Patents by Inventor Osamu Shibata

Osamu Shibata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6815870
    Abstract: A surface acoustic wave device having an unbalanced-to-balanced conversion function, which is capable of improving balanced characteristics, includes a first resonator filter and a second resonator filter, having a plurality of interdigital transducers disposed along the propagation direction of a surface acoustic wave. The surface acoustic wave device has an unbalanced-to-balanced conversion function as a result of the phase of the second resonator filter being reversed by 180° with respect to that of the first resonator filter. The surface acoustic wave device further includes a first resonator connected in series to an unbalanced signal terminal side of the first resonator filter, and a second resonator connected in series to an unbalanced signal terminal side of the second resonator filter. The first resonator and the second resonator have different design parameters.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: November 9, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Shibata, Yuichi Takamine
  • Patent number: 6815868
    Abstract: A surface acoustic wave apparatus includes three longitudinally-coupled-resonator-type interdigital transducers (IDTs) having a balanced-to-unbalanced conversion function, which are provided on a piezoelectric substrate in a direction in which a surface acoustic wave (SAW) propagates. Weighting is applied to at least one of the IDTs. For example, among the electrode fingers of the IDT located on the left side, an apodization-weighted electrode finger is provided for one of the electrode fingers positioned adjacent to the central IDT.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: November 9, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Shibata, Yuichi Takamine, Hiroki Watanabe, Masaru Yata, Yoichi Sawada
  • Publication number: 20040219117
    Abstract: The present invention provides a method of spray coating deodorant, antibacterial and antifungal agent which can exert a deodorant, antibacterial and antifungal effect even in a dark place shielded from light and which is not hazardous to animals, human and environment as well as a deodorized and antibacterially and antifungally treated article. An article to be subjected to a deodorizing, antibacterial and antifungal treatment is spray-coated with a solution comprising as an active component a titanium phosphate-based compound or a condensate thereof at a coating rate of 10 to 30 g/m2 using a spray gun whose pumping rate is 33 to 34 cc per minute.
    Type: Application
    Filed: January 27, 2004
    Publication date: November 4, 2004
    Applicant: Home Taste Co., Ltd.
    Inventor: Osamu Shibata
  • Patent number: 6812741
    Abstract: A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: November 2, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Osamu Shibata, Yoshiyuki Saito, Yukihiro Fukumoto
  • Publication number: 20040155720
    Abstract: A receiver includes a noise reduction circuit for eliminating noise from a differential signal transmitted through a differential transmission line and a data recovery circuit for recovering data from a differential signal outputted from the noise reduction circuit. The noise reduction circuit includes common-mode chokes for reflecting common-mode noise superimposed on an input differential signal and a common-mode noise reduction circuit for directing the common-mode noise reflected by the common-mode chokes to a low potential point of the common-mode noise reduction circuit.
    Type: Application
    Filed: August 22, 2003
    Publication date: August 12, 2004
    Inventors: Nobuhiko Yasui, Noboru Katta, Takahisa Sakai, Yuji Mizuguchi, Yutaka Takahira, Hirotsugu Kawada, Toshitomo Umei, Takashi Akita, Osamu Shibata
  • Publication number: 20040076294
    Abstract: A copyright protection system comprises an encryption device and a decryption device. Cryptographic communication is performed between the encryption device and the decryption device using a contents key. The encryption device includes a contents storage section for storing contents, a first contents key generation section for generating the contents key based on a second decryption limitation obtained by updating a first decryption limitation, and a first encryption section for encrypting the contents using the contents key and outputting the encrypted contents. The decryption device includes a second contents key generation section for generating the contents key from the second decryption limitation, and a first decryption section for decrypting the encrypted contents using the contents key generated by the second contents key generation section.
    Type: Application
    Filed: April 6, 2001
    Publication date: April 22, 2004
    Inventors: Osamu Shibata, Tsutomu Sekibe
  • Publication number: 20040029533
    Abstract: A wireless transmitting apparatus according to the present invention, comprising: N (N is two or more integer) pieces of antennas capable of transmitting a wireless signal; and a selector which selects L (L is one or more integer, and L≦N) pieces of antennas from said N pieces of antennas and selects the types of signals to be transmitted from the selected L pieces of antennas.
