Patents by Inventor Patrick D. Boyd

Patrick D. Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100252160
    Abstract: A clamshell tire traction device having two or more grip portions operatively couple-able by a fastening mechanism is described. The device grips the peripheral tread region of the tire without requiring any contact or connection with the wheel or its hub. The grips are equipped with spaced-apart radial cleat-bearing arms that extend around the tread region and toward the interior of the tire. The fastening mechanism includes a tensioning mechanism that is easily and quickly operated manually by a pivotal lever and includes a release mechanism operable by a depressible pushbutton.
    Type: Application
    Filed: April 3, 2009
    Publication date: October 7, 2010
    Inventors: Debra L. Gelowicz, Patrick D. Boyd
  • Patent number: 7691458
    Abstract: Numerous embodiments of a carrier substrate having thermochromatic materials are described. In one embodiment of the present invention, a carrier substrate has a visible surface, and a thermochromatic material is disposed near the carrier substrate. The thermochromatic material produces a visual change of the visible surface when an activation temperature of the thermochromatic material is reached.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: April 6, 2010
    Assignee: Intel Corporation
    Inventors: Gary A. Brist, Patrick D. Boyd
  • Publication number: 20100049097
    Abstract: An anatomical flexion apparatus comprising a relatively rigid base structure, and a pivot member coupled with and typically traversing a distance between opposing support members of the base. An arrangement of articulable platform members is generally operatively coupled with the pivot member, wherein one or more of the platform members are independently pivotable about a longitudinal axis of the pivot member. Typically, one or more radial translation members are operatively coupled with one or more drive mechanisms, and are further configured to urge one or more of the platform members through an arc of motion having a range found within a range of approximately zero to approximately one hundred eighty (0-180) degrees.
    Type: Application
    Filed: August 22, 2008
    Publication date: February 25, 2010
    Inventors: John M. O'Brien, Patrick D. Boyd
  • Publication number: 20090283026
    Abstract: An apparatus, system, and method provides blind and vision impaired (B/VI) persons with improved Detectible Guidance Markers (DGMs) for navigation in a wide variety of environments, providing information regarding the presence, type, direction, and proximity of various navigational obstacles. A representative but non-exclusive example of an invented unitary DGM includes a plurality of tactually-detectable informational members, including a base member and one or more integral directional members configured to be disposed at a surface of a navigational substrate. A discrete number of directional members conveys an obstacle identity, while different lengths of directional members, and characteristics of other informational members, convey a direction and/or a proximity to an obstacle. Additionally, numerous structural alterations to a surrounding substrate surface cooperatively supplement the detectability and information-conveying benefits of a DGM.
    Type: Application
    Filed: May 11, 2009
    Publication date: November 19, 2009
    Inventors: Robert G. Cook, Patrick D. Boyd
  • Publication number: 20090212196
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Application
    Filed: April 27, 2009
    Publication date: August 27, 2009
    Inventors: Al LaValle, Patrick D. Boyd, Jarett Rinaldi
  • Patent number: 7525405
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: April 28, 2009
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Publication number: 20090036219
    Abstract: An interactive entertainment system including numerous thematically-related elements, and particularly including one or more pliant, design-bearing ornaments which are transferrable and/or attachable nearly anywhere. Each ornament includes and defines a character embodied in a design fixed thereupon, and such characters provide a thematic-basis and continuity throughout the numerous features and elements of the invented entertainment system. The ornaments are typically universally-interchangeable within the system embodiments, being operably attachable and detachable via reciprocal hook and loop fastener, for example, with any of a great variety of structures, each structure configured for coupling an ornament with one or more of a great variety of substrates.
