Abstract: A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each has a bonding surface exposed out of the solder mask for connecting with the external terminals of the semiconductor device. The dams are disposed above the surface of the carrier body. The dams protrude from and located between the bonding surfaces of the contact pads to prevent solder paste, flux or the external terminals of the semiconductor device from bridging.

Abstract: A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each has a bonding surface exposed out of the solder mask for connecting with the external terminals of the semiconductor device. The dams are disposed above the surface of the carrier body. The dams protrude from and located between the bonding surfaces of the contact pads to prevent solder paste, flux or the external terminals of the semiconductor device from bridging.

Abstract: A method for mounting a semiconductor package onto PCB is disclosed. A semiconductor package is provided, which comprises a plurality of outer terminals exposed out of an encapsulant. A PCB is provided and has a surface with a plurality of contact pads. Each contact pad has a first exposed side, an opposing exposed second side and a center between the exposed sides. A plurality of first pre-solders and a plurality of second pre-solders are formed on the surface by one single printing. The first pre-solders and the second pre-solders respectively cover the first and second exposed sides of the contact pads, spaces between the opposing first and second pre-solders expose the centers of the contact pads. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB.

Abstract: A tire pump, which is adapted to be secured on a bicycle, includes an elongate mounting frame, a cylinder, a piston, a hinge member, and a lever. The mounting frame has first and second ends. The cylinder has a rear end pivotally secured to the second end, and a front end spaced apart from the rear end and disposed to be proximate to the first end. The piston is disposed to reciprocate within the cylinder so as to pump air out of an outlet in the rear end to inflate a bicycle tire. The cylinder further has a piston rod with a fixed end secured to the piston in the cylinder and a coupling end extending axially and outwardly of the front end. The hinge member includes a fixed knuckle member and a movable knuckle member. The fixed knuckle member is disposed on the coupling end.

Abstract: A system for detecting deposited metals on soldering points of an integrated circuit board substrate, a light source, a charge coupled device camera, and a computer. The camera captures an image of the substrate of a ball grid array integrated circuit board and converts the image into a digital image signal. The dot matrix image is transmitted to the computer for analysis by software to examine a conformity index between the image on the substrate to be detected and the image of a reference substrate, thereby providing an automatic detecting function.