    Type: Application
    Filed: May 19, 2003
    Publication date: February 12, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Ryoko Matsuo, Koji Horisaki, Tsuguhide Aoki, Hiroki Shoki, Hiroshi Tsurumi, Shuichi Obayashi, Osamu Shibata, Hideo Kasami, Kuniaki Ito, Takayoshi Ito
  • Publication number: 20040000839
    Abstract: A surface acoustic wave device includes at least four surface acoustic wave elements that are arranged to have an unbalanced-to-balanced conversion function. In a surface acoustic wave element on the balanced side, the phase between the input and output terminals is 180 degrees shifted so that the phase difference between the outputs on the balanced side becomes substantially 180 degrees.
    Type: Application
    Filed: October 12, 2002
    Publication date: January 1, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Shibata, Yoichi Sawada
  • Publication number: 20030197528
    Abstract: A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.
    Type: Application
    Filed: March 21, 2003
    Publication date: October 23, 2003
    Inventors: Osamu Shibata, Yoshiyuki Saito, Yukihiro Fukumoto
  • Patent number: 6629302
    Abstract: A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: September 30, 2003
    Inventors: Shinji Miura, Yukihiro Fukumoto, Hirokazu Uemura, Yoshiyuki Saito, Hiroshi Ikeda, Takeshi Nakayama, Osamu Shibata, Shinichi Tanimoto
  • Publication number: 20030168932
    Abstract: A surface acoustic wave device having an unbalanced-to-balanced conversion function, which is capable of improving balanced characteristics, includes a first resonator filter and a second resonator filter, having a plurality of interdigital transducers disposed along the propagation direction of a surface acoustic wave. The surface acoustic wave device has an unbalanced-to-balanced conversion function as a result of the phase of the second resonator filter being reversed by 180° with respect to that of the first resonator filter. The surface acoustic wave device further includes a first resonator connected in series to an unbalanced signal terminal side of the first resonator filter, and a second resonator connected in series to an unbalanced signal terminal side of the second resonator filter. The first resonator and the second resonator have different design parameters.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 11, 2003
    Inventors: Osamu Shibata, Yuichi Takamine
  • Patent number: 6613180
    Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: September 2, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshitaka Sunagawa, Yoshitake Hayashi, Masayoshi Koyama, Yoshihiro Tomura, Toshiyuki Kojima, Osamu Shibata, Ryuichi Saito
  • Publication number: 20030061519
    Abstract: An authentication communication system includes an storage medium having an area for storing digital information and an access device for reading/writing digital information from/into the area. The access device authenticates whether the storage medium is authorized according to a challenge-response authentication protocol in which scrambled access information generated by scrambling the access information which shows the area is used. The storage medium authenticates whether the access device is authorized. When the access device and the storage medium have authenticated each other as authorized devices, the access device reads/writes digital information from/into the area in the storage medium according to the access information separated from the scrambled access information by the access device.
    Type: Application
    Filed: September 6, 2001
    Publication date: March 27, 2003
    Inventors: Osamu Shibata, Taihei Yugawa, Tsutomu Sekibe, Teruto Hirota, Yoshiyuki Saito, Toshihiko Otake
  • Publication number: 20030033108
    Abstract: A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.
