for directing the common-mode noise reflected by the common-mode chokes to a low potential point of the common-mode noise reduction circuit.

Abstract: A first transmission line for transmitting a first signal and a second transmission line for transmitting a second signal, which has the reverse phase of the first signal, are connected in series with a common mode choke coil. A third transmission line and fourth transmission line are each connected in series with the common mode choke coil, and transmit the first and second signals. A semiconductor device is connected in series with the third and fourth transmission lines, so as to transmit and receive the first and second signals. One end of a first terminator is connected in parallel with the first transmission line, and the other end is connected to the common mode choke coil. One end of a second terminator is connected in parallel with the second transmission line, and the other end is connected to the common mode choke coil. The noise eliminating capability of the common mode choke coil is increase by means of this structure.

Abstract: A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.

Abstract: First and second transmission lines and are connected to each other in series. A first terminator is connected to the first transmission line in parallel, and is provided externally of a semiconductor device. A second terminator is connected to the second transmission line in parallel, and is provided inside the semiconductor device. The values of the first and second terminator are adjusted so that the combined resistance value of first and second terminator and the second transmission line matches with the impedance of the first transmission line. Impedance matching of the entire transmission line can be achieved with this simple construction, thus, a stable, high quality signal can be transmitted.

Abstract: A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.

Abstract: Disclosed are a propylene polymer composition possessing excellent balance among rigidity and low warpage, resistance to deterioration caused by thermal oxidation during processing, weathering resistance, antistatic properties, and low bleeding properties, and a propylene resin composition which can easily produce molded products having excellent balance between rigidity and impact resistance (particularly low-temperature impact resistance) or heat resistance. The propylene polymer composition and the propylene resin composition comprise a propylene block copolymer consisting essentially of the following blocks (a) and (b) and having a melt flow rate of 0.