Abstract: This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300° C. during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.

Abstract: A composition is comprised of the following: a) a hydrolyzed or partially hydrolyzed alkoxysilane; b) a solvent consisting of an organic liquid or mixture of two or more organic liquids in which component (a) and component (c) are soluble and c) a cross linking prepolymer, oligomer, resin or mixtures thereof that forms a low dielectric constant crosslinked polymer. Preferred crosslinked polymers are of a arylcyclobutene or polyphenylene prepolymer, oligomer, resin or mixtures thereof. A coating may be made using the composition wherein the coating is comprised of a crosslinked polymer of a low dielectric crosslinking prepolymer, oligomer, resin or mixture thereof and a hydrolyzed or partially hydrolyzed alkoxysilane, said coating being adhered to a surface of a substrate wherein said surface is comprised of a first material that is a metal, ceramic or polymer and a second material that is (i) a metal, ceramic, or polymer and (ii) different than the first material.

Abstract: A method of hydrolyzing an alkoxysilane which comprises adding sufficient water to hydrolyze at least one alkoxy group, optionally, in the presence of acidic or basic catalysts.

Abstract: An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two or more aromatic acetylene groups wherein at least some of the polyfunctional compounds contain three or more reactive groups. Such oligomers and uncured polymers may be cured to form cured polymers which are useful as dielectrics in the microelectronics industry, especially for dielectrics in integrated circuits.

Abstract: A coating composition comprising:a hydrolyzed or partially hydrolyzed alkoxysilane,a solvent,and an arylcyclobutene;is useful in a variety of applications, including coatings for multichip modules, flat panel displays and integrated circuits. The preferred alkoxysilanes correspond to the formula: ##STR1## wherein R is C.sub.1 -C.sub.6 alkylidene, C.sub.1 -C.sub.6 alkylene, arylene, or a direct bond; Y is C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl, aryl, 3-methacryloxy, 3-acryloxy, 3-aminoethylamino, or 3-amino; R' is independently in each occurrence C.sub.1 -C.sub.6 alkyl; and Z is C.sub.1 -C.sub.6 alkyl, C.sub.2 -C.sub.6 alkenyl or OR'.

Abstract: The present invention refers to an electrical interconnection device having conductive metal layers separated by a dielectric cyclobutarene polymer layer. The adhesion of the conductive metal layer to the dielectric cyclobutarene polymer layer is promoted by a carbide-forming metal interface layer. Further disclosed is a method of making such electrical interconnection device by ion sputtering the dielectric cyclobutarene polymer surface, vapor depositing a carbide-forming metal interface layer onto the sputtered polymer surface, and then vapor depositing the superior conductive metal layer onto the carbide-forming metal interface layer.