Abstract: One embodiment of the present invention sets forth a serrated tooth actuator for driving MEMS resonator structures. The actuator includes a fixed drive electrode having a serrated tooth surface opposing a MEMS resonator arm also having a serrated tooth surface, where the MEMS resonator arm is configured to rotate towards the drive electrode when an AC signal is applied to the drive electrode. Such a configuration permits higher amplitude signals to be applied to the drive electrode without the performance of the actuator being compromised by nonlinear effects. In addition, the serrated tooth configuration enables a sufficiently high actuating force to be maintained even though the distance traversed by the MEMS resonator arm during operation is quite small. Further, the serrated configuration allows a MEMS resonator system to withstand larger fluctuations in voltage and larger substrate stresses without experiencing a substantial shift in resonant frequency.

Abstract: One embodiment of the present invention sets forth a serrated tooth actuator for driving MEMS resonator structures. The actuator includes a fixed drive electrode having a serrated tooth surface opposing a MEMS resonator arm also having a serrated tooth surface, where the MEMS resonator arm is configured to rotate towards the drive electrode when an AC signal is applied to the drive electrode. Such a configuration permits higher amplitude signals to be applied to the drive electrode without the performance of the actuator being compromised by nonlinear effects. In addition, the serrated tooth configuration enables a sufficiently high actuating force to be maintained even though the distance traversed by the MEMS resonator arm during operation is quite small. Further, the serrated configuration allows a MEMS resonator system to withstand larger fluctuations in voltage and larger substrate stresses without experiencing a substantial shift in resonant frequency.

Abstract: One embodiment of the present invention sets forth a serrated tooth actuator for driving MEMS resonator structures. The actuator includes a fixed drive electrode having a serrated tooth surface opposing a MEMS resonator arm also having a serrated tooth surface, where the MEMS resonator arm is configured to rotate towards the drive electrode when an AC signal is applied to the drive electrode. Such a configuration permits higher amplitude signals to be applied to the drive electrode without the performance of the actuator being compromised by nonlinear effects. In addition, the serrated tooth configuration enables a sufficiently high actuating force to be maintained even though the distance traversed by the MEMS resonator arm during operation is quite small. Further, the serrated configuration allows a MEMS resonator system to withstand larger fluctuations in voltage and larger substrate stresses without experiencing a substantial shift in resonant frequency.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.

Abstract: There are many inventions described and illustrated herein.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to oscillator systems which employ a plurality of microelectromechanical resonating structures, and methods to control and/or operate same. The oscillator systems are configured to provide and/or generate one or more output signals having a predetermined frequency over temperature, for example, (1) an output signal having a substantially stable frequency over a given/predetermined range of operating temperatures, (2) an output signal having a frequency that is dependent on the operating temperature from which the operating temperature may be determined (for example, an estimated operating temperature based on a empirical data and/or a mathematical relationship), and/or (3) an output signal that is relatively stable over a range of temperatures (for example, a predetermined operating temperature range) and is “shaped” to have a desired turn-over frequency.

Abstract: Systems and methods are provided for distributing graphic assets among users of personal communication devices. The graphic assets may include, for example, an avatar and/or avatar accessories used to exchange messages over cellular telephones. A method includes providing an authorized first user with an authoring version of the graphic asset. The authoring version allows the first user to morph the graphic asset and use the graphic asset to send a message to a second user. If the second user is not licensed to use the graphic asset, the second user can view the graphic asset to receive the message from the first user. However, the second user cannot morph the graphic asset or use the graphic asset to send messages until licensed to do so. The graphic asset may include marketing information such as a link to an owner of the graphic asset for licensing purposes.

Abstract: There are many inventions described and illustrated herein.

Abstract: A method and apparatus for detecting under- or over-filling of lenses in packages where ultraviolet radiation is directed to the package.

Abstract: A method and apparatus for detecting under- or over-filling of lenses in packages where ultraviolet radiation is directed to the package.

