Abstract: Sold-state intravascular ultrasound (IVUS) imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient circuit architectures and electrical interfaces for an ultrasound transducer array used in a solid-state IVUS system. In one embodiment, an intravascular ultrasound (IVUS) device includes: a flexible elongate member; an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including an ultrasound transducer array; an interface coupler disposed at a proximal portion of the flexible elongate member; and a cable disposed within and extending along a length of the flexible elongate member between the ultrasound scanner assembly and the interface coupler. The cable includes four conductors electrically coupling the ultrasound scanner assembly and the interface coupler.

Abstract: Sold-state intravascular ultrasound (IVUS) imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient circuit architectures and electrical interfaces for an ultrasound transducer array used in a solid-state IVUS system. In one embodiment, an intravascular ultrasound (IVUS) device includes: a flexible elongate member; an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including an ultrasound transducer array; an interface coupler disposed at a proximal portion of the flexible elongate member; and a cable disposed within and extending along a length of the flexible elongate member between the ultrasound scanner assembly and the interface coupler. The cable includes four conductors electrically coupling the ultrasound scanner assembly and the interface coupler.

Abstract: An intravascular ultrasound probe is disclosed, incorporating features for utilizing an advanced transducer technology on a rotating transducer shaft. In particular, the probe accommodates the transmission of the multitude of signals across the boundary between the rotary and stationary components of the probe required to support an advanced transducer technology. These advanced transducer technologies offer the potential for increased bandwidth, improved beam profiles, better signal to noise ratio, reduced manufacturing costs, advanced tissue characterization algorithms, and other desirable features. Furthermore, the inclusion of electronic components on the spinning side of the probe can be highly advantageous in terms of preserving maximum signal to noise ratio and signal fidelity, along with other performance benefits.

Abstract: Embodiments of the present disclosure are related to intravascular devices having improved rapid-exchange configurations and associated systems and methods. In some particular embodiments, the devices of the present disclosure include a reinforced rapid-exchange port, an offset rapid-exchange port, and/or combinations thereof. For example, in some implementations an intravascular imaging device is provided that includes a main catheter body; a rotational imaging element positioned within a lumen of the main catheter body; a distal portion extending from the main catheter body, the distal portion having a rapid-exchange port in communication with a guidewire lumen, the rapid-exchange port and the guidewire lumen sized and shaped to receive a guidewire; and at least one reinforcing element positioned adjacent to the rapid-exchange port.

Abstract: Solid-state ultrasound imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient ultrasound transducer scanner formed from a substantially cylindrical semiconductor substrate. In some embodiments, an intravascular ultrasound (IVUS) device includes: an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including a semiconductor substrate having a plurality of transistors formed thereupon. The semiconductor substrate is curved to have a substantially cylindrical form when the ultrasound scanner assembly is in a rolled form, and the plurality of transistors are arranged in a cylindrical arrangement when the ultrasound scanner assembly is in the rolled form.

Abstract: Embodiments of the present disclosure are related to intravascular devices having improved rapid-exchange configurations and associated systems and methods. In some particular embodiments, the devices of the present disclosure include a reinforced rapid-exchange port, an offset rapid-exchange port, and/or combinations thereof. For example, in some implementations an intravascular imaging device is provided that includes a main catheter body; a rotational imaging element positioned within a lumen of the main catheter body; a distal portion extending from the main catheter body, the distal portion having a rapid-exchange port in communication with a guidewire lumen, the rapid-exchange port and the guidewire lumen sized and shaped to receive a guidewire; and at least one reinforcing element positioned adjacent to the rapid-exchange port.

Abstract: An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.

Abstract: Solid-state ultrasound imaging devices, systems, and methods are provided. Some embodiments of the present disclosure are particularly directed to compact and efficient ultrasound transducer scanner formed from a substantially cylindrical semiconductor substrate. In some embodiments, an intravascular ultrasound (IVUS) device includes: an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member, the ultrasound scanner assembly including a semiconductor substrate having a plurality of transistors formed thereupon. The semiconductor substrate is curved to have a substantially cylindrical form when the ultrasound scanner assembly is in a rolled form, and the plurality of transistors are arranged in a cylindrical arrangement when the ultrasound scanner assembly is in the rolled form.

Abstract: An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.

Abstract: Embodiments of the present disclosure are related to intravascular imaging devices having a low reverberation housing and associated systems and methods. In some particular embodiments, the devices of the present disclosure include a transducer housing having a trough on the backside of the ultrasound transducer to deflect ultrasound signals away from the ultrasound transducer. For example, in some implementations an intravascular imaging device is provided that includes a catheter body; a drive cable extending through a lumen of the catheter body; a housing coupled to a distal section of the drive cable; and an ultrasound transducer mounted within the housing, wherein the housing includes a trough on a backside of the ultrasound transducer, the trough shaped to deflect ultrasound signals away from the ultrasound transducer. Methods of making such devices and systems are also provided.

Abstract: An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing.

Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices are guide wires that include a capacitive pressure-sensing component disposed at a distal portion of the guide wire. Methods of making such intravascular devices, including various manufacturing and assembling techniques, are disclosed. Systems associated with such intravascular devices and methods of using such devices and systems are also disclosed.

Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices are guide-wires that include one or more sensing components and a sensor control module that stores information about the guide-wire. In some instances, the information about the guide-wire stored in the sensor control module is calibration information for a sensing component of the guide-wire. In some embodiments, the intravascular devices are guide-wires that include wireless communication functionality. In some instances, the guide-wires include one or more antennas adjacent a proximal portion of the guide-wire. In some instances, the guide-wires include passive radio frequency devices integrated into the guide-wire. Systems associated with such intravascular devices are disclosed. Methods of using such devices and systems are also disclosed.

Abstract: Embodiments of the present disclosure are related to intravascular imaging devices having a low reverberation housing and associated systems and methods. In some particular embodiments, the devices of the present disclosure include a transducer housing having a trough on the backside of the ultrasound transducer to deflect ultrasound signals away from the ultrasound transducer. For example, in some implementations an intravascular imaging device is provided that includes a catheter body; a drive cable extending through a lumen of the catheter body; a housing coupled to a distal section of the drive cable; and an ultrasound transducer mounted within the housing, wherein the housing includes a trough on a backside of the ultrasound transducer, the trough shaped to deflect ultrasound signals away from the ultrasound transducer. Methods of making such devices and systems are also provided.

Abstract: An intravascular pressure sensor assembly is disclosed herein that is produced in part using photolithography and DRIE solid-state device production processes. Using DRIE production processes facilitates a number of features that could not be readily incorporated in sensor chips fabricated using mechanical saws. In accordance with a first feature, sensor chips are created with non-rectangular outlines. The sensor chip includes a widened portion that substantially abuts an inner wall of a sensor housing, and a cantilevered portion that is relatively narrow in relation to the widened portion. The non-rectangular outline of the sensor chip is formed using photolithography in combination with DRIE processing. In accordance with another feature, the sensor chip is positioned width-wise in the housing, thereby reducing a required length for the housing.

Abstract: The present disclosure related generally to ultrasound imaging, such as intravascular ultrasound imaging. For example, some embodiments of the present disclosure provide an ultrasound imaging system with improved acoustic impedance matching between an ultrasonic transducer and a vessel of interest. For example, in some implementations, an ultrasound imaging device includes a flexible elongate member and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member. The ultrasound scanner assembly includes a plurality of ultrasound transducers arranged circumferentially, and an impedance matching structure is coupled to the plurality of ultrasound transducers. In some such embodiments, the impedance matching structure is disposed radially outward from the plurality of ultrasound transducers, and in some embodiments, the impedance matching structure is disposed radially inward from the plurality of ultrasound transducers.

Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices are guide wires that include a capacitive pressure-sensing component disposed at a distal portion of the guide wire. Methods of making such intravascular devices, including various manufacturing and assembling techniques, are disclosed. Systems associated with such intravascular devices and methods of using such devices and systems are also disclosed.

Abstract: Intravascular devices, systems, and methods are disclosed. In some instances, the intravascular device is a guide wire with electrical conductors printed on a solid core wire. In some instances, the electrical conductors are coupled to conductive bands adjacent a proximal portion of the guide wire. Methods of making, manufacturing, and/or assembling such intravascular devices and associated systems are also provided. In certain aspects, guidewires of the invention include a body having an inner core and an outer layer with one or more embedded conductors. The conductors are exposed at one or more locations along the body and a conductive material can be layered over the exposed locations. A sensor can also be coupled to the body via the conductive material at one of the exposed locations.

Abstract: Intravascular devices, systems, and methods are disclosed. In some instances, the intravascular device is a guide wire with electrical conductors printed on a solid core wire. In some instances, the electrical conductors are coupled to conductive bands adjacent a proximal portion of the guide wire. Methods of making, manufacturing, and/or assembling such intravascular devices and associated systems are also provided. In certain aspects, guidewires of the invention include a body having an inner core and an outer layer with one or more embedded conductors. The conductors are exposed at one or more locations along the body and a conductive material can be layered over the exposed locations. A sensor can also be coupled to the body via the conductive material at one of the exposed locations.

Abstract: The invention generally relates systems and methods to for producing an image from a rotational intravascular ultrasound device. A method can include alternately transmitting complementary Golay codes to a plurality of transducers in a intravascular ultrasound device; receiving echoes of the complementary codes from the transducers; performing pulse compression of the echoes that comprises weighting the received echoes and summing an odd number of weighted echoes, wherein a center echo is given a weighted value of 1.0 and weighted sums of its neighbors constitute complementary echoes of a Golay pair; and producing an image from the compressed echoes. A system can include a processor; and a plurality of beam modules coupled to the processor, each module comprising: a receiver for receiving a trigger signal from the processor; a complex programmable logic device programmed with a Golay code; a high voltage switching transmitter; and an ultrasound transducer.