Abstract: The present disclosure discloses a backlight module, which includes a light guide plate and at least one light emitting unit. The light guide plate includes a first side and a second side opposite to each other, at least one accommodating portion and at least one light guide structure. The accommodating portion is adjacent to the first side and has an incident surface faced toward the second side. The light guide structure is disposed between the accommodating portion and the second side, and the light guide structure further comprises a first reflective surface and a second reflective surface. The first reflective surface is toward the first side and close to the accommodating portion. The second reflective surface is adjacent to the first reflective surface, and the second reflective surface is toward the first side and away from the accommodating portion. The light emitting unit is disposed in the accommodating portion.

Abstract: The present disclosure discloses a keyboard including a base plate, membrane circuit board, a plurality of keys and a frame. The base plate includes a plurality of assembly areas and a first opening. The first opening is disposed between some said assembly areas. The membrane circuit board is disposed above the base plate. The membrane circuit board includes a second opening corresponding in position to the first opening, respectively. The frame is disposed above the base plate, and the membrane circuit board is disposed between the base plate and the frame. The frame blocks the first and second openings. The frame includes receiving portions corresponding in position to the assembly areas. The keys pass through the receiving portions and are fixed to the assembly areas of the base plate, respectively. Gaps between the frame and keys, the first and second openings jointly form an air current channel.

Abstract: A keyswitch device includes a base plate, a membrane circuit board, a light source, and a keyswitch assembly. The membrane circuit board is disposed on the base plate and includes a reflective film layer, a transmissive film layer, and a light guide spacer. The reflective film layer is located on the base plate. The transmissive film layer is located over the reflective film layer. The light guide spacer has an accommodating space. The reflective film layer and the transmissive film layer are respectively located at opposite sides of the light guide spacer. The light source is disposed between the reflective film layer and the transmissive film layer and located in the accommodating space. The keyswitch assembly is disposed on the membrane circuit board.

Abstract: A backlight module includes a reflective film, a light guide plate located on the top side of the reflective film and defining a light incident area, a light-shielding film located on the light guide plate opposite to the reflective film, a membrane switch structure including a first circuit layer mounted on the reflective film and disposed between the light guide plate and the reflective film and a second circuit layer mounted on the light-shielding film to face toward the light guide plate, and a light source disposed adjacent to the light guide plate with light-emitting elements arranged for emitting light toward the light incident area of the light guide.

Abstract: A keyswitch device includes a base plate, a membrane circuit board, a light source, and a keyswitch assembly. The membrane circuit board is disposed on the base plate and includes a reflective film layer, a transmissive film layer, and a light guide spacer. The reflective film layer is located on the base plate. The transmissive film layer is located over the reflective film layer. The light guide spacer has an accommodating space. The reflective film layer and the transmissive film layer are respectively located at opposite sides of the light guide spacer. The light source is disposed between the reflective film layer and the transmissive film layer and located in the accommodating space. The keyswitch assembly is disposed on the membrane circuit board.

Abstract: A keyboard backlight module includes a backlight device including a reflective layer, a light shielding layer and a light guide layer sandwiched between the reflective layer and the light shielding layer and carrying a set of key switches on the top surface thereof, a light source mounted between the reflective layer and the light shielding layer, and high-refractive index scatter points prepared from a mixture containing a colored light-transmissive ink and high-refractive index particles at a predetermined ratio and mounted in the top side and/or bottom side of the light guide layer for refracting light toward the key switches to enhance illumination brightness.

Abstract: A keyboard backlight module includes a backlight device including a reflective layer, a light shielding layer and a light guide layer sandwiched between the reflective layer and the light shielding layer and carrying a set of key switches on the top surface thereof, a light source mounted between the reflective layer and the light shielding layer, and high-refractive index scatter points prepared from a mixture containing a colored light-transmissive ink and high-refractive index particles at a predetermined ratio and mounted in the top side and/or bottom side of the light guide layer for refracting light toward the key switches to enhance illumination brightness.

Abstract: A keyboard light-emitting structure mounted at a bottom side of a keyboard for illuminating the keyboard upon operation is disclosed to include a base module including a planar reflector, a planar light shield covering the planar reflector and having open spaces therein and a planar light guide sandwiched between the planar reflector and the planar light shield, and a light-emitting device including a flexible printed circuit board bonded to the planar reflector, a plurality of light-emitting components located at one end of the flexible printed circuit board and arranged in different directions within one respective opening of the planar reflector and a connection terminal located at an opposite end of the flexible printed circuit board and electrically connected with the circuit layout of the keyboard to an external power source.

