Patents by Inventor Pao An
Pao An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250095908Abstract: The network transformer includes an iron core body, and first, second, and third winding assemblies. The iron core body has first and second winding sections. A first flange and a second flange are on both ends of the iron core body, and a third flange situated between the first and second flanges. The first winding section is positioned between the first and third flange s, while the second winding section is located between the second and third flanges. The first, second, and third flanges respectively have first, second, and third electrode sets. The two ends of the coils in the first winding assembly are electrically connected to the first electrode set. The second winding assembly has the two ends of the coils electrically connected to the third electrode set. The third winding assembly has the two ends of the coils electrically connected to the second and third electrode sets.Type: ApplicationFiled: September 14, 2023Publication date: March 20, 2025Inventors: Ming-Yen Hsieh, Pao-Lin Shen, Hsiang-Chung Yang, Wei-Hsuan Lo
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Publication number: 20250085562Abstract: A three-dimensional reflective display device includes a reflective display panel, a lens array disposed on the reflective display panel, and a front light module disposed on the lens array. The reflective display panel includes pixel structures, and each pixel structure includes a left-eye pixel and a right-eye pixel. The lens array includes lenticular lenses extending in a first direction and arranged in a second direction perpendicular to the first direction. The lenticular lenses are respectively corresponding to the pixel structures. The front light module includes two front light components. The two front light components both include a light guide plate and a light source disposed on a light incident surface of the light guide plate, where the light incident surfaces face to each other in the second direction.Type: ApplicationFiled: September 5, 2024Publication date: March 13, 2025Inventors: Shin-Bo LIN, Jen-Yuan CHI, Yu-Nan PAO, Chia-Ming HSIEH, Sheng-Wei CHEN, Chi-Mao HUNG
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Publication number: 20250088106Abstract: A switching DC-to-DC converter, in which the control circuit of the switch is powered by an adaptively regulated voltage. A voltage regulator that provides the adaptively regulated voltage has a first receiving terminal coupled to an input terminal of the switching DC-to-DC converter, a second receiving terminal coupled to an output terminal of the switching DC-to-DC converter, and a regulated output terminal coupled to the control circuit to provide the adaptively regulated voltage to power the control circuit and thereby to generate a load current. According to the load current, the voltage regulator controls whether to use the output voltage to assist in the generation of the adaptively regulated voltage.Type: ApplicationFiled: February 23, 2024Publication date: March 13, 2025Inventors: Shei-Chie YANG, Yuan-Yen MAI, Pao-Hsun YU
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Publication number: 20250085470Abstract: A light module includes a light guide plate, a first light source and a second light source. The light guide plate has an inner light emitting surface, an outer light emitting surface opposite to the inner light emitting surface, and a light incident surface connecting the inner light emitting surface and the outer light emitting surface. The first light source is disposed on the light incident surface and located between the inner light emitting surface and the outer light emitting surface, and the first light source emits light of a first color temperature. The second light source is disposed on the light incident surface and located between the first light source and the inner light emitting surface, and the second light source emits light of a second color temperature, and the difference between the first color temperature and the second color temperature is greater than 2000K.Type: ApplicationFiled: August 2, 2024Publication date: March 13, 2025Inventors: Jen-Yuan CHI, Yu-Nan PAO, Chia Feng HO
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Publication number: 20250088785Abstract: A device for detecting a wearing status of a headphone includes a sensor, a player, an acoustic detection assembly and a microprocessor, where the acoustic detection assembly is connected to the player through a digital-to-analog converter, and the microprocessor is connected to the sensor and the acoustic detection assembly separately; the sensor is configured to determine, in combination with the microprocessor, a wearing status of the headphone within a period of time after current time in the case where the headphone is in a worn status at the current time; and the acoustic detection assembly is configured to determine, in combination with the microprocessor and the player, the wearing status of the headphone within the period of time after the current time in the case where the headphone is in a non-worn status at the current time.Type: ApplicationFiled: April 3, 2024Publication date: March 13, 2025Applicant: Lanto Electronic LimitedInventors: Hsin-Nan Chen, Tsung-Pao Hsu, Jung-Pin Chien, Yao-Chun Tsai, Che-Yung Huang
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Publication number: 20250085496Abstract: A photonic integrated circuit (PIC) chip has an empty area and includes a grating coupler array, a photodetector array, an optical modulator module, a plurality of optical waveguides, and a plurality of bonding pads. The photodetector array is configured to transform a light signal from the grating coupler array into an electrical signal. The optical modulator module is configured to modulate a light beam from the grating coupler array such that light with a specific wavelength in the light beam is output from the grating coupler array. The optical modulator module and the photodetector array are coupled with the grating coupler array through the optical waveguides. The bonding pads are electrically connected to the optical modulator module and the photodetector array. The grating coupler array, the photodetector array, the optical modulator module, the optical waveguides, and the bonding pads are disposed around the empty area.Type: ApplicationFiled: October 25, 2023Publication date: March 13, 2025Applicant: Wistron CorporationInventors: Ching Pao Sun, Cheng Hung Lu, Guan Fu Lu
