Patents by Inventor Paul Collins

Paul Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250252073
    Abstract: Systems, apparatus, articles of manufacture, and methods to implement a High Bandwidth Memory (HBM) are disclosed. An example method includes identifying, with memory controller circuitry, a first input output (IO) port on the memory controller circuitry that is coupled to programmable circuitry, identifying, with the memory controller circuitry, a second IO port on the memory controller circuitry that is disconnected from the programmable circuitry, identifying a third IO port on the memory controller circuitry that is coupled to the programmable circuitry, and using, with the memory controller circuitry, one or more of the first and third IO ports to communicate with the programmable circuitry.
    Type: Application
    Filed: March 28, 2025
    Publication date: August 7, 2025
    Applicant: INTEL CORPORATION
    Inventors: Andrew Paul Collins, Sujit Sharan
  • Patent number: 12347780
    Abstract: An example microelectronic assembly includes a substrate, a bridge die over the substrate, and a die stack between the substrate and the bridge die, the die stack including a logic die and at least one memory die, where the logic die is between the at least one memory die and the bridge die.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Krishna Vasanth Valavala, Chandra Mohan Jha, Andrew Paul Collins, Omkar G. Karhade
  • Publication number: 20240232122
    Abstract: Embodiments may relate to a microelectronic assembly including a substrate; a first die electrically coupled to the substrate, wherein the first die includes a first edge, a second edge, a third edge opposite the first edge, and a fourth edge opposite the second edge; and a second die electrically coupled to the substrate adjacent to the second edge of the first die and communicatively coupled to the first die, wherein the second die includes a fifth edge and a sixth edge opposite the fifth edge, and wherein the fifth edge of the second die is substantially aligned with the first edge of the first die and the sixth edge of the second die extends beyond the third edge of the first die, where the first die includes a processor die and the second die includes an input/output (I/O) die.
    Type: Application
    Filed: March 22, 2024
    Publication date: July 11, 2024
    Applicant: Intel Corporation
    Inventors: Andrew Paul Collins, Mahesh Krishnappayya Kumashikar, Srikanth Nimmagadda
  • Patent number: 11625692
    Abstract: One or more devices, systems and/or methods for generating waste profiles are provided. For example, a graphical user interface may be controlled to display a waste profile interface. A request to generate a waste profile associated with waste may be received via the waste profile interface. The request may comprise waste parameters of the waste. One or more waste information databases may be analyzed to identify data records associated with the waste parameters. The waste profile may be generated based upon the waste parameters and the data records. An electronic waste transfer request, comprising the waste profile, associated with the waste, may be transmitted over a network connection to a second device associated with a waste facility. An acceptance message indicating that the waste facility accepts the waste or a rejection message indicating that the waste facility rejects the waste may be received from the second device.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: April 11, 2023
    Assignee: ENVIRONMENTAL DATA SYSTEMS, LLC
    Inventors: Daniel Paul Collins, Douglas Yoder, Michael Haritakis, Patrick Sullivan
  • Publication number: 20230081139
    Abstract: An example microelectronic assembly includes a substrate, a bridge die over the substrate, and a die stack between the substrate and the bridge die, the die stack including a logic die and at least one memory die, where the logic die is between the at least one memory die and the bridge die.
