Abstract: An adapter for a measurement test instrument electrical probe has a flexible dielectric substrate with electrically conductive runs thereon. One end of the conductive runs has first electrical contacts with a pitch geometry corresponding to the pitch geometry of electrical contacts of an electronic device that is electrically connected to a substrate via the electrical contacts of the device. The other end of the conductive runs has second electrical contacts that have a pitch geometry compatible with the electrical probe of the measurement test instrument.

Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: An adapter for coupling electrical signal to and from an integrated circuit device mounted on a circuit board has a frame composed of individual side sections with each side section having ribs formed therein for providing detented cantilever engagement of the side sections to the sides of the IC device. Electrically conductive elements fit in between the ribs and engage the leads on the IC. The electrically conductive elements are connected to conductive pads formed on a substrate that is secured with the frame. A securing means that includes pins are used for securing the side sections together.

Abstract: A modified BNC connector for connecting an active probe to an active probe to an electronic instrument includes a female BNC input on the instrument for cooperatively mating with the male BNC output of the probe. The female BNC input includes a flex circuit mounted on a planar surface and disposed about the periphery of its outer coaxial shield. A plastic bezel fits over the flex circuit to permit access to contact points located thereon and to mask the remaining area. The male BNC connector is located in a housing which includes a set of spring loaded telescoping pins which make contact with the flex circuit contact points. The housing includes a rotatable knob that locks the male and female portions together.