Abstract: An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity at 120° C. of the adhesive layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the adhesive layer before thermosetting is maintained at a constant temperature of 120° C.

Abstract: A carbon monoxide removing catalyst such as a ruthenium supporting catalyst is provided for removing, through oxidation thereof, carbon monoxide from an alcohol reformed gas containing hydrogen and carbon monoxide to be supplied to a fuel cell. For its activation, the catalyst is caused to contact an inactive gas or a hydrogen-containing inactive gas consisting of less than 50 volume % of hydrogen gas and the remaining volume of inactive gas, thereby to avoid poisoning of the electrode of the fuel cell with carbon monoxide.

Abstract: A carbon monoxide removing catalyst such as a ruthenium supporting catalyst is provided for removing, through oxidation thereof, carbon monoxide from an alcohol reformed gas containing hydrogen and carbon monoxide to be supplied to a fuel cell. For its activation, the catalyst is caused to contact an inactive gas or a hydrogen-containing inactive gas consisting of less than 50 volume % of hydrogen gas and the remaining volume of inactive gas, thereby to avoid poisoning of the electrode of the fuel cell with carbon monoxide.

Abstract: A sheet-like underfill material includes a base and adhesive layer provided peelably on the base for use in a flip chip mounting process in the manufacture of a semiconductor device. The process includes laminating a sheet-like underfill material onto a circuit face of a semiconductor wafer having bumps on its circuit face and, simultaneously, allowing the bumps to pierce the adhesive layer and allowing the tops of the bumps to penetrate the base. The base has a storage elastic modulus of 1.0×106 Pa to 4.0×109 Pa, a breaking stress of 1.0×105 Pa to 2.0×108 Pa, and a Young's modulus of 1.0×107 Pa to 1.1×1010 Pa. The adhesive layer has a storage elastic modulus of 1.0×104 Pa to 1.0×107 Pa and a breaking stress of 1.0×103 Pa to 3.0×107 Pa.

Abstract: Described is a sheet for forming a protective film, which can be used suitably in a process where marking is made on the protective film formed on work such as a wafer and the like. The sheet includes a release sheet and a protective film forming layer provided on the release surface of the release sheet, wherein the protective film forming layer includes 100 parts by weight of an epoxy resin, 50 to 200 parts by weight of a binder polymer, and 100 to 2,000 parts by weight of fillers, 30% by weight or more of total 100% by weight of the said epoxy resin being selected from epoxy resins represented by the following formulae (I) and (II); wherein, X's are —O—, —OCH(CH3)O— and the like; R's are a polyether skeleton and the like; and n's are in the range of 1 to 10.

Abstract: A polymerizable liquid crystal composition of the present invention includes a compound including a repeated unit represented by a general formula (I) (wherein R1, R2, R3, and R4 each independently represents a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms, and one or more of hydrogen atoms in the hydrocarbon group may be substituted by the halogen atoms.), in which a weight average molecular weight is 100 or more.

Abstract: A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Abstract: A magnetron sputtering apparatus includes: a target provided in a sputtering chamber; a susceptor opposed to the target; a high-frequency power supply connected to the susceptor; a plate provided outside the sputtering chamber and coaxial with a central axis of the target; a rotary motion mechanism configured to rotate the plate about the central axis; S-pole magnets placed on one side of the plate with their S-pole end directed to the target; and first and second N-pole magnets placed on the one side of the plate with their N-pole end directed to the target. The first N-pole magnets are placed along a circle coaxial with the plate and opposed to an outer peripheral vicinity of the target. The S-pole magnets are placed inside the first N-pole magnets and along a circle coaxial with the plate. The second N-pole magnets are placed inside the S-pole magnets and along a circle coaxial with the plate.

Abstract: An adhesive sheet for dicing and die bonding includes a base material and an adhesive layer releasably laminated on said base material, wherein said adhesive layer has a pressure sensitive adhering property at room temperature and a thermosetting property, the elastic modulus of the adhesive layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity at 120° C. of the adhesive layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the adhesive layer before thermosetting is maintained at a constant temperature of 120° C.

Abstract: In operating the carbon monoxide removal reactor or the fuel reforming system, there is provided a technique for removing carbon monoxide in a stable manner for an extended period of time. In a method of removing carbon monoxide including an introducing step of introducing a reactant gas including mixture gas and an oxidizer added thereto to a carbon monoxide removal reactor forming in its casing a catalyst layer comprising a carbon monoxide removal catalyst for removing carbon monoxide contained in the mixture gas and a removing step of removing the carbon monoxide by causing the oxidizer to react with the mixture gas on the carbon monoxide removal catalyst, in said introducing step, the reactant gas of 100° C. or lower is introduced to the carbon monoxide removal reactor.

Abstract: A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Abstract: A method of forming an insulating film for enhancing the film and removing water and OH groups from the film efficiently. The method comprises steps of forming a second low dielectric constant insulating film having a thickness smaller than a desired thickness in a predetermined material gas atmosphere, carrying out O2 gas treatment at the same substrate temperature and pressure as those in the step of forming the second low dielectric constant insulating film, carrying out residual unreacted material removal, uncombined bonds termination, or absorbed OH group removal, without air exposure, and forming a second cap insulating film. The steps of forming the second low dielectric constant insulating film, carrying out processes such as the residual unreacted material removal, and forming the second cap insulating film are repeated until a total thickness of the second low dielectric constant insulating film and the second cap insulating film reaches a desired level.

Abstract: An adhesive composition is characterized by including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet are also provided.

Abstract: In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the invention, voids are easily eliminated irrespective of a design of the wiring board, and the adhesive is prevented from curling up on the chip.

Abstract: The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.

Abstract: A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermosetting is 1.0×103 to 1.0×104 Pa, the melt viscosity 120° C. of the sealing resin layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the sealing resin layer before thermosetting is kept at a constant temperature of 120° C.

Abstract: According to one embodiment, a wireless device includes an optical motion detector, battery lifetime display unit, battery, communication unit, communication signal emitting opening, and mouse button unit. The optical motion detector includes a CPU, RAM, ROM, and optical unit. The optical unit has a light emitting unit configured to emit light from an opening toward a plate or desktop upon which the wireless device is placed, a lens for collecting the light reflected therefrom, and a CMOS image sensor for receiving the collected light and detecting patterns on the plate or desktop. The battery lifetime display unit includes the CPU, RAM, ROM, light emitting unit, and a voltage detection circuit. The battery lifetime display unit allows the user to know whether the battery thereof has reached its lifetime, that is to say, whether the voltage of the battery has dropped so low that the wireless device cannot function.

Abstract: A carbon monoxide removing catalyst such as a ruthenium supporting catalyst is provided for removing, through oxidation thereof, carbon monoxide from an alcohol reformed gas containing hydrogen and carbon monoxide to be supplied to a fuel cell. For its activation, the catalyst is caused to contact an inactive gas or a hydrogen-containing inactive gas consisting of less than 50 volume % of hydrogen gas and the remaining volume of inactive gas, thereby to avoid poisoning of the electrode of the fuel cell with carbon monoxide.

Abstract: A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.

Abstract: The present invention relates to a carbon-monoxide removing (removal) catalyst for removing mainly carbon monoxide from a gas containing hydrogen (H2) gas as the major component thereof and containing also a small amount of carbon monoxide (CO) gas, such as a reformed gas obtained by reforming (steam reforming, partial oxidation reforming, etc.) a hydrocarbon such as a natural gas, naphtha, kerosene or the like and an alcohol such as methanol.