Abstract: A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.

Abstract: A system is disclosed for automatically loading a scraper including a method for controlling an implement. The method includes receiving a first signal indicative of a speed of a driven component of the at least one traction device. The method also includes receiving a second signal indicative of a speed of the machine with respect to a surface. The method also includes receiving a third signal indicative of a desired slip of the machine with respect to the surface. The method also includes selectively receiving a fourth signal indicative of an operators desire to affect manual control of the implement. The method further includes determining a first parameter as a function of the received first, second, third, and selectively received fourth signals and controlling the implement as a function of the first parameter.

Abstract: A manifold for a two-phase cooling system for efficiently transferring coolant within a multi-phase cooling system. The manifold for a two-phase cooling system generally includes an extruded manifold having a supply chamber and a return chamber in thermal communication with one another to provide for efficient coolant transfer between a thermal server and a spray module.

Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled through evaporation. The resulting liquid and vapor mixture exits the spray modules via return branches. Each individual return branch feeds into a return manifold wherein the manifold is sized sufficiently for the separation of liquid and vapor under the influences of gravity. In addition, a heat exchanger is located within the return manifold and provides for the condensation of vapor. The heat exchanger may also provide liquid subcooling.

Abstract: An atomizer for thermal management system for efficiently thermally managing one or more heat producing devices. The atomizer for thermal management system includes a housing having a coolant passage and a dispensing end, an orifice within the dispensing end, and an actuator manipulating a plunger within the housing. The plunger includes a head that is sealable within a recessed portion of the orifice to open or close the orifice. The coolant passes through the coolant passage into the orifice for spraying upon a heat producing device. The actuator may reciprocate so that the coolant spray emitted through the orifice is pulsating. The pulsing frequency may be increased to increase cooling or decreased to decrease cooling of the heat producing device.

Abstract: A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housing, and an inlet port and an outlet port extending through the housing in fluid communication with the microchannels. Alternatively, the microchannels may also extend into the interior surface of the housing. The cap is preferably thermally attached to a heat producing device by a thermal interface layer. Thermally managed coolant enters the inlet port passing through the microchannels conducting heat transferred to the cap by the heat producing device and exits through the outlet port.

Abstract: The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system.

Abstract: The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system. Valves provide the ability to minimize the amount of interaction between the cooling fluid and air outside the chambers.

Abstract: A two-phase liquid cooling system includes an active venting system for regulating an amount of non-condensable gas within the cooling system. Various venting structures may be used to remove gases from the cooling system, some of which are designed to remove the non-condensable gases and avoid removing the vapor-phase coolant. A control system activates the venting system to achieve a desired pressure, which may be based on measured process conditions within the cooling system. A venting and refilling system may serve multiple cooling systems in a parallel arrangement. A return path of the cooling system can be tested for coolant leaks by increasing the pressure in the return path and placing a coolant detector near the path.

Abstract: A two-phase liquid cooling system includes an active venting system for regulating an amount of non-condensable gas within the cooling system. Various venting structures may be used to remove gases from the cooling system, some of which are designed to remove the non-condensable gases and avoid removing the vapor-phase coolant. A control system activates the venting system to achieve a desired pressure, which may be based on measured process conditions within the cooling system.

Abstract: An inkjet printhead is provided having at least one printhead module and drive electronics removably mounted to a support frame. The printhead module(s) has inkjet integrated circuits, a support member supporting and carrying ink for the inkjet integrated circuits and an electrical connector for connecting drive signals to the inkjet integrated circuits from the drive electronics so as to control ink ejection therefrom. The drive electronics is removable from the support frame independently of the printhead module.

Abstract: A cradle unit for a printhead cartridge, the cradle unit comprising: an interface at which a printhead cartridge is removably engageable with the cradle unit, the interface comprising connections for connecting the printhead cartridge with a power supply which is remote from the interface; and a power regulation circuit incorporated in the interface for regulating supply of power from the power supply to the printhead cartridge.

Abstract: A system for interconnecting a printhead cartridge and a cradle unit for supporting the printhead cartridge, the system comprising: an interface at which the printhead cartridge is removably engageable with the cradle unit, the interface comprising connections for connecting the printhead cartridge with a power supply of the cradle unit; and a power regulation circuit incorporated in the interface for regulating supply of power from the power supply to the printhead cartridge.

Abstract: A system for interconnecting a printhead cartridge and a cradle unit for supporting the printhead cartridge, the system comprising: an interface at which the printhead cartridge is removably engageable with the cradle unit, the interface comprising connections for connecting the printhead cartridge with a power supply of the cradle unit; and a power storage circuit incorporated in the interface for storing at least some of the power being supplied to the printhead cartridge from the power supply.

Abstract: A printing system comprising: a printhead cartridge comprising a printhead; a cradle unit for supporting the printhead cartridge; and an interface at which the cradle unit is removably engageable with the printhead cartridge, the interface comprising connections for connecting the printhead cartridge with a power supply which is remote from the interface and a power storage circuit for storing at least some of the power being supplied to the printhead cartridge from the power supply.

Abstract: A cradle unit for a printhead cartridge, the cradle unit comprising: an interface at which the cradle unit is removably engageable with a printhead cartridge, the interface comprising connections for connecting the printhead cartridge with a power supply which is remote from the interface; and a power storage circuit incorporated in the interface for storing at least some of the power being supplied to the printhead cartridge from the power supply.

Abstract: A printing system comprising: a printhead cartridge comprising a printhead; a cradle unit for supporting the printhead cartridge; and an interface at which the cradle unit is removably engageable with the printhead cartridge, the interface comprising connections for connecting the printhead cartridge with a power supply which is remote from the interface and a power regulation circuit for regulating supply of power from the power supply to the printhead cartridge.

Abstract: A spray cool system with a dry access chamber for providing convenient access to specific spray system components in a dry chamber separate from the wet chamber. The spray cool system with a dry access chamber includes a chassis having a dry chamber and a wet chamber. A dry access door and a wet access door are removably attached about the dry chamber and the wet chamber respectively for providing access to the same. Spray cool components such as a card cage and a spray unit are positioned within the wet chamber. Spray cool components such as but not limited to filters, pumps, heaters, sensors, separators and the like are positioned within the dry chamber for efficient dry access.

Abstract: The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

Abstract: A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.