Abstract: Provided herein are methods and compositions for treating Parkinson's disease (PD), or alleviating symptoms thereof, by the enhancing expression of aromatic acid decarboxylase (AADC) in the substantia nigra. In particular, the beneficial effects of levodopa to subjects suffering from PD are extended by enhancing the expression of AADC in the substantia nigra of the subject.

Abstract: A superconducting computing architecture includes at least one computing element including a first input to receive a first set of electrical pulses encoded in a first data representation, a second input to receive a second set of electrical pulses encoded in a second data representation, and an operator to perform an operation and generate an output based on the first input and the second input.

Abstract: A method of processing data in a memory can include accessing an array of memory cells located on a semiconductor memory die to provide a row of data including n bits, latching the n bits in one or more row buffer circuits adjacent to the array of memory cells on the semiconductor memory die to provide latched n bits operatively coupled to a column address selection circuit on the semiconductor memory die to provide a portion of the n latched bits as data output from the semiconductor memory die responsive to a memory read operation, and serially transferring the latched n bits in the row buffer circuit to an arithmetic logic unit (ALU) circuit located adjacent to the row buffer circuit on the semiconductor memory die.

Abstract: A method of processing data in a memory can include accessing an array of memory cells located on a semiconductor memory die to provide a row of data including n bits, latching the n bits in one or more row buffer circuits adjacent to the array of memory cells on the semiconductor memory die to provide latched n bits operatively coupled to a column address selection circuit on the semiconductor memory die to provide a portion of the n latched bits as data output from the semiconductor memory die responsive to a memory read operation, and serially transferring the latched n bits in the row buffer circuit to an arithmetic logic unit (ALU) circuit located adjacent to the row buffer circuit on the semiconductor memory die.

Abstract: A device authentication computing device for authenticating consumer computing devices used to perform online payment transactions is provided. The device authentication computing device receives cardholder device information for each of a plurality of cardholder computing devices of a cardholder and stores the cardholder device information based on a unique identifier associated with the cardholder. During an online transaction using a consumer computing device, the device authentication computing device receives an authentication request message and a unique identifier associated with the cardholder. The device authentication computing device also receives, via an Internet browser, transaction device information corresponding to the consumer computing device. The device authentication computing device compares the device information received during the transaction to the stored cardholder device information.

Abstract: The transparent handbag is an inner bag for holding selected personal items that would normally be loosely placed in a larger bag or receptacle. The transparent, inner handbag is adapted to be inserted in a larger receptacle such as a purse, a larger handbag, luggage, backpack or similar receptacles. Since the inner handbag is transparent, items stored therein can be quickly and easily identified.

Abstract: Curable epoxy resin composition, which is suitable for the production of electrical insulation systems for low, medium and high voltage applications, including at least an epoxy resin, a hardener, a mineral filler material, and optionally further additives, wherein (i) the epoxy resin component is a diglycidylether of bisphenol A (DGEBA); (ii) the hardener includes methyltetrahydrophthalic anhydride (MTHPA) and polypropylene glycol (PPG), wherein (iii) the average molecular weight of the polypropylene glycol (PPG) is within the range of about 300 to about 510 Dalton; and (iv) the molar ratio of methyltetrahydrophthalic anhydride (MTHPA) to polypropylene glycol (PPG) is within the range of about 9:1 to 19:1. A method of making the epoxy resin composition and electrical articles made therefrom are also provided.

Abstract: A curable epoxy resin composition is provided. The composition includes at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ether of bisphenol F (DGEBF) as epoxy resins, in which the weight ratio of DGEBA:DGEBF is within the range of about 15:85 to 45:55; (ii) an anhydride hardener; (iii) and at least one plasticizer. The composition can additionally include a catalyst, at least one filler material and/or further additives. The dynamic complex viscosity value (?*) of the composition is within the range of 0.1 to 20 Pa·s. The present disclosure also provides a process for making the composition and electrical articles including an electrical insulation system made from the composition.

Abstract: To improve its fire resistance, the winding of a low voltage coil for a dry transformer is, at its circumferential surface, covered by a wrap made up of four turns of a protective foil comprising a layer consisting of woven glass fibers impregnated with silicone resin with an admixture of mica. An inner part winding and an outer part winding are separated by a gap comprising twelve rectangular aluminium tubes as spacers. At a lower end, the end face of the winding is covered with a protective cover comprising epoxy resin.

Abstract: A hardenable epoxy resin composition which is suitable for the production of an electrical insulation with improved thermal ageing properties, wherein said hardenable epoxy resin composition comprises an epoxy resin, a hardener, an inorganic filler composition, and a coupling agent for improving the bonding between the polymer matrix and the filler, and optionally further additives. The filler composition comprises silica and aluminum trihydride (ATH). The composition can be used for the production of an electrical insulation, and electrical articles containing such an electrical insulation system.