Patents by Inventor Para K. Segaram

Para K. Segaram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8598696
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 3, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy, Inessa Obenhuber
  • Patent number: 8338713
    Abstract: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: December 25, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas Obenhuber, William F. Wiedemann
  • Patent number: 8324727
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: December 4, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber, legal representative
  • Patent number: 8313333
    Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: November 20, 2012
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedermann, Joseph C. Fjelstad, Para K. Segaram
  • Patent number: 8244993
    Abstract: A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: August 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kevin P. Grundy, Para K. Segaram
  • Publication number: 20120149250
    Abstract: An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 14, 2012
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 8079848
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 20, 2011
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram
  • Patent number: 8047855
    Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: November 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gary Yasamura, Joseph C. Fjelstad, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy
  • Publication number: 20110252164
    Abstract: A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed.
    Type: Application
    Filed: June 21, 2011
    Publication date: October 13, 2011
    Inventors: Kevin P. Grundy, Para K. Segaram
  • Publication number: 20110215475
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 8, 2011
    Applicant: Interconnect Portfollo LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, Kevin P. Grundy
  • Patent number: 7989929
    Abstract: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: August 2, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Belgacem Haba
  • Publication number: 20110171857
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Application
    Filed: March 21, 2011
    Publication date: July 14, 2011
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7973391
    Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, Gary Yasumura
  • Patent number: 7966443
    Abstract: A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: June 21, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kevin P. Grundy, Para K. Segaram
  • Patent number: 7919355
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: April 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, legal representative, Kevin P. Grundy
  • Patent number: 7909615
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: March 22, 2011
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram
  • Publication number: 20110065332
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Application
    Filed: November 23, 2010
    Publication date: March 17, 2011
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Patent number: 7845986
    Abstract: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: December 7, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Gary Yasumura, William F. Wiedemann, Joseph C. Fjelstad, Para K. Segaram, Kevin P. Grundy
  • Publication number: 20100221871
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Application
    Filed: May 12, 2010
    Publication date: September 2, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Kevin P. Grundy, Inessa Obenhuber
  • Publication number: 20100165525
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Application
    Filed: March 9, 2010
    Publication date: July 1, 2010
    Applicant: INTERCONNECT PORTFOLIO LLC
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber