Patents by Inventor Paolo Crema

Paolo Crema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375787
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Application
    Filed: May 17, 2021
    Publication date: December 2, 2021
    Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Paolo CREMA, Jürgen BARTHELMES, Din-Ghee NEOH
  • Publication number: 20210167022
    Abstract: A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 3, 2021
    Applicant: STMicroelectronics S.r.l.
    Inventor: Paolo CREMA
  • Patent number: 11011476
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: May 18, 2021
    Assignees: STMICROELECTRONICS INTERNATIONAL N.V., STMICROELECTRONICS S.R.L.
    Inventors: Paolo Crema, Jürgen Barthelmes, Din-Ghee Neoh
  • Publication number: 20210003721
    Abstract: A device such as a dosimeter for detecting ionizing radiation, for example, X-ray radiation, in hospitals or the like. The device includes scintillator material configured to produce light as a result of radiation interacting with the scintillator material, and photoelectric conversion circuitry optically coupled to the scintillator material and configured to produce electrical signals via photoelectric conversion of light produced by the scintillator material. The device includes a plurality of photoelectric converters optically coupled with the scintillator material at spatially separated locations. The plurality of photoelectric converters thus produce respective electrical signals by photoelectric conversion of light produced by the scintillator material as a result of radiation interacting with the scintillator material. Improved energy linearity is thus facilitated while providing more efficient detection over the whole energy spectrum of radiation detected.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Inventors: Sara LOI, Paolo CREMA, Alessandro FREGUGLIA
  • Publication number: 20200402895
    Abstract: Manufacturing a semiconductor device, such as an integrated circuit, comprises: providing a leadframe having a die pad area, attaching onto the die pad area of the leadframe one or more semiconductor die or dice via soft-solder die attach material, and forming a device package by molding package material onto the semiconductor die or dice attached onto the die pad area of the leadframe. An enhancing layer, provided onto the leadframe to counter device package delamination, is selectively removed via laser beam ablation from the die pad area, and the semiconductor die or dice are attached onto the die pad area via soft-solder die attach material provided where the enhancing layer has been removed to promote wettability by the soft-solder material.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 24, 2020
    Inventor: Paolo CREMA
  • Publication number: 20200373230
    Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventor: Paolo CREMA
  • Patent number: 10763195
    Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: September 1, 2020
    Assignee: STMICROELECTRONICS S.r.l.
    Inventor: Paolo Crema
  • Publication number: 20190295934
    Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 26, 2019
    Inventor: Paolo CREMA
  • Publication number: 20190279942
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Application
    Filed: March 11, 2019
    Publication date: September 12, 2019
    Inventors: Paolo Crema, Jürgen Barthelmes, Din-Ghee Neoh
  • Patent number: 10408952
    Abstract: A radiation scintillator detector comprising a substrate on which are arranged a scintillator module and a silicon photomultiplier optically coupled one to the other. The detector includes a package comprising an outer casing enclosing said scintillator module and said photomultiplier, said package comprising inside said outer casing an inner casing comprising resin reflecting photons, in particular infrared and/or visible photons, emitted by said scintillator module upon receiving a ionizing radiation, enclosing said scintillator module and said photomultiplier.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 10, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Paolo Crema, Alessandro Freguglia, Piero Fallica
  • Publication number: 20190181076
    Abstract: A method of producing leadframes for semiconductor devices comprises: providing a plurality of electrically-conductive plates, forming in the electrically conductive plates homologous passageway patterns according to a desired semiconductor device leadframe pattern, joining together the plurality of plates with the homologous passageway patterns formed therein mutually in register by producing a multilayered leadframe exhibiting the desired leadframe pattern and a thickness which is the sum of the thicknesses of the plates in the plurality of electrically-conductive plates.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 13, 2019
    Inventors: Dario VITELLO, Fabio MARCHISI, Alberto ARRIGONI, Federico FREGO, Federico Giovanni ZIGLIOLI, Paolo CREMA
  • Publication number: 20180284299
    Abstract: A radiation scintillator detector comprising a substrate on which are arranged a scintillator module and a silicon photomultiplier optically coupled one to the other. The detector includes a package comprising an outer casing enclosing said scintillator module and said photomultiplier, said package comprising inside said outer casing an inner casing comprising resin reflecting photons, in particular infrared and/or visible photons, emitted by said scintillator module upon receiving a ionizing radiation, enclosing said scintillator module and said photomultiplier.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Inventors: Paolo CREMA, Alessandro FREGUGLIA, Piero FALLICA
  • Publication number: 20180053709
    Abstract: Semiconductor devices comprising at least one electrically conductive metal element in a non-conductive package material are manufactured by: providing a first metal layer having a smooth morphology for covering the aforesaid metal element; and providing a second metal layer for covering partially the first layer, leaving at least one portion of the surface of the first layer exposed, the second layer having a rough morphology. There may moreover be provided a die pad for mounting a semiconductor die by providing the aforesaid first layer for covering the die pad and attaching a semiconductor die on the die pad in contact with said first layer.
