Abstract: An aeroponic system for supporting efficient low-resource-usage plant growth comprises a housing comprising one or more openings and one or more root chambers; one or more sealing members configured to substantially conform to a stalk of a plant and to substantially isolate a canopy of the plant from the one or more root chambers; one or more root chamber sensors; one or more nutrient storage reservoirs for storage of plant nutrients; one or more air-assisted nozzles configured to introduce atomized nutrient solution into the one or more root chambers; a temperature control system configured to control a temperature of the one or more root chambers; and a control system configured to control the temperature control apparatus and the one or more air-assisted nozzles to maintain environmental parameters associated with the one or more root chambers within desired parameter ranges.

Abstract: An aeroponic system for supporting efficient low-resource-usage plant growth comprises a housing comprising one or more openings and one or more root chambers; one or more sealing members configured to substantially conform to a stalk of a plant and to substantially isolate a canopy of the plant from the one or more root chambers; one or more root chamber sensors; one or more nutrient storage reservoirs for storage of plant nutrients; one or more air-assisted nozzles configured to introduce atomized nutrient solution into the one or more root chambers; a temperature control system configured to control a temperature of the one or more root chambers; and a control system configured to control the temperature control apparatus and the one or more air-assisted nozzles to maintain environmental parameters associated with the one or more root chambers within desired parameter ranges.

Abstract: According to the invention, a plurality of elementary laser beams (fi) are generated, the phases of which are adjusted by an electro-optical feedback loop (6, 7i, 8i, 9) implementing the matrix equation of a phase-contrast filtering device (6).

Abstract: A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.

Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.

Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.

Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.

Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.

Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.

Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.

Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.

Abstract: Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.

Abstract: A balance system for a rotational airfoil assembly includes a bulkhead, an elongated member, a support member and at least one balance weight. The elongated member extends through the bulkhead along a bore toward an airfoil tip segment of the airfoil assembly. The balance weights are mounted to a tip segment of the elongated member positioned within the bore outboard of an airfoil mid-span segment of the airfoil assembly. A reduced quantity of weight is required to balance the airfoil assembly because of the location of the balance weights outside of the mid-span segment of the airfoil assembly.

Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.

Abstract: Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.

Abstract: A composite metal article from two dissimilar metals is prepared. A metal base is comprised of a first metal and having first and second opposing surfaces and a least one longitudinally-positioned depression in each of the first and second opposing surfaces for receiving a wire. An elongated metal element comprised of a second metal is introduced into each of the at least one first and second depressions of the metal base to form a composite assembly, and the composite assembly is heated under pressure to urge the adjacent surfaces of the second metal elements and the depressions together to form a bonded article.

Abstract: A composite metal article from two dissimilar metals is prepared. A metal base is comprised of a first metal and having first and second opposing surfaces and a least one longitudinally-positioned depression in each of the first and second opposing surfaces for receiving a wire. An elongated metal element comprised of a second metal is introduced into each of the at least one first and second depressions of the metal base to form a composite assembly, and the composite assembly is heated under pressure to urge the adjacent surfaces of the second metal elements and the depressions together to form a bonded article.

Abstract: A propeller blade mounted with a preload adjacent a propeller blade root retention that increases the moment capacity of the retention for a given pitch diameter, yet permits pitching of the propeller blade about a blade axis in response to a propeller pitch change actuation system. During assembly, the preload condition is established by preload springs which apply a load on the end of a tapered roller bearing set as a floating race is rotated which allows the tapered roller bearing set to progressively push the propeller blade root outboard and the floating race inboard to generate the preloaded condition.

Abstract: A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35. Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.

Abstract: A composite metal article from two dissimilar metals is prepared. A metal base is comprised of a first metal and having first and second opposing surfaces and a least one longitudinally-positioned depression in each of the first and second opposing surfaces for receiving a wire. An elongated metal element comprised of a second metal is introduced into each of the at least one first and second depressions of the metal base to form a composite assembly, and the composite assembly is heated under pressure to urge the adjacent surfaces of the second metal elements and the depressions together to form a bonded article.