Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.

Abstract: A semiconductor package is provided, which includes: a first electronic element; a plurality of conductive elements formed on the first electronic element; a second electronic element having a plurality of conductive bumps and disposed on the first electronic element through the conductive bumps, wherein the conductive bumps are correspondingly electrically connected to the conductive elements; and an underfill formed between the second electronic element and the first electronic element for encapsulating the conductive bumps and the conductive elements, wherein the underfill contains a plurality of conductive particles having a particle size between 0.1 and 1 um, a plurality of insulating particles having a particle size between 1 and 10 um and a polymer. The invention overcomes the conventional drawback of poor electrical connection between the second electronic element and the first electronic element through the conductive particles so as to enhance the electrical performance of the semiconductor package.