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Patent number: 12249636Abstract: A method includes providing a substrate having a first region and a second region, forming a fin protruding from the first region, where the fin includes a first SiGe layer and a stack alternating Si layers and second SiGe layers disposed over the first SiGe layer and the first SiGe layer has a first concentration of Ge and each of the second SiGe layers has a second concentration of Ge that is greater than the first concentration, recessing the fin to form an S/D recess, recessing the first SiGe layer and the second SiGe layers exposed in the S/D recess, where the second SiGe layers are recessed more than the first SiGe layer, forming an S/D feature in the S/D recess, removing the recessed first SiGe layer and the second SiGe layers to form openings, and forming a metal gate structure over the fin and in the openings.Type: GrantFiled: December 10, 2021Date of Patent: March 11, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Hao Pao, Chih-Chuan Yang, Shih-Hao Lin, Kian-Long Lim, Chih-Hsuan Chen, Ping-Wei Wang
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Patent number: 12250803Abstract: A Static Radom Access Memory (SRAM) cell includes a pass-gate transistor and a pull-down transistor. The pass-gate transistor includes a first active region and a first gate structure engaging the first active region. The pull-down transistor includes a second active region and a second gate structure engaging the second active region. The SRAM cell further includes a first isolation feature abutting the first gate structure and a second isolation feature abutting the second gate structure. The first isolation feature is spaced from the first active region of the pass-gate transistor for a first distance. The second isolation feature is spaced from the second active region of the pull-down transistor for a second distance that is larger than the first distance.Type: GrantFiled: August 30, 2021Date of Patent: March 11, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTORING COMPANY, LTD.Inventors: Chih-Hsuan Chen, Chia-Hao Pao, Shih-Hao Lin
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Publication number: 20250073819Abstract: Methods and apparatus for cleaning a used component from a substrate processing chamber are provided. In some embodiments, the method includes obtaining a used component having a ceramic base and process residue that is generated as a byproduct in the substrate processing chamber and that is in direct contact with the ceramic base; and at least partially removing the process residue by scanning a laser beam across the process residue.Type: ApplicationFiled: September 5, 2023Publication date: March 6, 2025Inventors: Chunrong YIN, Ching-Pao WANG, Joseph LIU, Yixing LIN, Boon Sen CHAN, Siamak SALIMIAN
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Patent number: 12240194Abstract: A method of manufacturing a multicolor shoe material includes the following steps. Step S1: blank molds are provided, and a mold chamber of each of the blank molds is injected by one of the foamed materials in different colors to form unfoamed semi-finished products in different colors. Step S2: the semi-finished products are put into a foaming mold, when the foaming mold is preheated and completely closed, a ratio of a total volume of the semi-finished products to a volume of the mold chamber of the foaming mold is ranged between 0.96 and 1.04. Thus, the semi-finished products could be evenly foamed. After foaming, adjacent two of the semi-finished products could be connected by heat fusion to obtain the multicolor shoe material. Additionally, a semi-finished product and a multicolor shoe material are provided in the present invention.Type: GrantFiled: April 13, 2022Date of Patent: March 4, 2025Assignee: GLORY STEEL ENTERPRISE CO., LTD.Inventors: Yi-Liang Chen, Pao-Hsin Wang
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Publication number: 20250069612Abstract: Provided are an intelligent call noise reduction device, method, and headphone. The device includes a first microphone, a second microphone, a sound collecting and processing module and a loudspeaker unit. The first microphone is near to a primary talker sound source. The second microphone is near to a third-party talker sound source. The first microphone receives a talker sound source and generates a first voltage signal based on the talker sound source and receives a background sound source and generates a second voltage signal based on the background sound source. The second microphone receives the talker sound source and generates a third voltage signal based on the talker sound source and receives the background sound source and generates 10 a fourth voltage signal based on the background sound source. The talker sound source includes the primary talker sound source and the third-party talker sound source.Type: ApplicationFiled: February 21, 2024Publication date: February 27, 2025Applicant: Lanto Electronic LimitedInventors: Hsin-Nan Chen, Tsung-Pao Hsu, Jung-Pin Chien, Yao-Chun Tsai, SHAO-HSIANG CHEN
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Publication number: 20250068268Abstract: The present disclosure provides a wireless communication system including a first host computer, a communication dongle, a second host computer and an input device. The communication dongle is connected to the first host computer via a USB interface, connected to the second host computer via a Bluetooth interface, and connected to the input device via a RF interface. The first host computer has first application software for intercepting the operating signal(s) of the input device and transferring, via the communication dongle, to the second host computer to be executed thereby. The first application software also controls the first host computer to ignore the operating signal(s) during the operating signal(s) is being transferred to the second host computer.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Inventors: PING-SHUN ZEUNG, CHUNG-HAN HSIEH, PAO-WEI CHEN, KUN-YUAN LIN
