Abstract: Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.

Abstract: A connector for interconnecting electronic components within a device, such as an optical transceiver module, is disclosed. In one embodiment the connector utilizes compressive engagement to electrically connect an optical subassembly to a printed circuit board within the optical transceiver. In one embodiment, the electrical connector includes a body that mechanically mounts on the printed circuit board. The body defines a plurality of slots, each having a first portion of a conductive finger positioned therein. The first portion of each finger is arcuately shaped and extends from the slot. The connector is positioned such that each finger compressively engages and electrically connects with a corresponding contact pad on the optical subassembly when the optical transceiver is assembled. A second portion of each finger extends from a face of the connector body and electrically connects with corresponding contact pads on the printed circuit board, electrically connecting it with the optical subassembly.

Abstract: A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predetermined distance from a reference point. The optical component is positioned at the predetermined distance by a spacer tool, wherein the spacer tool is interposed between the optical component and a spacer tool mount during optical component positioning. The spacer tool is of a length that corresponds with the predetermined distance between the optical component and the reference point.

Abstract: Optical components are aligned within an optoelectronic device using a composite adhesive material. An optical subassembly of the optoelectronic device includes a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance. The spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: This invention describes an optical component incorporated in an optical device or subassembly for reducing reflections at the terminal end of an optical fiber. An optical device has a housing having an opening for receiving and securing a terminal end of an optical fiber. An optical component having a first facet and a second facet is positioned so that the first facet abuts the terminal end when the optical fiber is received in the opening. The optical component has a thickness that is chosen to be large enough that reflections from the second surface are sufficiently diverged to prevent substantial coupling back into the core of the optical fiber.

Abstract: The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

Abstract: An optoelectronic device that employs a composite adhesive to properly position optical components within the device is disclosed. In one embodiment, an optical subassembly is disclosed, comprising a package housing, an optical component, and a composite adhesive that at least indirectly maintains the optical component in a predetermined position on a mounting surface within the package housing. The composite adhesive includes an adhesive substance, and a plurality of spacing elements intermixed in the adhesive substance, wherein the spacing elements at least indirectly space the optical component from a designated surface of the package housing such that the component is positioned in the predetermined position.

Abstract: This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.

Abstract: The present invention provides a host board system in which transceivers of two sizes (the larger approximately twice the width of the smaller) can be arbitrarily mixed within a given host board design. This is accomplished by specifying an arrangement of electrical connectors, a guide rail design, a set of transceiver features, and a bezel configuration to meet this need as well as the other requirements of optoelectronic transceivers. Typically, two slots and connectors are lined up behind an opening in a bezel that provides transceiver access to two connectors. So that either double-width or single-width transceivers can be used in the same opening, the double-width transceiver is designed to engage with the connectors in the same position as a single-width transceiver. Further, the slots and connectors are spaced evenly so that all of the slots and connectors can accommodate a single-width transceiver and all adjacent slots and connectors can accommodate a double-width transceiver.

Abstract: An optoelectronic assembly includes an optoelectronic device, housed in a transistor outline (TO) package having a base and a signal lead traversing an aperture in the base, and a circuit interconnect coupled to the optoelectronic device and TO package. The circuit interconnect substantially comprises an insulator, and includes a data signal trace, a resistor, and a conductor. The data signal trace, on a first side of the insulator, transmits data signal current between the optoelectronic device and an external device. The resistor, also on the first side, transmits the data signal current between the optoelectronic device and the data signal trace. The resistor is electrically and mechanically connected to the signal lead and to data signal trace. The conductor, on a second side of the insulator, transmits a ground current between the TO package and the external device, and forms a current path substantially parallel to the data signal trace.

Abstract: An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module.

Abstract: A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined orientation with respect to the base. The device side of the base cooperates with a cap to define a hermetic chamber wherein one or more optoelectronic components, such as optical transmitters and optical receivers, are disposed. The platform includes an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform further includes at least one conductive pathway extending substantially through the platform so as to facilitate electrical communication between components disposed on the device side of the base, and circuits, devices and systems disposed on the connector side of the base.

Abstract: An optoelectronic assembly includes a transistor outline (TO) package that houses an optoelectronic device. The TO package and the optoelectronic device are coupled to a circuit interconnect. The circuit interconnect includes an insulator having a first side for transmitting a signal current between the optoelectronic device and a device external to the TO package, and a second side for transmitting a ground current between the TO package and the external device. For a predefined operating frequency range, the impedance of the circuit interconnect approximately matches the impedance of the signal leads of the TO package and also approximately matches the impedance of the device external to the TO package. The optoelectronic device may include a laser diode or a photo diode. In addition, the present invention is an optoelectronic transceiver including a transmitter optoelectronic assembly and a receiver optoelectronic assembly.

Abstract: An optical transceiver module for use in optical communications networks is disclosed. The transceiver features a simplified optical subassembly structure that facilitates the alignment and calibration of active optical components located thereon. The transceiver includes a shell that contains a transceiver printed circuit board and a transmitter/receiver optical subassembly (“TROSA”) connected to the printed circuit board via a TROSA connector. The TROSA includes a singular substrate on which a laser for producing optical signals and a photodetector for receiving optical signals are disposed. The laser and photodetector are precisely positioned on the TROSA substrate to have a specified spacing therebetween. So positioned, the laser and photodetector can be aligned with conduits of a sleeve assembly in a single alignment operation, thereby simplifying calibration of the transceiver module.

Abstract: The packaging system comprises a mechanical support, an insulating substrate and an electronic circuit. The mechanical support has a first support element that extends at a non-zero angle from a second support element. The insulating substrate has a first portion and a second portion in contact with the first support element and the second support element, respectively. The first portion is contoured to define at least one access hole. The optical communications device and the electronic circuit are mechanically coupled to the first support element. Either or both the optical communications device and the electronic circuit is mechanically coupled to the first support element through a respective one of the at least one access hole. The packaging device additionally comprises a conductive track extending between the electronic circuit and the optical communications device on the first portion of the insulating substrate.

Abstract: A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined orientation with respect to the base. The device side of the base cooperates with a cap to define a hermetic chamber wherein one or more optoelectronic components, such as optical transmitters and optical receivers, are disposed. The platform includes an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform further includes at least one conductive pathway extending substantially through the platform so as to facilitate electrical communication between components disposed on the device side of the base, and circuits, devices and systems disposed on the connector side of the base.

Abstract: This invention describes an optical component incorporated in an optical device or subassembly for reducing reflections at the terminal end of an optical fiber. An optical device has a housing having an opening for receiving and securing a terminal end of an optical fiber. An optical component having a first facet and a second facet is positioned so that the first facet abuts the terminal end when the optical fiber is received in the opening. The optical component has a thickness that is chosen to be large enough that reflections from the second surface are sufficiently diverged to prevent substantial coupling back into the core of the optical fiber.

Abstract: A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.

Abstract: An optical assembly includes a first lens positioned along a first axis and configured to focus light from a light source along the first axis, and a second lens positioned along the first axis and configured to focus light from the first lens onto an optical target. A third lens is positioned along a second axis and configured to approximately collimate light from a second light source along the second axis, and a reflector positioned along the second axis is configured to reflect light from the third lens onto a fourth lens. The fourth lens is positioned on a third axis angled from the second axis and configured to focus light from the reflector onto an optical detector. Furthermore, the optical assembly is preferably a single molded optic. The optical assembly may be used in an optoelectronic transceiver having an optical subassembly, including a light source and an optical detector. The optical assembly is used to couple a pair of closely spaced optical fibers to the light source and optical detector.