Abstract: An optical mirror system with multi-axis rotational control is disclosed. The mirror system includes an optical surface assembly, and at least one leg assembly coupled to the optical surface assembly. The at least one leg assembly supports the optical surface above a substrate. A system and method in accordance with the present invention can operate with many different actuator mechanisms, including but not limited to, electrostatic, thermal, piezoelectric, and magnetic. An optical mirror system in accordance with the present invention accommodates large mirrors and rotation angles. Scanning mirrors can be made with this technique using standard surface-micromachining processes, or a deep RIE etch process. A device in accordance with the present invention meets the requirements for a directly scalable, high port count optical switch, utilizing a two mirror per optical I/O port configuration.

Abstract: A method and apparatus for detecting under- or over-filling of lenses in packages where ultraviolet radiation is directed to the package.

Abstract: The present invention provides an improved fiber optic cross connect (OXC) package which reduces the size of the device. The OXC includes a chip, the chip including a plurality of input micromirrors and a plurality of output micromirrors; and a reflector optically coupled to the plurality of input micromirrors and the plurality of output micromirrors. The OXC package in accordance with the present invention folds the light beam during scanning. In the preferred embodiment, the OXC package comprises input and output micromirrors on a single chip. A reflector is placed above both the input and output micromirrors for folding the light beam as it travels between an input micromirror and an output micromirror. In the preferred embodiment, the distance from the input/output micromirror to the reflector is approximately one-half of the Rayleigh Length of the light beam.

Abstract: An optical mirror system with multi-axis rotational control is disclosed. The mirror system includes an optical surface assembly, and at least one leg assembly coupled to the optical surface assembly. The at least one leg assembly supports the optical surface above a substrate. A system and method in accordance with the present invention can operate with many different actuator mechanisms, including but not limited to, electrostatic, thermal, piezoelectric, and magnetic. An optical mirror system in accordance with the present invention accommodates large mirrors and rotation angles. Scanning mirrors can be made with this technique using standard surface-micromachining processes, or a deep RIE etch process. A device in accordance with the present invention meets the requirements for a directly scalable, high port count optical switch, utilizing a two mirror per optical I/O port configuration.

Abstract: The present invention provides a fiber optic cross connect (OXC) package which utilizes a modular approach to substrate population. The OXC includes a slab, where the slab comprises a first surface and a second surface, and a micromirror array coupled to the second surface of the slab, where the micromirror array comprises a plurality of clusters, where each of the plurality of clusters includes at least one micromirror of the micromirror array. In the preferred embodiment, the slab is a substrate. Chips containing micromirrors are fabricated in clusters so that groups of micromirrors can be separately placed onto the substrate. This provides flexibility in how the substrate is populated. In the preferred embodiment, the clusters are in the form of strips. Only strips with known good micromirrors are placed onto the substrate, thus improving the device yield. Also, if any of the micromirrors become damaged after placement, its chip may be replaced without disturbing the other chips.

Abstract: The present invention provides an improved fiber optic cross connect (OXC) package. The OXC includes a substrate, where light beams may travel through the substrate; a plurality of optical fibers optically coupled to a first surface of the substrate; and a micromirror array coupled to a second surface of the substrate. In the preferred embodiment, this substrate is optically transparent to the wavelengths of interest. The light beams enter the substrate from one surface, traverses the substrate, and exits from an opposite surface of the substrate. The opposite surface is populated with micromirrors. By folding the light beams in a switch architecture with the substrate, the size of the switch package is reduced. Using the substrate in combination with a modular approach to substrate population allows for a single die switch with a higher die yield and scalability. Integrated circuits may be placed on the same substrate as the micromirrors, and the complexity of the assembly process is reduced.

Abstract: An optical mirror system with multi-axis rotational control is disclosed. The mirror system includes an optical surface assembly, and at least one leg assembly coupled to the optical surface assembly. The at least one leg assembly supports the optical surface above a substrate. A system and method in accordance with the present invention can operate with many different actuator mechanisms, including but not limited to, electrostatic, thermal, piezoelectric, and magnetic. An optical mirror system in accordance with the present invention accommodates large mirrors and rotation angles. Scanning mirrors can be made with this technique using standard surface-micromachining processes, or a deep RIE etch process. A device in accordance with the present invention meets the requirements for a directly scalable, high port count optical switch, utilizing a two mirror per optical I/O port configuration.