Abstract: A surface mount device light emitting diode package is provided. The package includes a circuit board housing attached to a printed circuit board. The circuit board housing supports a first light emitting diode and a second light emitting diode. The light emitting diodes are then coupled to the printed circuit board.

Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.

Abstract: A device and method to hold a number of card edge slots in a fixed position inserting pins contained on these card slots simultaneously into a printed circuit board. This device and method prevents tilting of the card edge slots from occurring due to improper installation or the action of a wave solder machine. This device and method uses a number of slot insertion members connected to a grip attachment member to rigidly hold the card edge slots in alignment.

Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending), wherein the component retention socket itself facilitates safe and easy lead bending.

Abstract: A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, vertical orientation, without requiring lead preparation.