    Type: Application
    Filed: March 30, 2017
    Publication date: February 22, 2018
    Inventors: Paolo Crema, Paolo Casati
  • Patent number: 9822001
    Abstract: A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: November 21, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Alex Gritti, Paolo Crema
  • Publication number: 20170122195
    Abstract: An internal combustion engine is supplied with a mixed fuel from a supply system. The mixed fuel includes hydrogen. An electrolytic cell operates to produce hydrogen and oxygen starting from water in a liquid or vapor state. The produced hydrogen is delivered for inclusion in the mixed fuel and the produced oxygen is delivered to an intake of the internal combustion engine. A converter device operates to generate electrical energy starting from the thermal energy of exhaust gases output from the internal combustion engine. At least part of the electrical energy generated by the converter device is used in the electrolytic cell for the production of hydrogen.
    Type: Application
    Filed: May 19, 2016
    Publication date: May 4, 2017
    Applicant: STMicroelectronics S.r.l.
    Inventor: Paolo Crema
  • Publication number: 20160315059
    Abstract: An electronic component, such as an integrated circuit, includes one or more circuits with bumps extending in a longitudinal direction outward from the circuit. The bumps may be formed, e.g., by 3D printing, with at least one protrusion extending away from the longitudinal direction.
    Type: Application
    Filed: December 28, 2015
    Publication date: October 27, 2016
    Inventors: Paolo CREMA, Pierangelo MAGNI
  • Patent number: 9461011
    Abstract: An embodiment of a method and an apparatus for manufacturing lead frames are described. For example, a coating layer is formed on one or more predefined portions of the surface of the substrate of the lead frame by delimiting the predefined portions by means of screen printing. The employment of screen printing may allow obtaining large amounts of lead frames with excellent electronic and structural properties in a quick and cost-effective way.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: October 4, 2016
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Paolo Crema
  • Publication number: 20160099200
    Abstract: Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%.
    Type: Application
    Filed: June 25, 2015
    Publication date: April 7, 2016
    Inventors: Laura Ceriati, Paolo Crema, Agatino Minotti
  • Publication number: 20140131819
    Abstract: A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.
    Type: Application
    Filed: October 30, 2013
    Publication date: May 15, 2014
    Applicant: STMicroelectronics S.r.l.
    Inventors: Alex Gritti, Paolo Crema
  • Publication number: 20140065296
    Abstract: An embodiment of a method and an apparatus for manufacturing lead frames are described. For example, a coating layer is formed on one or more predefined portions of the surface of the substrate of the lead frame by delimiting the predefined portions by means of screen printing. The employment of screen printing may allow obtaining large amounts of lead frames with excellent electronic and structural properties in a quick and cost-effective way.
    Type: Application
    Filed: November 13, 2013
    Publication date: March 6, 2014
    Applicant: STMICROELECTRONICS S.R.L.
    Inventor: Paolo CREMA