Patents by Inventor Patrik Moller
Patrik Moller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10724614Abstract: A gear arrangement for transforming a linear force and/or motion into a rotational torque and/or motion and vice versa. The arrangement comprises; a rack (10, 110, 210, 510, 1010, 2010, 3010, 4010) exhibiting a longitudinal axis (A) and at least one toothed side extending parallel to the longitudinal axis of the rack, the rack being reciprocally movable along its longitudinal axis. At least two pinions (20, 120, 220, 520, 1020, 2020, 3020, 4020, 5020) are arranged such that each pinion is rotationally meshing with a toothed side of the rack. Each pinion is fixed to a respective first primary gear (30, 130, 230, 530, 1030, 2030, 3030, 4030, 5030) arranged at a first axial side of the pinion. At least two first primary gears are mechanically connected to a common out- or input shaft (60, 160, 560, 1060), such that the at least two first primary gears transmit torque to or from the first out- or input shaft.Type: GrantFiled: March 17, 2015Date of Patent: July 28, 2020Assignee: Cascade Drives ABInventors: Stig Lundbäck, Stefan Svensson, André Hellestig, Patrik Möller, Stefan Björklund
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Publication number: 20170082179Abstract: A gear arrangement for transforming a linear force and/or motion into a rotational torque and/or motion and vice versa. The arrangement comprises; a rack (10, 110, 210, 510, 1010, 2010, 3010,4010) exhibiting a longitudinal axis (A) and at least one toothed side extending parallel to the longitudinal axis of the rack, the rack being reciprocally movable along its longitudinal axis. At least two pinions (20, 120, 220, 520, 1020, 2020, 3020, 4020, 5020) are arranged such that each pinion is rotationally meshing with a toothed side of the rack. Each pinion is fixed to a respective first primary gear (30, 130, 230, 530, 1030,2030, 3030, 4030, 5030) arranged at a first axial side of the pinion. At least two first primary gears are mechanically connected to a common out- or input shaft (60, 160, 560, 1060), such that the at least two first primary gears transmit torque to or from the first out- or input shaft.Type: ApplicationFiled: March 17, 2015Publication date: March 23, 2017Applicant: Cascade Drives ABInventors: Stig LUNDBÄCK, Stefan SVENSSON, André HELLESTIG, Patrik MÖLLER, Stefan BJÖRKLUND
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Patent number: 9441309Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: GrantFiled: December 20, 2013Date of Patent: September 13, 2016Assignee: Luxembourg Institute of Science and Technology (LIST)Inventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Patent number: 8741113Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.Type: GrantFiled: March 12, 2012Date of Patent: June 3, 2014Assignee: Centre de Recherche Public—Gabriel LippmannInventors: Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
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Publication number: 20140110265Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: December 20, 2013Publication date: April 24, 2014Applicant: CENTRE DE RECHERCHE PUBLIC - GABRIEL LIPPMANNInventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-N ilsson, Cecilia Aronsson, Matteo Dainese
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Patent number: 8617362Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: GrantFiled: March 26, 2012Date of Patent: December 31, 2013Assignee: Centre de Recherche Public—Gabriel LippmannInventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Publication number: 20120305390Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: March 26, 2012Publication date: December 6, 2012Inventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Publication number: 20120279866Abstract: A multilayer structure is formed by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material is arranged between the structures thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.Type: ApplicationFiled: March 30, 2012Publication date: November 8, 2012Inventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-Nilsson
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Publication number: 20120267241Abstract: A master electrode is arranged on substrate and comprises a pattern layer at least partly of an insulating material and a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conductor being electrically connected to at least one electrode current supply; said substrate comprising a surface contacting or adjacent said first surface and having a conductor arranged thereon, said substrate conductor being electrically connected to the at least one current supply; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conductor and said electrode conductor, said cells comprising an electrolyte; wherein an electrode resistance between said electrode conductor and said electrode current supply and a substrate resistance between said substrate conductor and said substrate current supply provide a predetermined current density in each electrochemical cell.Type: ApplicationFiled: April 25, 2012Publication date: October 25, 2012Inventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Publication number: 20120228128Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, chat are formed in closed or open cavities between the master electrode and the substrate.Type: ApplicationFiled: March 12, 2012Publication date: September 13, 2012Inventors: Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
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Publication number: 20110278162Abstract: A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided.Type: ApplicationFiled: November 14, 2008Publication date: November 17, 2011Inventors: Mikael Fredenberg, Patrik Möller
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Publication number: 20110000784Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.Type: ApplicationFiled: May 27, 2010Publication date: January 6, 2011Applicant: Replisaurus Technologies ABInventors: Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
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Patent number: 7790009Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.Type: GrantFiled: December 15, 2003Date of Patent: September 7, 2010Assignee: Replisaurus Technologies ABInventors: Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
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Publication number: 20090229856Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: November 20, 2006Publication date: September 17, 2009Applicant: REPLISAURUS TECHNOLOGIES ABInventors: Mikael Fredenberg, Patrik Moller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Publication number: 20090229854Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: May 21, 2009Publication date: September 17, 2009Inventors: Mikael FREDENBERG, Patrik Moller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese
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Publication number: 20090229857Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: May 21, 2009Publication date: September 17, 2009Inventors: Mikael FREDENBERG, Patrik Moller, Peter Wiwen-Nilsson, Cecillia Aronsson, Matteo Dainese
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Publication number: 20090229855Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.Type: ApplicationFiled: May 21, 2009Publication date: September 17, 2009Inventors: Mikael Fredenberg, Patrik Moller, Peter Wiwen-Nilsson, Cecillia Aronsson, Matteo Dainese
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Publication number: 20090218233Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.Type: ApplicationFiled: November 20, 2006Publication date: September 3, 2009Inventors: Mikael Fredenberg, Patrik Moller, Peter Wiwen-Nilsson
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Publication number: 20090205967Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.Type: ApplicationFiled: March 26, 2009Publication date: August 20, 2009Inventors: Mikael FREDENBERG, Patrik Moller, Peter Wiwen-Nilsson
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Publication number: 20090183992Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.Type: ApplicationFiled: March 26, 2009Publication date: July 23, 2009Inventors: Mikael FREDENBERG, Patrik Moller, Peter Wiwen-Nilsson