    Type: Application
    Filed: September 15, 2021
    Publication date: March 16, 2023
    Applicant: Intel Corporation
    Inventors: Krishna Vasanth Valavala, Chandra Mohan Jha, Andrew Paul Collins, Omkar G. Karhade
  • Patent number: 11387187
    Abstract: Embodiments may relate to an interposer that has a first layer with a plurality of first layer pads that may couple with a die. The interposer may further include a second layer with a power delivery component. The interposer may further include a very high density (VHD) layer, that has a VHD pad coupled by a first via with the power delivery component and coupled by a second via with a first layer pad. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: July 12, 2022
    Assignee: Intel Corporation
    Inventors: Andrew Paul Collins, Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov
  • Publication number: 20220099715
    Abstract: Techniques described enable a modular communication card to alert of its removal from a device. A method described herein includes monitoring, at a modular communication card for sending communications from a utility meter, a power fail signal received from a card of the utility meter. According to the method, the modular communication card monitors a power supply signal that supplies power to components of the modular communication card while the modular communication card is installed on the utility meter. The method includes detecting a change in the power fail signal, indicating a loss of power. The method further includes detecting that the power supply signal is outside an operational voltage range. The method further includes, responsive to the change and the power supply signal being outside, determining that the modular communication card has been removed from the utility meter. Additionally, the method includes transmitting an alert indicating the removal.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventors: Justin Clifford Matthews, Akhil Kumar Gupta, Govind Kharangate, Paul Collins
  • Publication number: 20210287186
    Abstract: One or more devices, systems and/or methods for generating waste profiles are provided. For example, a graphical user interface may be controlled to display a waste profile interface. A request to generate a waste profile associated with waste may be received via the waste profile interface. The request may comprise waste parameters of the waste. One or more waste information databases may be analyzed to identify data records associated with the waste parameters. The waste profile may be generated based upon the waste parameters and the data records. An electronic waste transfer request, comprising the waste profile, associated with the waste, may be transmitted over a network connection to a second device associated with a waste facility. An acceptance message indicating that the waste facility accepts the waste or a rejection message indicating that the waste facility rejects the waste may be received from the second device.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Daniel Paul Collins, Douglas Yoder, Michael Haritakis, Patrick Sullivan
  • Publication number: 20210263880
    Abstract: Embodiments may relate to a die with a processor. The die may include a first input/output (I/O) tile adjacent to a first side of the processor, and a second I/O tile adjacent to a second side of the processor. The first or second I/O tiles may be communicatively coupled with the processor. Other embodiments may be described or claimed.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 26, 2021
    Applicant: Intel Corporation
    Inventors: Andrew Paul Collins, Mahesh Krishnappayya Kumashikar, Srikanth Nimmagadda
  • Patent number: 11068860
    Abstract: One or more devices, systems and/or methods for generating waste profiles are provided. For example, a graphical user interface may be controlled to display a waste profile interface. A request to generate a waste profile associated with waste may be received via the waste profile interface. The request may comprise waste parameters of the waste. One or more waste information databases may be analyzed to identify data records associated with the waste parameters. The waste profile may be generated based upon the waste parameters and the data records. An electronic waste transfer request, comprising the waste profile, associated with the waste, may be transmitted over a network connection to a second device associated with a waste facility. An acceptance message indicating that the waste facility accepts the waste or a rejection message indicating that the waste facility rejects the waste may be received from the second device.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: July 20, 2021
    Assignee: ENVIRONMENTAL DATA SYSTEMS, LLC
    Inventors: Daniel Paul Collins, Douglas Yoder, Michael Haritakis, Patrick Sullivan
  • Patent number: 11019300
    Abstract: Disclosed are various embodiments for providing soundtrack information during the playback of video content. A video content item is rendered upon a display. A command is received from a user. In response to this command, a current time in the playback of the video content item is determined. Further, an item associated with the current time in the playback is identified. The item is featured in corresponding video or audio content of the video content item at the current time when the command is received. An information user interface is rendered upon the display to provide information regarding the identified item.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: May 25, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Michelle Dianne Baxendale, Ike Eshiokwu, Ian Fuller, Sam Ahmed Akil Hassan, Salmen Hichri, Lucy Jane Spence, Alexandre Paul Collin
  • Patent number: 10984394
    Abstract: One or more devices, systems and/or methods for managing waste are provided. For example, a waste profile may be generated, based upon inputs received from a first device via a profile interface of a waste data aggregation platform. An approval notice may be received, via an approval interface of the waste data aggregation platform, from a second device. Shipping information may be entered into a plurality of digital forms of a shipping documentation interface based upon the waste profile and/or one or more inputs received from the first device and/or the second device. A shipping order for shipment of the waste may be generated. One or more notifications corresponding to the shipment of the waste may be transmitted to one or more devices associated with the shipment. The waste profile may be analyzed to generate a risk report, a sustainability report, a landfill report, a raw material source report, etc.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: April 20, 2021
    Assignee: ENVIRONMENTAL DATA SYSTEMS, LLC
    Inventors: Daniel Paul Collins, Douglas Yoder, Raymond Lewis, Michael Haritakis, Patrick Sullivan
  • Patent number: 10771869
    Abstract: A radio and advanced metering system. In an example, a multi-device module includes a host device interface configured to connect to a host device. The host device interface includes a communications interface that can send communications to and receive communications from the host device. The multi-device module includes a radio that can to connect to a wireless network and a microcontroller configurable to perform different functions.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: September 8, 2020
    Assignee: Landis+Gyr Innovations, Inc.