    Type: Application
    Filed: April 9, 2008
    Publication date: February 5, 2009
    Inventors: Marissa Beth Crouch, Anne Frances Mersereau, James Stewart, Patrick D. Boyd
  • Patent number: 7243705
    Abstract: An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: July 17, 2007
    Assignee: Intel Corporation
    Inventors: Alan M. Myers, Je-Young Chang, Ravi Prasher, Ioan Sauciuc, Gregory M. Chrysler, Patrick D. Boyd, Chia-pin Chiu
  • Patent number: 7205074
    Abstract: The present invention describes a method of providing a substrate, the substrate being transparent to radiation at an actinic wavelength; forming an absorber layer over the substrate, the absorber layer including an active area and a peripheral area; removing the absorber layer from a portion of the peripheral area; and forming a trench in the substrate in the portion of the peripheral area. The present invention further describes a mask including an active area; and a peripheral area located around the active area, the peripheral area including vent channels.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: April 17, 2007
    Assignee: Intel Corporation
    Inventor: Patrick D. Boyd
  • Patent number: 7157301
    Abstract: Numerous embodiments of an apparatus and method for generating an identification feature are described. In one embodiment of the present invention, portions of an identification character printed with thermochromatic ink are distributed within a three-dimensional matrix of a multi-layer patch. The multi-layer patch may be disposed above a substrate.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: January 2, 2007
    Assignee: Intel Corporation
    Inventor: Patrick D. Boyd
  • Patent number: 7154170
    Abstract: Numerous embodiments of an apparatus and method for generating an identification feature are described. In one embodiment of the present invention, portions of an identification character printed with thermochromatic ink are distributed within a three-dimensional matrix of a multi-layer patch. The multi-layer patch may be disposed above a substrate.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: December 26, 2006
    Assignee: Intel Corporation
    Inventor: Patrick D. Boyd
  • Patent number: 6993834
    Abstract: A device and method including a slot insertion member is to hold a number of card edge slots having a plurality of pins extending from them in alignment for insertion of the plurality of pins into a plurality of holes of a printed circuit board. At least one grip attachment member is connected to the plurality of slot insertion members to hold the plurality of slot insertion members in a fixed position. At least one grip member is connected to at least one grip attachment member to enable the holding and positioning of the slot holder.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: February 7, 2006
    Assignee: Intel Corporation
    Inventors: Patrick D. Boyd, Al LaValle, Jarett Rinaldi
  • Patent number: 6880232
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: April 19, 2005
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Patent number: 6833563
    Abstract: A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: December 21, 2004
    Assignee: Intel Corporation
    Inventors: Jarett L. Rinaldi, Patrick D. Boyd, Al LaValle
  • Patent number: 6809625
    Abstract: A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: October 26, 2004
    Assignee: Intel Corporation
    Inventors: Jarett Rinaldi, Patrick D. Boyd, Al LaValle
  • Publication number: 20040123950
    Abstract: The present invention describes a method of providing a substrate, the substrate being transparent to radiation at an actinic wavelength; forming an absorber layer over the substrate, the absorber layer including an active area and a peripheral area; removing the absorber layer from a portion of the peripheral area; and forming a trench in the substrate in the portion of the peripheral area.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventor: Patrick D. Boyd
  • Publication number: 20030216065
    Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, vertical orientation, without requiring lead preparation.
    Type: Application
    Filed: June 16, 2003
    Publication date: November 20, 2003
    Inventor: Patrick D. Boyd
  • Patent number: 6623282
    Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, vertical orientation, without requiring lead preparation.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: September 23, 2003
    Assignee: Intel Corporation
    Inventor: Patrick D. Boyd
  • Publication number: 20030117253
    Abstract: A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventors: Jarett Rinaldi, Patrick D. Boyd, Al LaValle
  • Patent number: 6555746
    Abstract: An apparatus and methods for attaching a component to a substrate, which allows through-hole mount electronic components to be attached to the substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending). The apparatus is, in general, a socket including a housing having a first surface, a second surface, and an attachment surface. A recess is defined within the housing, wherein the recess comprises a component chamber extending from the housing first surface to a horizontal portion of at least one lead guide channel that extends from the component chamber to the housing second surface. The lead guide channel includes a sloped wall extending from the component chamber toward the lead guide channel. A lid is attached to the housing and adapted to move from an open position to a closed position abutting the housing second surface.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: April 29, 2003
    Assignee: Intel Corporation
    Inventors: Patrick D. Boyd, Al LaValle, Jarett L. Rinaldi