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Publication number: 20250071904Abstract: An integrated coil module includes: a substrate; a plurality of inductor elements arranged on the substrate with a spacing distance between adjacent inductor elements, the inductor elements each including an iron core, first and second coils wound on the iron core, first and second flanges at two sides of the iron core, and a third flange arranged on the iron core and between the first and second flanges, the first flange including first and second electrodes, the second flange including third and fourth electrodes, the third flange including fifth and sixth electrodes; and a plate arranged atop the plurality of inductor elements to cover the inductor elements. As such, the plurality of inductor elements are integrated together as a one-piece structure to thereby simplify the SMT manufacturing process and shorten the spacing distance between the inductor elements so as to reduce the area of the substrate occupied thereby.Type: ApplicationFiled: August 21, 2023Publication date: February 27, 2025Inventors: Ming-Yen Hsieh, Pao-Lin Shen, Hsiang-Chung Yang, Wei-Hsuan Lo
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Patent number: 12237376Abstract: The current disclosure describes a new vertical tunnel field-effect transistor (TFET). The TFET includes a source layer over a substrate. A first channel layer is formed over the source layer. A drain layer is stacked over the first channel layer with a second channel layer stacked therebetween. The drain layer and the second channel layer overlap a first surface portion of the first channel layer. A gate structure is positioned over the channel layer by a second surface portion of the channel layer and contacts a sidewall of the second channel layer.Type: GrantFiled: December 29, 2021Date of Patent: February 25, 2025Assignees: Taiwan Semiconductor Manufacturing Co., Ltd., National Taiwan UniversityInventors: Jiun-Yun Li, Pao-chuan Shih, Wei-Chih Hou
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Publication number: 20250058846Abstract: A safety system for bicycles includes a radar, a controller, and a warning apparatus, which includes a tube, a vibrating motor, and an impact sounder. The vibrating motor includes a rotary shaft and an eccentric block. The impact sounder includes an elastic member and an impact block. The elastic member includes a first end fixed to the inner wall of the tube and a second end connected to the impact block. When the controller decides to issue a warning based on a radar signal, it outputs a control signal to drive the rotary shaft to rotate. The rotation of the rotary shaft drives the eccentric block to rotate and vibrate, and the eccentric block strikes the impact sounder to make the impact block hit the inner wall and thus generate an impact force and emit a sound. The warning apparatus simultaneously provides the bicycle rider with vibrating, impacting, and audible warning.Type: ApplicationFiled: August 16, 2023Publication date: February 20, 2025Inventors: Yu-Hsiang Tseng, Hsin-Pao Lin
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Patent number: 12232291Abstract: A server chassis includes a baseboard, a power distribution board, and a busbar module. The baseboard includes a front end and a rear end. The front end and the rear end define a chassis depth. The power distribution board is positioned on the baseboard. The busbar module includes a chassis-side busbar connector. The chassis-side busbar connector is configured to mate with a rack-side busbar connector. The rack-side busbar connector is positioned on a rack having a rack depth. The busbar module is adjustable, such that the chassis-side busbar connector mates with the rack-side busbar connector in a first configuration and a second configuration. In the first configuration, the rack depth is approximately equal to the chassis depth. In the second configuration, the rack depth is greater than the chassis depth.Type: GrantFiled: June 16, 2023Date of Patent: February 18, 2025Assignee: QUANTA COMPUTER INC.Inventors: Ren-Cheng Liao, Ting-Kuang Pao
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Patent number: 12231844Abstract: A microphone system of the invention is applicable to an electronic device comprising an adjustable mechanism that causes a change in geometry of a microphone array. The microphone system comprises the microphone array, a sensor and a beamformer. The microphone array comprises multiple microphones that detect sound and generate multiple audio signals. The sensor detects a mechanism variation of the electronic device to generate a sensing output. The beamformer is configured to perform a set of operations comprising: performing a spatial filtering operation over the multiple audio signals using a trained model based on the sensing output, one or more first sound sources in one or more desired directions and one or more second sound sources in one or more undesired directions to generate a beamformed output signal originated from the one or more first sound sources.Type: GrantFiled: August 25, 2022Date of Patent: February 18, 2025Assignee: BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC.Inventors: Hua-Jun Hong, Chih-Sheng Chen, Hsueh-Ying Lai, Yu-Pao Tsai, Tsung-Liang Chen
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Publication number: 20250054459Abstract: An emotion perceiving artificial intelligence mask includes a processing circuit, a sensing circuit and a display circuit. The processing circuit includes a display control module and an artificial intelligence calculation module. The sensing circuit receives an emotion perceiving message and transmits the emotion perceiving message to the artificial intelligence calculation module. The artificial intelligence calculation module calculates and analyzes the emotion perceiving message to generate a multidimensional emotion perceiving index factor and transmit the multidimensional emotion perceiving index factor to the display control module. The display control module generates a dynamic display picture message according to the multidimensional emotion perceiving index factor. The display circuit receives the dynamic display picture message transmitted by the display control module and relatively displays an emotion perceiving dynamic picture.Type: ApplicationFiled: July 26, 2024Publication date: February 13, 2025Inventors: Sheng-Ying Pao, Shun-Hsun Liang, Shih-Dun Liu
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Publication number: 20250054877Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
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Patent number: D1067997Type: GrantFiled: June 26, 2023Date of Patent: March 25, 2025Assignee: Yumvio LLCInventors: Pao-Ching Paul Cherng, Linda Trang Nguyen