    Inventors: Keith Torpy, Justin Clifford Matthews, Paul Collins, Chris Calvert, Matt Karlgaard
  • Publication number: 20200006236
    Abstract: Embodiments may relate to an interposer that has a first layer with a plurality of first layer pads that may couple with a die. The interposer may further include a second layer with a power delivery component. The interposer may further include a very high density (VHD) layer, that has a VHD pad coupled by a first via with the power delivery component and coupled by a second via with a first layer pad. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 28, 2018
    Publication date: January 2, 2020
    Applicant: Intel Corporation
    Inventors: Andrew Paul Collins, Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov
  • Publication number: 20190373343
    Abstract: A radio and advanced metering system. In an example, a multi-device module includes a host device interface configured to connect to a host device. The host device interface includes a communications interface that can send communications to and receive communications from the host device. The multi-device module includes a radio that can to connect to a wireless network and a microcontroller configurable to perform different functions.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 5, 2019
    Inventors: Keith Torpy, Justin Clifford Matthews, Paul Collins, Chris Calvert, Matt Karlgaard
  • Patent number: 10425704
    Abstract: A radio and advanced metering system. In an example, a multi-device module includes a host device interface configured to connect to a host device. The host device interface includes a communications interface that can send communications to and receive communications from the host device. The multi-device module includes a radio that can to connect to a wireless network and a microcontroller configurable to provide metering functions and smart metering applications.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 24, 2019
    Assignee: Landis+Gyr Innovations, Inc.
    Inventors: Keith Torpy, Justin Clifford Matthews, Paul Collins, Chris Calvert, Matt Karlgaard
  • Patent number: 10370924
    Abstract: A subsea powered override tool is described, for effective and permanent reinstatement of subsea tree valve actuation functionality. The override tool is powered from the Subsea Control Module on the subsea Christmas Tree. The override tool assembly comprise cylinder body (11), piston (8) and cylinder cap (2). A locking collar (1) that is part of the override tool is used to attach the tool to the actuator body on the subsea Tree. The override tool is designed for permanent installation and can lie dormant for extensive periods of time before use.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: August 6, 2019
    Assignee: Neptune Subsea Engineering Limited
    Inventors: Lev Uryevich Roberts-Haritonov, Paul Collins
  • Publication number: 20190124424
    Abstract: A radio and advanced metering system. In an example, a multi-device module includes a host device interface configured to connect to a host device. The host device interface includes a communications interface that can send communications to and receive communications from the host device. The multi-device module includes a radio that can to connect to a wireless network and a microcontroller configurable to provide metering functions and smart metering applications.
    Type: Application
    Filed: July 16, 2018
    Publication date: April 25, 2019
    Inventors: Keith Torpy, Justin Clifford Matthews, Paul Collins, Chris Calvert, Matt Karlgaard
  • Patent number: 10205389
    Abstract: A switching mode power supply (SMPS) configured for clearing an overvoltage condition. The overvoltage is determined by detecting that the output voltage has exceeded the input voltage by a limited amount. The overvoltage is cleared by repetitively turning on and then off the switches controlling the flow of energy to the SMPS in sequence until the excess charge resulting from the overvoltage is couple to circuit ground, and the output is reduced to within acceptable limits.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: February 12, 2019
    Assignee: Dialog Semiconductor (UK) Limited
    Inventors: Mark Childs, Paul Collins
  • Publication number: 20190004629
    Abstract: In an embodiment, a touch-sensitive device includes a controller, a shield sensor, a plurality of first electrodes, and a plurality of second electrodes. The plurality of first electrodes spans a first direction and the plurality of second electrodes spans a second direction that is different than the first direction. The controller electrically couples the plurality of first electrodes to the shield sensor. The shield sensor charges the plurality of first electrodes to cause substantially equal voltages to be present on the plurality of first electrodes and the plurality of second electrodes.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 3, 2019
    Inventors: Samuel Brunet, Richard Paul Collins, Luben Hristov Hristov, Steinar Myren, Trond Jarle Pedersen, Paul Stavely