Abstract: A connector is provided that includes a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground wafers that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: An electrical connector includes a housing, a plurality of contacts located in each wall of the housing and having grounding contacts and differential-pair contacts, and a grounding bar. The grounding bar includes a pair of lower spring fingers respectively contacting lower regions of the ground contacts in a transverse direction, and a pair of upper spring fingers respectively contacting upper regions of the ground contacts in the transverse direction, an upper transverse bar linked between the pair of upper spring fingers along a longitudinal direction, a lower transverse bar linked between the pair of lower spring fingers along the longitudinal direction, the pair of upper spring fingers extend upwardly from the lower transverse bar and a transverse base having retaining device attached to a lower portion of the housing. The pair of lower spring fingers upwardly extend from the transverse base.

Abstract: An electrical connector includes a housing and a pair of contact wafers. Each contact wafer includes an insulative plate and a plurality of contacts. The contacts include a plurality of grounding contacts and plural differential-pair contacts. Each contact includes a contacting section extending beyond a front edge of the plate, a tail section exposed outside of a bottom edge of the plate and a connecting section linked between the contacting section and the tail section. The plate includes a plurality of first through holes formed along the connecting section of each grounding contact, and a plurality of second through holes formed along the connecting sections of each pair of the differential-pair contacts. The first through holes and the second through hole are essentially offset from each other in both the first direction and the second direction which are perpendicular to each other.

Abstract: A connector is provided that includes a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground wafers that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A twin axial or differential pair cable includes a pair of wires each with an core conductor enclosed in a primary insulator, an insulative inner tape as a secondary insulation spirally wrapping both the pair of wires, a shielding tape longitudinally wrapping the inner tape with an insulative inner layer and a conductive outer layer thereof, a drain wire positioned outside of the shielding tape and at the centerline between the pair of wires, and an insulative outer tape spirally wrapping both the shielding tape and the drain wire. One feature of the invention is to have a seam of the longitudinally wrapping shielding tape located opposite to the drain wire along the centerline in a vertical direction which is perpendicular to the transverse direction defined by two centers of the wires.

Abstract: The QSFP-DD module has an internal printed circuit board defining a mating port at a front edge region, and a connecting port at a rear edge region, and plural sets of wires mechanically and electrically connected to the connecting port with a plurality of ground staples discrete from one another to secure the respective sets of wires to the printed circuit board. The pitch among the ground staples is essentially 3.38 mm, and the wires are connected to two opposite surfaces of the printed circuit board with the associated ground staples. The staples are arranged in rows along the transverse direction.

Abstract: The QSFP-DD module has an internal printed circuit board defining a mating port at a front edge region, and a connecting port at a rear edge region, and plural sets of wires mechanically and electrically connected to the connecting port with a plurality of ground staples discrete from one another to secure the respective sets of wires to the printed circuit board. The pitch among the ground staples is essentially 3.38 mm, and the wires are connected to two opposite surfaces of the printed circuit board with the associated ground staples. The staples are arranged in rows along the transverse direction.

Abstract: A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A connector is provided with a pair of terminals configured to provide a differential signal pair. A ground terminal is positioned on opposing sides of the differential pair. The body of the differential pair is configured so as to bring the differential pair closer together. In an embodiment, the % coupling on the differential pair is increase at least 5% more than a design where the four terminals are positioned at a constant pitch between the tail and the contact.

Abstract: A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A connector is provided with a pair of terminals configured to provide a differential signal pair. A ground terminal is positioned on opposing sides of the differential pair. The body of the differential pair is configured so as to bring the differential pair closer together. In an embodiment, the % coupling on the differential pair is increase at least 5% more than a design where the four terminals are positioned at a constant pitch between the tail and the contact.

Abstract: A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A conductive member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

Abstract: A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A conductive member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

Abstract: A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A commoning member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

Abstract: A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Abstract: A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A commoning member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

Abstract: A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.

Abstract: A system of dampening resonance is provided. In an embodiment, ground traces may be coupled to a common or ground plane via dampening elements such as resistors a predetermined distance from a non-dampened coupling. Ground terminals in a connector have with a separated electrical length that allows for a potential to exist between the ground terminal and a common ground. When the ground terminals are coupled to the ground traces, the dampening element, which may be a resistor, helps convert energy traveling over ground terminal into heat, thus reducing or preventing resonance conditions in the connector.