    Type: Application
    Filed: December 20, 2001
    Publication date: February 13, 2003
    Inventors: Eiji Takahashi, Yukihiro Fukumoto, Yoshiyuki Saito, Osamu Shibata, Shinichi Tanimoto, Takeshi Nakayama
  • Publication number: 20030027371
    Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has
    Type: Application
    Filed: April 1, 2002
    Publication date: February 6, 2003
    Inventors: Yoshitaka Sunagawa, Yoshitake Hayashi, Masayoshi Koyama, Yoshihiro Tomura, Toshiyuki Kojima, Osamu Shibata, Ryuichi Saito
  • Publication number: 20020145361
    Abstract: A surface acoustic wave apparatus includes three longitudinally-coupled-resonator-type interdigital transducers (IDTs) having a balanced-to-unbalanced conversion function, which are provided on a piezoelectric substrate in a direction in which a surface acoustic wave (SAW) propagates. Weighting is applied to at least one of the IDTs. For example, among the electrode fingers of the IDT located on the left side, an apodization-weighted electrode finger is provided for one of the electrode fingers positioned adjacent to the central IDT.
    Type: Application
    Filed: April 9, 2002
    Publication date: October 10, 2002
    Inventors: Osamu Shibata, Yuichi Takamine, Hiroki Watanabe, Masaru Yata, Yoichi Sawada
  • Patent number: 6367174
    Abstract: A recess portion 12 and a thick outer peripheral portion 13 are formed in an upper surface of a bottom plate 1. A recess portion 21 is formed in a lower surface of a cover 2. The recess portions 12 and 21 have configurations corresponding to a combination of a tarsal portion of a foot covering an area from a heel to substantially a center portion of a foot and a metatarsal portion of the foot covering an area from the center portion to roots of toes of the foot, respectively. A plurality of blades 11 are integrally formed on a surface of the recess portion 12, extend in directions perpendicular to a longitudinal direction of the bottom plate and are slanted toward a heel portion of the bottom plate. The welded portions 3 and 4 of the upper surface of the bottom plate 1 and the lower surface of the cover, which directly surround the respective recess portions and have uniform width, are welded together by a high frequency welder and fluid is sealed in a space defined by the recess portions 12 and 21.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: April 9, 2002
    Assignee: Kabushiki Kaisha Himiko
    Inventor: Osamu Shibata
  • Publication number: 20010047508
    Abstract: A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.
    Type: Application
    Filed: December 22, 2000
    Publication date: November 29, 2001
    Inventors: Shinji Miura, Yukihiro Fukumoto, Hirokazu Uemura, Yoshiyuki Saito, Hiroshi Ikeda, Takeshi Nakayama, Osamu Shibata, Shinichi Tanimoto
  • Publication number: 20010034715
    Abstract: A decryption device includes: an internal-key storage section for storing an internal-key; a content-key storage section for storing a content-key; a determination section for determining whether or not a value of the content-key storage section in its initial state and a current value of the content-key storage section are different; and an operation section, the operation section including a first decrypting section which, when an encrypted content-key is input to the operation section, decrypts the encrypted content-key using the internal-key so as to obtain a content-key and stores the content-key in the content-key storage section, and a second decrypting section which, when an encrypted content is input to the operation section and the determination section determines that the value of the content-key storage section in its initial state and the current value of the content-key storage section are different, decrypts the encrypted content using the current value of the content-key storage section as a c
    Type: Application
    Filed: April 10, 2001
    Publication date: October 25, 2001
    Inventors: Osamu Shibata, Taihei Yugawa, Tsutomu Sekibe, Yoshiyuki Saito, Toshihiko Otake
  • Patent number: 5989495
    Abstract: An aluminum alloy for use in castings, comprising 0.0005-0.01 weight % of Fe, 0.0005-0.01 weight % of Si, 2.5-6.5 weight % of Cu, 0.10-0.50 weight % of Mg, 0.001-0.40 weight % of Mn, 0.10-0.50 weight % of Ti, 0.20-1.2 weight % of Ag, 0.002-0.01 weight % of B, no more than 0.01 weight % of any other individual component aside from Al, and the balance Al. The aluminum alloy is thereby designed to provide improved toughness without detracting from tensile strength, proof stress, and hardness.
    Type: Grant
    Filed: July 30, 1996
    Date of Patent: November 23, 1999
    Assignees: Kyushu Mitsui Aluminum Industries, Inc., Nippon Precision Casting Corp.
    Inventors: Tomoaki Isayama, Osamu Shibata