Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: An integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount.

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are nonfunctional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A heat sink (44-48) is detachably mechanically connected to an electronic component package (10) by means of a pair of mutually spaced and parallel spring rods (16, 18) that are fixed to the electronic component package and span a recess (14) formed in a surface of the package. The heat sink is formed with a projecting latching member (50) having a short shank (52) on the end of which is formed a laterally outwardly extending flange (60). The flange has shoulders (62) that slope outwardly and away from the heat sink body and distal ends on which are formed cam surfaces (66) that slope inwardly away from the heat sink body. The latching member (50) of the heat sink is pressed into the electronic component package recess between the resilient rods (16, 18) to force the rods apart and to pass the outer most ends (64) of the flange this causes the rods to contact the flange shoulders (62) in a slightly outwardly bowed position of the rods.