Abstract: A multicolor light-emitting computer input device includes a key switch module including a bottom plat having through holes, press members spaced above the bottom plate, and linking members respectively coupled between the bottom plate and the press members for moving the press members up and down, a circuit board arranged above the bottom plate and carrying light-emitting diodes in the through holes of the bottom plate and a light guide cap of a selected color capped around each light-emitting diode, elastomer members arranged the top side of the circuit board, and a light guide panel arranged at the bottom side of the bottom plate for receiving light from the light-emitting diodes and the respective light guide caps and guiding the received light toward the press members.

Abstract: A multicolor light-emitting computer input device includes a key switch module including a bottom plat having through holes, press members spaced above the bottom plate, and linking members respectively coupled between the bottom plate and the press members for moving the press members up and down, a circuit board arranged above the bottom plate and carrying light-emitting diodes in the through holes of the bottom plate and a light guide cap of a selected color capped around each light-emitting diode, elastomer members arranged the top side of the circuit board, and a light guide panel arranged at the bottom side of the bottom plate for receiving light from the light-emitting diodes and the respective light guide caps and guiding the received light toward the press members.

Abstract: An optoelectronical semiconductor device having a bonding structure comprises a first optoelectronical structure, a second optoelectronical structure, and a transparent bonding structure formed in-between.

Abstract: A light-emitting device comprises a channel structure in the semiconductor layer for connecting an electrode and an ohmic contact layer by means of a substrate transfer process including a wafer-bonding process and a substrate-lifting-off process. The channel structure is formed in the semiconductor stack for electrically connecting the ohmic contact layer and the electrode and driving the current into the light-emitting device. Thereby, a horizontal type or a vertical type of light-emitting device has a good ohmic contact and high light efficiency.

Abstract: A method for making an LED is proposed. First a light-emitting structure is formed on a temporary substrate, and then a heat radiating substrate is formed on the light-emitting structure. Next the temporary substrate is removed. The heat radiating substrate includes a low expansion body and a high thermal conductivity body mutually connected.

Abstract: A light-emitting device comprises a channel structure in the semiconductor layer for connecting an electrode and an ohmic contact layer by means of a substrate transfer process including a wafer-bonding process and a substrate-lifting-off process. The channel structure is formed in the semiconductor stack for electrically connecting the ohmic contact layer and the electrode and driving the current into the light-emitting device. Thereby, a horizontal type or a vertical type of light-emitting device has a good ohmic contact and high light efficiency.

Abstract: An optoelectronical semiconductor device having a bonding structure comprises a first optoelectronical structure, a second optoelectronical structure, and a transparent bonding structure formed in-between.

Abstract: A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier of the LED; the reflective layer can make the light emitted by the epitaxial structure to be reflected more efficiently; and the carrier is used to enhance the heat-dissipation effect of the LED. Moreover, the transparent heat-conductive glue and the reflective layer can be replaced with one single adhesive reflective layer having functions of adhesion and reflection simultaneously.

Abstract: A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED.

Abstract: A package structure of a light emitting diode includes a substrate structure, a connection layer, and at least one conductive passage. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The insulation layer is configured to electrically insulate the conduction board from the conductive layer, and also to insulate a first portion from a second portion of the conduction board. The substrate structure has an opening to expose the conduction board. The connection layer configured to support and electrically couple to a first electrode of a light emitting diode (LED) is disposed in the opening. The connection layer is also configured to electrically couple to the conduction board and to be electrically insulated from at least one portion of the conductive layer, which is coupled to a second electrode of the LED.

Abstract: A package structure for a light emitting diode (LED) includes a substrate structure and a reflective layer. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The substrate structure has an opening to expose the conduction board. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. The reflective layer is electrically coupled to the conduction board and electrically insulated from at least a portion of the conductivity layer, which is coupled to a second electrode of the LED.

Abstract: This invention this invention provides a light-emitting semiconductor device having enhanced brightness, to ensure even current distribution emitted by a front contact of the light emitting diodes so as to improve the light-emitting efficiency of the active layer. This invention adopts the method to manufacture the light-emitting device, comprising the steps of: forming an active layer on a substrate; forming a capping layer on the active layer to enhance current distribution, where a back contact is located on another side of the substrate and a front contact is located above the capping layer. This invention is characterized by: re-designing the front contact, by reducing the width of a metallic pattern constructing fingers or Mesh lines and increasing the number of the fingers or Mesh lines, so as to resolve the current crowding problem.