Abstract: An oscillating sprinkler includes a rotatable cylindrical mount, an impeller housing at one side of the rotatable body, an impeller in the impeller housing, a pair of sweep setting rings at the other side of the rotatable body, and a toggle valve in the rotatable body. The impeller housing has an outlet wall defines two impeller inlets therein. Each of the sweep setting rings has a radial wall provided with an arcuate slot. The rotatable body has a radial inlet wall provided with an aperture. The toggle valve is configured to control which of the impeller inlets in the outlet wall is opened. The toggle valve includes a rocker, a lever, an arm extending the lever and through the aperture in the inlet wall and the slots in the sweep setting rings and a snap bushing sleeved on the arm and having fingers snapped in a groove of the arm.

Abstract: A spray gun includes a gun body, a rotary plug and a button. The gun body has a valve seat extending in between an inlet passage and an outlet passage thereof. The plug is accommodated in a chamber of the valve seat and has a fluid path so that the plug is rotatable between an open position where the fluid path joins the inlet passage and the outlet passage and a closed position where the plug separates the inlet passage from the outlet passage. The button has two lobes joined to opposite ends of the plug. An elastomeric seal ring is sleeved around the plug. A backup ring adjacent to the seal ring is sleeved around the plug. The seal ring and the backup ring are held in between a shoulder of the valve seat and the respective lobe of the button.

Abstract: A misting nozzle includes a body having a hole centrally defined therein and a flange radially extending therefrom to divide the body into a connecting section and a mounting section. At least two ditches are longitudinally and equally defined in the mounting section, and each laterally communicates with the hole. A distal end of the smooth portion is formed with an abutment and a round recess centrally defined in the abutment. At least two grooves are respectively equally defined in the abutment, wherein each groove is defined along a corresponding one of the tangents of the round recess and has two opposite ends respectively communicating with the round recess and a corresponding one of the ditches. A cap is airtightly mounted onto the mounting section of the body. A funnel-shaped hole is defined in a bottom of the cavity and communicates with the recess.

Abstract: A misting nozzle includes a body having a through hole longitudinally and centrally defined therein. A cap is longitudinally and airtightly mounted to the mounting section of the body. The cap includes a cavity centrally and longitudinally defined therein and a funnel-shaped hole centrally defined in the bottom of the cavity. A guide element is airtightly received in the smooth portion of the cavity. The guide element includes multiple ditches equally longitudinally defined in the outer periphery of the guide element. A round recess is centrally defined in the abutment and communicating with the funnel-shaped hole. Multiple grooves are respectively defined in the abutment. Each groove is defined along a corresponding one of the tangents of the recess and having two opposite ends respectively communicating with the recess and a corresponding one of the ditches.

Abstract: A flow controller includes a handle, first and second valves, and first and second levers. The handle includes an inlet, an outlet, a first chamber in communication with the inlet and outlet and a second chamber in communication with the outlet. A first end of the first valve is movable in the first chamber between a shutting position for shutting the inlet and an opening position for opening the inlet. A second end of the first valve is outside the first chamber. The first lever is operable to move the first valve to the opening position. The second valve is rotationally located in the second chamber for controlling the flow rate of water going through the outlet. The second lever is operable to rotate the second valve.

Abstract: A system and method for measuring movements, utilizing one or more wireless accelerometers attached to one or more limbs of a human subject for the purpose of determining certain temporal and spatial gestures of the subject.

Abstract: A flow controller includes a handle, first and second valves, and first and second levers. The handle includes an inlet, an outlet, a first chamber in communication with the inlet and outlet and a second chamber in communication with the outlet. A first end of the first valve is movable in the first chamber between a shutting position for shutting the inlet and an opening position for opening the inlet. A second end of the first valve is outside the first chamber. The first lever is operable to move the first valve to the opening position. The second valve is rotationally located in the second chamber for controlling the flow rate of water going through the outlet. The second lever is operable to rotate the second valve.

Abstract: A substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure includes a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding to the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. The problem of non-alignment of the solder ball can thus be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract: A sprinkler includes a tubular member having a longitudinal track and a number of water discharging openings formed through the track, and one or more shutoff control devices slidably attached onto the track and movable along the track to selectively align with either or some of the water discharging openings of the tubular member and to selectively block and seal the water discharging openings of the tubular member. The shutoff control devices each include a seat slidably attached to the track, and a latch pivotally attached to the seat for selectively blocking either of the water discharging openings of the tubular member and for controlling the water spraying patterns of the sprinkler.

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB.

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract: A sprinkler includes a tubular member having a longitudinal track and a number of water discharging openings formed through the track, and one or more shutoff control devices slidably attached onto the track and movable along the track to selectively align with either or some of the water discharging openings of the tubular member and to selectively block and seal the water discharging openings of the tubular member. The shutoff control devices each include a seat slidably attached to the track, and a latch pivotally attached to the seat for selectively blocking either of the water discharging openings of the tubular member and for controlling the water spraying patterns of the sprinkler.

Abstract: A sprayer gun includes a housing form on top of a handle and having a conduit for receiving water from the handle, a revolving ring rotatably attached to the housing and having a number of openings for aligning with the conduit of the housing, a sealing ring engaged in the conduit of the housing and having a bore for aligning with either of the openings of the revolving ring, an actuating rod slidably disposed in the housing and coupled to a trigger which may move the actuating rod toward or away from the revolving ring, and the actuating rod includes a plug for engaging into the bore of the sealing ring and for sealingly engaging with the sealing ring and for controlling the water to flow out through the bore of the sealing ring.

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB.

Abstract: A periodical mechanism of a sprinkler includes a casing and a wheel is received in the casing to introduce water into a chamber of the casing in which a gear set is received. The gear set includes multiple gears and is connected between the wheel and a rotatable member which has a plurality of openings and closed areas. The casing includes a cover which includes an outlet so as to introduce water into the sprinkler. The outlet includes multiple openings and closed areas so that when the wheel is rotated by water entering the casing, the gear set drives the rotatable member. The water periodically enters into the sprinkler when the respective openings of the rotatable member and the cover are in alignment with each other.

Abstract: A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.

Abstract: A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed side, a second exposed side and a center between the exposed sides. A plurality of first pre-solders and second pre-solders are formed on the surface to cover the first and second exposed sides of the contact pads respectively, the centers of the contact pads between the first and second pre-solders being exposed. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals are connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the centers of the contact pad to prevent the fine pitch contact pads from bridging.

Abstract: The present invention relates to a substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure comprises a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. By utilizing the substrate structure of the invention, the problem of non-alignment of the solder ball can be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract: The present invention relates to a package of a leadframe with heatsinks. The package of the invention comprises a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions are corresponding to the first positioning portions of the first heatsink, whereby the warped problem of the leadframe will be resolved.