Abstract: An optical system includes a substrate and, being formed on the substrate, a reflective structure including a first inner reflection face with a parabolic profile, a second inner planar reflection face and a third inner planar reflection face, a photoelectric transducer including an active region configured to emit light waves or configured to receive light waves and positioned in the reflective structure, at a part of the foci, the material of the reflective structure being chosen to be transparent to the light waves, a waveguide arranged so that its longitudinal axis is parallel to the optical axes and its proximal end is adjoining the reflective structure between the second and third reflection faces and at the active region.

Abstract: A a method for manufacturing an optoelectronic device including at least one LED and at least one photodiode, including the following consecutive steps: a) epitaxially forming an active semiconductor emitting and receiving stack common to the LED and photodiode; b) forming trenches extending vertically through the active stack, and laterally delimiting the LED and photodiode, wherein the trenches are arranged so that the lateral dimensions of the LED are smaller than the lateral dimensions of the photodiode.

Abstract: A method for manufacturing a native emission matrix, comprising the following steps: a) providing a base structure comprising a substrate, a layer of GaN, a layer of doped In(x)GaN and an epitaxial regrowth layer of nid In(x)GaN, b) structuring first and second mesas in the base structure, the first mesa comprising a part of the layer of GaN, the layer of doped In(x)GaN and the epitaxial regrowth layer of not-intentionally doped In(x)GaN, the second mesa comprising a part of the layer of doped In(x)GaN and the epitaxial regrowth layer of not-intentionally doped In(x)GaN, c) electrochemically porosifying the second mesa, d) producing stacks on the mesas to form LED structures emitting at various wavelengths.

Abstract: Optoelectronic device including: a plurality of diodes each including a portion of a stack of first and second semiconductor layers doped according to opposite types, a portion of the first layer of each diode being coupled to a first electrode; trenches running through the stack; a conductive layer arranged against side walls of the trenches, insulated from the stack, coupled to the second electrodes and which is interrupted in such a way that portions of the conductive layer arranged around each of the diodes are insulated from other portions of the conductive layer arranged around the other diodes; conductive portions arranged in the trenches, insulated from the electrically conductive layer and coupled to one another and to a third electrode; bottom walls of the trenches being formed at least by the second electrodes.

Abstract: A ring resonator electro-optical device includes a first silicon nitride waveguide and a second annular silicon waveguide that comprises a first section running under a second section of the first waveguide. The second waveguide also includes an annular silicon strip having a cross-section increasing in the first section from a minimum cross-section located under the second section.

Abstract: An optoelectronic chip includes optical inputs having different passbands, a photonic circuit to be tested, and an optical coupling device configured to couple said inputs to the photonic circuit to be tested.

Abstract: A method for producing a native emission matrix including the following steps of: a) providing a base structure including, successively, a substrate, a GaN layer, a doped In(x)GaN layer where x is from 0 to 8%, and an unintentionally doped In(x)GaN epitaxial regrowth layer; b) patterning mesas in the base structure, the mesas comprising a portion of the doped In(x)GaN layer and the unintentionally doped In(x)GaN epitaxial regrowth layer, whereby the mesas are electrically interconnected with one another; c) porosifying electrochemically the doped In(x)GaN layer; and d) carrying out a first LED structure and a second LED structure on the mesas, whereby a first LED having a first emission wavelength, and a second LED having a second emission wavelength, respectively, are obtained, and a native emission matrix is formed

Abstract: An optoelectronic system includes a photoelectric transducer to emit or receive optical waves and a waveguide to guide waves emitted by the transducer or to guide waves to the transducer, includes a stack successively including a porous first layer of first type doped semiconductor material, a second layer of first type doped semiconductor material doped and lightly doped, a zone including quantum wells, a third layer of semiconductor material doped according to a second doping type opposite to the first type, the photoelectric transducer including a first portion of the porous first layer, a first portion of the second layer, at least a first portion of the zone including the quantum well(s) and at least a first portion of the third layer; the waveguide including a second portion of the second layer adjacent to the first portion and disposed on a second portion of the porous first layer.

Abstract: A method of manufacturing an optoelectronic device including at least one LED and at least one photodiode, including the following steps: a) forming a semiconductor support stack including at least one doped semiconductor layer; b) simultaneously forming, during a common epitaxy step, an active emission semiconductor stack of the LED and an active reception semiconductor stack of the photodiode; c) forming trenches delimiting first and second support pads; and d) porosifying the doped semiconductor layer in the first support pad without porosifying this layer in the second support pad, or porosifying the doped semiconductor layer in the second support pad without porosifying this layer in the first support pad.

Abstract: An optical system includes a substrate and, being formed on the substrate, a reflective structure including a first inner reflection face with a parabolic profile, a second inner planar reflection face and a third inner planar reflection face, a photoelectric transducer including an active region configured to emit light waves or configured to receive light waves and positioned in the reflective structure, at a part of the foci, the material of the reflective structure being chosen to be transparent to the light waves, a waveguide arranged so that its longitudinal axis is parallel to the optical axes and its proximal end is adjoining the reflective structure between the second and third reflection faces and at the active region.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: An optoelectronic chip includes optical inputs having different passbands, a photonic circuit to be tested, and an optical coupling device configured to couple said inputs to the photonic circuit to be tested.

Abstract: An optoelectronic chip includes optical inputs having different passbands, a photonic circuit to be tested, and an optical coupling device configured to couple said inputs to the photonic circuit to be tested.

Abstract: A method for manufacturing a native emission matrix, comprising the following steps: a) providing a base structure comprising a substrate, a layer of GaN, a layer of doped In(x)GaN and an epitaxial regrowth layer of nid In(x)GaN, b) structuring first and second mesas in the base structure, the first mesa comprising a part of the layer of GaN, the layer of doped In(x)GaN and the epitaxial regrowth layer of not-intentionally doped In(x)GaN, the second mesa comprising a part of the layer of doped In(x)GaN and the epitaxial regrowth layer of not-intentionally doped In(x)GaN, c) electrochemically porosifying the second mesa, d) producing stacks on the mesas to form LED structures emitting at various wavelengths.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: A ring resonator electro-optical device includes a first silicon nitride waveguide and a second annular silicon waveguide that comprises a first section running under a second section of the first waveguide. The second waveguide also includes an annular silicon strip having a cross-section increasing in the first section from a minimum cross-section located under the second section.

Abstract: A device, includes: a ring waveguide; a diode comprising a junction extending at least partly in the ring waveguide; and a first circuit configured to supply a signal representative of a leakage current in the diode.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: In one embodiment, a waveguide includes an upstream portion, a downstream portion, and an intermediate portion between the upstream portion and the downstream portion. A first band is disposed on an insulating layer, the first band oriented along a first direction. A first lateral strip and a second lateral strip are disposed on either side of the first band, the first lateral strip and the second lateral strip being thinner or interrupted along the intermediate portion.

Abstract: An intermediate signal is separated into a first sub-signal and a second sub-signal according to a separation coefficient having a known real value. The first sub-signal is delivered to a first photonic circuit containing at least one photonic device to be characterized and a first photonic part. The second sub-signal is delivered to a second photonic circuit containing a second photonic part having a same transfer function as the first photonic part but lacking the at least one photonic device. Optical output signals from the first and second photonic circuits are converted into first and second electrical signals. Losses of the at least one photonic device are determined from processing the electrical signals and from the known real value of the separation coefficient.